JPS62147274U - - Google Patents
Info
- Publication number
- JPS62147274U JPS62147274U JP3571986U JP3571986U JPS62147274U JP S62147274 U JPS62147274 U JP S62147274U JP 3571986 U JP3571986 U JP 3571986U JP 3571986 U JP3571986 U JP 3571986U JP S62147274 U JPS62147274 U JP S62147274U
- Authority
- JP
- Japan
- Prior art keywords
- terminal block
- terminal
- adhesive tape
- adhered
- stacked
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002390 adhesive tape Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3571986U JPS62147274U (uk) | 1986-03-12 | 1986-03-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3571986U JPS62147274U (uk) | 1986-03-12 | 1986-03-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62147274U true JPS62147274U (uk) | 1987-09-17 |
Family
ID=30845456
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3571986U Pending JPS62147274U (uk) | 1986-03-12 | 1986-03-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62147274U (uk) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57124420A (en) * | 1981-01-26 | 1982-08-03 | Tdk Electronics Co Ltd | Chip part series and method of dividing substrate |
-
1986
- 1986-03-12 JP JP3571986U patent/JPS62147274U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57124420A (en) * | 1981-01-26 | 1982-08-03 | Tdk Electronics Co Ltd | Chip part series and method of dividing substrate |
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