JPS62147341U - - Google Patents

Info

Publication number
JPS62147341U
JPS62147341U JP3599586U JP3599586U JPS62147341U JP S62147341 U JPS62147341 U JP S62147341U JP 3599586 U JP3599586 U JP 3599586U JP 3599586 U JP3599586 U JP 3599586U JP S62147341 U JPS62147341 U JP S62147341U
Authority
JP
Japan
Prior art keywords
clamp
hole
window
clamp member
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3599586U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0325403Y2 (US06252093-20010626-C00008.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3599586U priority Critical patent/JPH0325403Y2/ja
Publication of JPS62147341U publication Critical patent/JPS62147341U/ja
Application granted granted Critical
Publication of JPH0325403Y2 publication Critical patent/JPH0325403Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means

Landscapes

  • Jigs For Machine Tools (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP3599586U 1986-03-12 1986-03-12 Expired JPH0325403Y2 (US06252093-20010626-C00008.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3599586U JPH0325403Y2 (US06252093-20010626-C00008.png) 1986-03-12 1986-03-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3599586U JPH0325403Y2 (US06252093-20010626-C00008.png) 1986-03-12 1986-03-12

Publications (2)

Publication Number Publication Date
JPS62147341U true JPS62147341U (US06252093-20010626-C00008.png) 1987-09-17
JPH0325403Y2 JPH0325403Y2 (US06252093-20010626-C00008.png) 1991-06-03

Family

ID=30845994

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3599586U Expired JPH0325403Y2 (US06252093-20010626-C00008.png) 1986-03-12 1986-03-12

Country Status (1)

Country Link
JP (1) JPH0325403Y2 (US06252093-20010626-C00008.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011054992A (ja) * 2010-11-12 2011-03-17 Seiko Instruments Inc ワイヤボンダ装置およびその使用方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5742175U (US06252093-20010626-C00008.png) * 1980-08-14 1982-03-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5742175U (US06252093-20010626-C00008.png) * 1980-08-14 1982-03-08

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011054992A (ja) * 2010-11-12 2011-03-17 Seiko Instruments Inc ワイヤボンダ装置およびその使用方法

Also Published As

Publication number Publication date
JPH0325403Y2 (US06252093-20010626-C00008.png) 1991-06-03

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