JPS62145374U - - Google Patents

Info

Publication number
JPS62145374U
JPS62145374U JP3250486U JP3250486U JPS62145374U JP S62145374 U JPS62145374 U JP S62145374U JP 3250486 U JP3250486 U JP 3250486U JP 3250486 U JP3250486 U JP 3250486U JP S62145374 U JPS62145374 U JP S62145374U
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
land
flexible printed
wiring pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3250486U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3250486U priority Critical patent/JPS62145374U/ja
Publication of JPS62145374U publication Critical patent/JPS62145374U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP3250486U 1986-03-06 1986-03-06 Pending JPS62145374U (US20030220297A1-20031127-C00074.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3250486U JPS62145374U (US20030220297A1-20031127-C00074.png) 1986-03-06 1986-03-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3250486U JPS62145374U (US20030220297A1-20031127-C00074.png) 1986-03-06 1986-03-06

Publications (1)

Publication Number Publication Date
JPS62145374U true JPS62145374U (US20030220297A1-20031127-C00074.png) 1987-09-12

Family

ID=30839240

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3250486U Pending JPS62145374U (US20030220297A1-20031127-C00074.png) 1986-03-06 1986-03-06

Country Status (1)

Country Link
JP (1) JPS62145374U (US20030220297A1-20031127-C00074.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106465538A (zh) * 2014-06-03 2017-02-22 大陆泰密克微电子有限责任公司 用于制造箔结构的方法及对应的箔结构
CN112105137A (zh) * 2019-06-17 2020-12-18 矢崎总业株式会社 电路体、板与电路体的连接结构和汇流条模块

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106465538A (zh) * 2014-06-03 2017-02-22 大陆泰密克微电子有限责任公司 用于制造箔结构的方法及对应的箔结构
JP2017525140A (ja) * 2014-06-03 2017-08-31 コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミット ベシュレンクテル ハフツングConti Temic microelectronic GmbH フィルム集合体の製造方法および相応するフィルム集合体
US10548229B2 (en) 2014-06-03 2020-01-28 Conti Temic Microelectronic Gmbh Method for producing a foil arrangement and corresponding foil arrangement
CN112105137A (zh) * 2019-06-17 2020-12-18 矢崎总业株式会社 电路体、板与电路体的连接结构和汇流条模块
JP2020205176A (ja) * 2019-06-17 2020-12-24 矢崎総業株式会社 回路体、基板と回路体との接続構造、及び、バスバモジュール

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