JPS62147341U - - Google Patents

Info

Publication number
JPS62147341U
JPS62147341U JP3599586U JP3599586U JPS62147341U JP S62147341 U JPS62147341 U JP S62147341U JP 3599586 U JP3599586 U JP 3599586U JP 3599586 U JP3599586 U JP 3599586U JP S62147341 U JPS62147341 U JP S62147341U
Authority
JP
Japan
Prior art keywords
clamp
hole
window
clamp member
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3599586U
Other languages
English (en)
Other versions
JPH0325403Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3599586U priority Critical patent/JPH0325403Y2/ja
Publication of JPS62147341U publication Critical patent/JPS62147341U/ja
Application granted granted Critical
Publication of JPH0325403Y2 publication Critical patent/JPH0325403Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means

Landscapes

  • Jigs For Machine Tools (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の一実施例を示す平面図、第
２図は第１図の一部断面正面図、第３図は非クラ
ンプ時の作用説明図で、イは正面図、ロは側面図
、第４図はクランプ時の作用説明図で、イは正面
図、ロは側面図、第５図は従来のワーククランプ
装置を示す平面図、第６図は第５図の正面図であ
る。 １……ワークたるリードフレーム、２……ヒー
トブロツク、３……ボンデイングツール、４……
ダイ、５……案内部、６……装置本体、７……ス
ライダ、８……ボールガイド、９……クランプ板
本体、１０……止ねじ、１１……透し穴、１２…
…クランプ面、１３……突出部、１４……引張り
スプリング、１５……スプリングハンガ、１６…
…スプリングハンガ、１１……アイランド部、１
８……外部リード、２０……窓、２１……ストツ
パ部、２２……クランプ部材、２３……フランジ
部、２４……突出部、２５……透し穴、２６……
クランプ面、２７……ボール、２８……ボール、
２９……板ばね、３０……板ばね、３１……止ね
じ、３２……止ねじ、３２ａ……ねじ穴。

Claims (1)

    【実用新案登録請求の範囲】
  1. 上下動するスライダ７に固定したクランプ板本
    体９に窓２０及びストツパ部２１を設ける一方、
    該ストツパ部２１に当接可能なフランジ部２３と
    、そのフランジ部の内側にあつて前記窓２０を貫
    いて下方に延びかつ先端にクランプ面２６を有す
    る突出部２４とを備えたクランプ部材２２を設け
    、該クランプ部材２２の中央部には透し穴２５を
    設け、該透し穴２５の両側の各上面に押圧される
    ２枚の板ばね２９，３０を前記クランプ本体に取
    付けると共に該２枚の板ばね２９，３０とクラン
    プ部材２２とを点接触させたことを特徴とするワ
    ーククランプ装置。
JP3599586U 1986-03-12 1986-03-12 Expired JPH0325403Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3599586U JPH0325403Y2 (ja) 1986-03-12 1986-03-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3599586U JPH0325403Y2 (ja) 1986-03-12 1986-03-12

Publications (2)

Publication Number Publication Date
JPS62147341U true JPS62147341U (ja) 1987-09-17
JPH0325403Y2 JPH0325403Y2 (ja) 1991-06-03

Family

ID=30845994

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3599586U Expired JPH0325403Y2 (ja) 1986-03-12 1986-03-12

Country Status (1)

Country Link
JP (1) JPH0325403Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011054992A (ja) * 2010-11-12 2011-03-17 Seiko Instruments Inc ワイヤボンダ装置およびその使用方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5742175U (ja) * 1980-08-14 1982-03-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5742175U (ja) * 1980-08-14 1982-03-08

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011054992A (ja) * 2010-11-12 2011-03-17 Seiko Instruments Inc ワイヤボンダ装置およびその使用方法

Also Published As

Publication number Publication date
JPH0325403Y2 (ja) 1991-06-03

Similar Documents

Publication Publication Date Title
JPS6071627U (ja) 釦取付機の部品方向設定装置
JPS62147341U (ja)
JPS5942806U (ja) バイト刃先位置調整装置
JPS5920930U (ja) プレス型
JPS6153030U (ja)
JPH0429333U (ja)
JPS6166954U (ja)
JPH03107131U (ja)
JPH0160831U (ja)
JPS6149678U (ja)
JPS6182748U (ja)
JPS6146138U (ja) バイス用ストツパ
JPS62121033U (ja)
JPS6374207U (ja)
JPS61102438U (ja)
JPS61182621U (ja)
JPS6150605U (ja)
JPH01173723U (ja)
JPH03387U (ja)
JPS6052929U (ja) 釦加工装置の部品把持装置
JPS5917108U (ja) フエ−シングヘツドにおける面取り加工装置
JPS6182733U (ja)
JPH02119427U (ja)
JPS59185020U (ja) プレスの移動ダイクツシヨン装置
JPS6132485U (ja) 開閉体の歪防止装置