JPS6214401U - - Google Patents
Info
- Publication number
- JPS6214401U JPS6214401U JP10427185U JP10427185U JPS6214401U JP S6214401 U JPS6214401 U JP S6214401U JP 10427185 U JP10427185 U JP 10427185U JP 10427185 U JP10427185 U JP 10427185U JP S6214401 U JPS6214401 U JP S6214401U
- Authority
- JP
- Japan
- Prior art keywords
- input
- substrate
- bonding agent
- optical
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims description 5
- 239000013307 optical fiber Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000007767 bonding agent Substances 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Mechanical Coupling Of Light Guides (AREA)
Description
第１図は本考案による一実施例の斜視図である
。
図において、１０……シリコン基板、２０，２
１……集束性光伝送体、３１〜３４……入出力用
光フアイバ、４１〜４５……Ｖ溝、５０……誘電
体多層膜、６１〜６５……溝、である。
FIG. 1 is a perspective view of an embodiment of the present invention. In the figure, 10...silicon substrate, 20,2
DESCRIPTION OF SYMBOLS 1... Focusing optical transmission body, 31-34... Optical fiber for input/output, 41-45... V-groove, 50... Dielectric multilayer film, 61-65... Groove.
Claims (1)
学的に結合するように基板上に配置された光回路
において、前記基板上に前記入出力光フアイバと
前記光学素子とをそれぞれ配置する前記基板上の
配置溝と、これら配置溝にそれぞれ金属接合剤を
流し込む接合剤用溝とを設けたことを特徴とする
光回路。 In an optical circuit in which an input/output optical fiber and an optical element are arranged on a substrate so as to be optically coupled to each other, the input/output optical fiber and the optical element are arranged on the substrate, respectively. An optical circuit characterized in that an arrangement groove and a bonding agent groove into which a metal bonding agent is poured into each of these arrangement grooves are provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10427185U JPS6214401U (en) | 1985-07-08 | 1985-07-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10427185U JPS6214401U (en) | 1985-07-08 | 1985-07-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6214401U true JPS6214401U (en) | 1987-01-28 |
Family
ID=30977611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10427185U Pending JPS6214401U (en) | 1985-07-08 | 1985-07-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6214401U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0323205U (en) * | 1989-07-17 | 1991-03-11 | ||
| JP2004341535A (en) * | 2003-05-15 | 2004-12-02 | Samsung Electronics Co Ltd | Optical module |
-
1985
- 1985-07-08 JP JP10427185U patent/JPS6214401U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0323205U (en) * | 1989-07-17 | 1991-03-11 | ||
| JP2004341535A (en) * | 2003-05-15 | 2004-12-02 | Samsung Electronics Co Ltd | Optical module |
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