JPS62144321A - Liquid-phase epitaxy apparatus - Google Patents

Liquid-phase epitaxy apparatus

Info

Publication number
JPS62144321A
JPS62144321A JP28436285A JP28436285A JPS62144321A JP S62144321 A JPS62144321 A JP S62144321A JP 28436285 A JP28436285 A JP 28436285A JP 28436285 A JP28436285 A JP 28436285A JP S62144321 A JPS62144321 A JP S62144321A
Authority
JP
Japan
Prior art keywords
solution
melt
temperature
injected
boat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP28436285A
Other languages
Japanese (ja)
Inventor
Ichiro Kume
久米 一郎
Misao Hironaka
美佐夫 廣中
Yoichiro Oota
太田 洋一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP28436285A priority Critical patent/JPS62144321A/en
Publication of JPS62144321A publication Critical patent/JPS62144321A/en
Pending legal-status Critical Current

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  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Semiconductor Lasers (AREA)

Abstract

PURPOSE:To reduce dispersion in composition of an epitaxial layer, in manufacturing a semiconductor element having a double heterostructure, by providing a slanted bottom part of a holder, which is located directly beneath an injecting port, so that used solution does not remain. CONSTITUTION:A boat is placed in the reacting of a liquid epitaxy apparatus. Temperature is increased to 700-800 deg.C in a hydrogen atmosphere. Then the temperature is kept for a specified time period. Thereafter, the boat is slowly cooled at a constant temperature decreasing speed. When the temperature is decreased to a growth starting temperature, a solution well 71 and the like are moved to the direction of an arrow (m) by one cell. At this time, a piston 42 on the solution 62 is pushed down with a tunnel 5. The solution 62 is injected to a gap formed with a substrate wafer 2 from an injecting port 9. The injected solution 62 is moved leftward in the Figure between the substrate wafer 2 and the container wall. Then the solution falls through a hole 93 at the left end and flows into a waste liquid well 8. Since a bottom part 92 of a lower holder beneath the injecting port 9 is slanted, the used solution does not remain.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、m−v族化合物半導体を用いたダブルへテ
ロ構造を有する半導体素子の製造装置に関するものであ
る。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for manufacturing a semiconductor element having a double heterostructure using an m-v group compound semiconductor.

〔従来の技術〕[Conventional technology]

第6図および第4図はA7GaAs系半導体レーザーの
製造を行う際、基板ウェハにダブルへテロ構造のエピタ
キシャル層を形成するために用いられる従来のスライド
式ボートの断面図である。図において、(υはスライダ
ーの中央部を示し、(2)は基板ウェハ、(3)は基板
ウェハ(2)を保持するためのホルダー、(4υ、(ハ
)・・・はピストン、(5)はピストンαυ等を押し下
げるためのトンネル、(6B 、 (63)・・・は成
長用融液、aυ、σ2・・・は融液溜め、(8)は廃液
溜めである。
FIGS. 6 and 4 are cross-sectional views of a conventional sliding boat used to form a double heterostructure epitaxial layer on a substrate wafer when manufacturing an A7GaAs semiconductor laser. In the figure, (υ indicates the center part of the slider, (2) is the substrate wafer, (3) is a holder for holding the substrate wafer (2), (4υ, (c)... is the piston, (5 ) is a tunnel for pushing down the piston αυ, etc., (6B, (63)... are melt for growth, aυ, σ2... are melt reservoirs, and (8) is a waste fluid reservoir.

次にエピタキシャル成長の方法について説明する。まず
、ボートを水素雰囲気中で高温中に一定時間保持した後
一定の降温速度で冷却し、成長開始温度まで下がったと
ころで融液溜めQυ、 (72)・・・を図の矢印(へ
)方向に1N分だけ移動させて、第4図の配置忙する。
Next, the epitaxial growth method will be explained. First, the boat is kept at a high temperature in a hydrogen atmosphere for a certain period of time, and then cooled down at a certain rate of temperature drop. When the temperature drops to the growth starting temperature, the melt reservoir Qυ, (72)... is moved in the direction of the arrow in the figure. Move it by 1N to complete the arrangement shown in Figure 4.

このとき、融液器上のピストン(4りがトンネル(5)
によって押し下げられ、その結果、融液鞄は2枚の基板
ウェハ(2)の間隙に注入される。
At this time, the piston (4 rims are tunnel (5)) on the melter.
As a result, the melt bag is injected into the gap between the two substrate wafers (2).

注入された融液(6カはその一部が基板(2)の間に残
り、その他は廃液溜め(8)に捨てられることになる。
A part of the injected melt (6) remains between the substrates (2), and the rest is discarded into the waste liquid reservoir (8).

このようにして融液關が注入されたときからエピタキシ
ャル成長が始まり、所定の時間だけ成長を行った後さら
にもう1槽分だけ融液溜め(力を図の矢印(ロ)方向に
移動させる。すると新しい融液(6りが注入され、もと
の融液のはすべて押し流されて新しい融液的に入れ代わ
る。以上のようにして、多層の薄膜結晶を1回の成長で
連続的に成長する。
Epitaxial growth begins when the melt tank is injected in this way, and after growth is performed for a predetermined time, the melt tank is moved by one more tank (the force is moved in the direction of the arrow (b) in the figure). A new melt is injected, and all of the original melt is washed away and replaced by the new melt. In this way, multilayer thin film crystals are continuously grown in one growth.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上記のような従来のボートでは、融液線等が注入される
注入口(9)の下にあたるホルダー(3)の底部(9υ
が直角になっているため、新しい融液−で古い融液(6
2を押し流したとき、注入口(9)の下にあたるホルダ
ー(3)の底部(91)の隅に古い融液翰が残ってしま
い、融液が完全に入れ換わらない。したがってエピタキ
シャル層の組成がバラツク要因の1つになっていた。
In the conventional boat as described above, the bottom (9υ
is at a right angle, so the new melt is at right angles to the old melt (6
When the melt 2 is washed away, the old melt pen remains at the corner of the bottom (91) of the holder (3) below the injection port (9), and the melt is not completely replaced. Therefore, the composition of the epitaxial layer has been one of the causes of variation.

この発明は、上記のような問題点を解消するためになさ
れたもので、古い融液が残らないようにボードの構造を
改良し、エピタキシャル1煙の組成のバラツキを少なく
することを目的とする。
This invention was made to solve the above-mentioned problems, and aims to improve the structure of the board so that no old melt remains, and to reduce variations in the composition of epitaxial 1 smoke. .

〔問題点を解決するための手段〕[Means for solving problems]

この発明は、上記の目的を達成するため一注入口の真下
にあたるホルダーの底部を斜めにしだ液相エピタキシャ
ル成長装置を提供するものである。
In order to achieve the above object, the present invention provides a liquid phase epitaxial growth apparatus in which the bottom of the holder, which is directly below one injection port, is inclined.

〔作用〕[Effect]

この発明の一実施例によれば、新しい融液と古い融液と
の混在がなくなるので、エピタキシセル層の組成のバラ
ツキが少ない。
According to one embodiment of the present invention, there is no mixing of new melt and old melt, so there is little variation in the composition of the epitaxy cell layer.

〔発明の実施例〕[Embodiments of the invention]

以下、この発明の一実施例を図について説明する。第1
図および第2図において、(1)〜(8)は第3図およ
び第4因に示した従来装置のそれとほぼ同じであるが、
改良点としては、融液が注入されるホルダー(3)の底
部器を斜めにし、これにより、古い融液がホルダーの隅
に残ることな(、新しい融液で完全に押し流されるよう
にした点にある。
An embodiment of the present invention will be described below with reference to the drawings. 1st
In the figure and FIG. 2, (1) to (8) are almost the same as those of the conventional device shown in FIG. 3 and the fourth factor,
An improvement is that the bottom part of the holder (3) into which the melt is injected is tilted, so that the old melt does not remain in the corner of the holder (and is completely washed away by the new melt). It is in.

次にこの発明によるボートを用いてエピタキシャル成長
を行う場合、まずボートを液相エピタキシャル成長装置
の反応管の中に入れ、水素雰囲気中で700〜800℃
まで温度を上げた後、一定時間保持する。その後、一定
の降温速度でボートをゆっくり冷却し、成長開始温度ま
で下がったところで、第1図の融液溜めσυ等を矢印(
ホ)方向に1槽分だけ移動させる〔第2図参照〕。この
とき、融液[F]a上のピストン(6)がトンネル(5
)によって押し下げられ、融液(62が注入口(9)よ
り基板ウェハ(2)の間隙に注入される。注入された融
液(621は基板ウェハ(2)の間を図の左方向に移動
した後、左端の穴(93より落下して廃液溜め(8)に
流れ込む。このとき、琺液暁の一部は基板ウェハ(2)
の間隙に残り、エピタキシャル成長が行われる。そして
所定の時間エピタキシャル成長を行った後、融液溜めσ
υ等をさらにもう1槽分だけ第1図の矢印6n1方向に
移動させろことによって、次の新しい融液(63)が注
入口(9)より注入され、基板ウェハ(2)の間の融液
を完全に押し流す。注入口(9)の下のホルダーの底部
(92が斜めになっているので、従来のように古い融液
の一部が残ることはない。
Next, when epitaxial growth is performed using the boat according to the present invention, the boat is first placed in a reaction tube of a liquid phase epitaxial growth apparatus and heated to 700 to 800°C in a hydrogen atmosphere.
After raising the temperature to a certain point, hold it for a certain period of time. After that, the boat is slowly cooled down at a constant temperature drop rate, and when the temperature has dropped to the temperature at which growth starts, the melt reservoir συ etc. in Figure 1 are marked with the arrows (
e) by one tank [see Figure 2]. At this time, the piston (6) on the melt [F]a moves into the tunnel (5
), and the melt (62) is injected from the injection port (9) into the gap between the substrate wafers (2).The injected melt (621) moves between the substrate wafers (2) to the left in the figure. After that, it falls from the leftmost hole (93) and flows into the waste liquid reservoir (8).
It remains in the gap and epitaxial growth takes place. After epitaxial growth for a predetermined time, the melt reservoir σ
By moving υ, etc. by one more tank in the direction of arrow 6n1 in Fig. 1, the next new melt (63) is injected from the injection port (9), and the melt between the substrate wafers (2) is completely washed away. Since the bottom (92) of the holder below the inlet (9) is slanted, no part of the old melt remains as in the conventional case.

以上のように、融液を順次入れ換えることによって、多
層のエピタキシャル層を成長する。
As described above, multilayer epitaxial layers are grown by sequentially replacing the melt.

なお、上記の実施例では、ALGaAs系半導体レーザ
ーの液相エピタキシャル成長に使用しているボートにつ
いて説明したが、このような構造を用いれば、他の液相
エピタキシャル成長装置でも、上記と同様な効果が得ら
れろ。
In the above example, the boat used for liquid phase epitaxial growth of an ALGaAs semiconductor laser was explained, but if such a structure is used, the same effect as above can be obtained with other liquid phase epitaxial growth equipment. Let it go.

〔発明の効果〕〔Effect of the invention〕

以上のようにこの発明によれば、注入口の下にあたるホ
ルダーの底部を斜めてしたので、従来のように古い融液
が新しい融液に混ざり込むということがなくなり、成長
したエピタキシャル層の組成のバラツキを押えることが
できる。
As described above, according to the present invention, the bottom of the holder below the injection port is tilted, so that the old melt does not mix with the new melt as in the conventional case, and the composition of the grown epitaxial layer changes. Variations can be suppressed.

【図面の簡単な説明】[Brief explanation of drawings]

第1図および第2図はこの発明の一実施例による液相エ
ピタキシャル成長装置を示す断面図、第3図および第4
図は従来のエピタキシャル成長装置を示す断面図である
。 図中、(1)はスライダーの中央部、(2)は基板ウェ
ハ、 (3)はホルダー、αη、(6)、・・・はピス
トン、(5)はトンネル、(62)、+6騰、・・・は
融液、(71)、σ2.・・・は融液溜め、(8)は廃
液溜め、(9)は融液の注入口である。 なお、各南中同一符号は同一または相当部分を示す。 代理人 弁理士 佐 藤 正 年 第1図 第2図 第3図 1 62  ど   9 38
1 and 2 are cross-sectional views showing a liquid phase epitaxial growth apparatus according to an embodiment of the present invention, and FIGS.
The figure is a cross-sectional view showing a conventional epitaxial growth apparatus. In the figure, (1) is the center of the slider, (2) is the substrate wafer, (3) is the holder, αη, (6), ... are the pistons, (5) is the tunnel, (62), +6 rise, ... is melt, (71), σ2. ... is a melt reservoir, (8) is a waste fluid reservoir, and (9) is a melt injection port. Note that the same reference numerals in each Nanchu indicate the same or equivalent parts. Agent Patent Attorney Masaru Sato Figure 1 Figure 2 Figure 3 1 62 Do 9 38

Claims (1)

【特許請求の範囲】[Claims] 一定の間隔をおいて対向させた2枚の基板ウェハの間に
エピタキシャル成長用融液を注入することによつてエピ
タキシャル成長を行うプッシュアウト式の成長法におい
て、注入口の真下にあたるホルダーの底部を斜めにした
ことを特徴とする液相エピタキシャル成長装置。
In the push-out growth method, which performs epitaxial growth by injecting an epitaxial growth melt between two substrate wafers facing each other at a fixed interval, the bottom of the holder, which is directly below the injection port, is tilted diagonally. A liquid phase epitaxial growth apparatus characterized by:
JP28436285A 1985-12-19 1985-12-19 Liquid-phase epitaxy apparatus Pending JPS62144321A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28436285A JPS62144321A (en) 1985-12-19 1985-12-19 Liquid-phase epitaxy apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28436285A JPS62144321A (en) 1985-12-19 1985-12-19 Liquid-phase epitaxy apparatus

Publications (1)

Publication Number Publication Date
JPS62144321A true JPS62144321A (en) 1987-06-27

Family

ID=17677605

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28436285A Pending JPS62144321A (en) 1985-12-19 1985-12-19 Liquid-phase epitaxy apparatus

Country Status (1)

Country Link
JP (1) JPS62144321A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03112931U (en) * 1990-03-06 1991-11-19

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03112931U (en) * 1990-03-06 1991-11-19

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