JPS62142068A - Soldering device for conductor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to the field of electrical fabrication, and in particular to soldering conductors of components attached to tape supplied from a tape roll. It is related to the device.

[Background of the invention]

For those who use electrical components commercially, it is advantageous to be able to purchase high-volume components in large quantities for later use as needed.

To facilitate bulk purchases, component suppliers often package components by sandwiching them between long lengths of tape wrapped around a reel. The parts packed in this way can be easily stored by the purchaser, and the parts can also be easily taken out.

In industrial applications, it is advantageous to physically position components on a circuit board by inserting the component's conductors into through holes in conductive patterns on the circuit board and connect them to those patterns by flow soldering. . This means that component conductors must have good solderability when in use, regardless of how long the component will be in storage. However, different suppliers use different finishes for component conductors. . For example, gold plating, silver plating, and tin plating are known. These platings may vary in thickness, porosity, and degree of surface contamination. It has been found that after flow soldering, considerable "tweak" work is often required to complete connections that were not made satisfactorily. This correction work is an expensive manual process. The storage period between purchase and use also has an unpredictable effect on the solderability of component conductors.

One way to solve this problem is to remove the components from the storage reel and solder all the components by hand before mounting them on the circuit board, but this is also a very expensive and time-consuming process. Deroru.

[Summary of the invention]

The present invention provides an apparatus that automatically solders the leads of an electrical component that is stored on a tape immediately after receiving it from a supplier without removing the component from the tape. . It has been found that this avoids the tendency for the leads to become unsoldable over time, and allows for automatic, quick and inexpensive soldering independent of the surface treatment of the supplied electrical component leads. . The device of the present invention has two parts: one has an "axial lead" extending from both ends of the part to both sides of the tape, and the other has a "radial lead" extending from the part in one direction i/i: one tape. equally effective against By implementing the invention, a component will be provided which will always have a constant solderability during use, no matter how the component was initially provided.

〔Example〕

Hereinafter, the present invention will be described in detail with reference to the drawings.

Reference is first made to FIG. 1, which shows some electrical components still packaged on tape for tape storage. The components 11 shown in FIG. 1 are diodes with axial leads 12, 13 extending in opposite directions from each end of the diodes. Since the first adhesive support tape 14 extends at right angles to the free ends of the leads 12 and the second support tape 15 extends at right angles to the free ends of the leads 13, this assembly of electrical components and tapes The parts ``
"ribbon" 16. When these components are later used in a circuit, it is desirable to solder the soldered portion 1-J of each lead. Liquid solder should not be attached to the lead part molecule bJ, as the heat during soldering may cause the parts to deteriorate.Also, to avoid heat deterioration of the tape 14 and 15, the lead part "C" should not be attached. ”
Do not allow liquid solder to come into contact with the product.

FIG. 2 shows how ribbon 16 is drawn from a supply reel 20 and wound around a take-up reel 21 along a path through several processing stations within the apparatus of the invention. Except as noted below, the leads of the component are held generally horizontal while the component is moved along its path. To keep the lead horizontal, tape 14.15
This can be done using rails spaced and oriented appropriately to guide the To feed the ribbon into and out of the device, the tape is extended over the parts at each end of the ribbon.

The path 30 for moving the component includes a front dirt removal section 31, a flux attachment section 32, a first twisting section 33, a first flow soldering section 34, a reverse twisting section 35, and a second flow soldering section 34. A soldering part 36, a cooling and twist removal part 37,
These are referred to as a post-cleaning section 38 and a drying section 39.

The front dirt removal section 31 has a nozzle that sprays a cleaning solution onto the reed. The flux application section 32 has a foam head that applies liquid flux to the lead, particularly to the part 1a of the lead. At twist portion 33, the tape is twisted by an angle of approximately 20 degrees so that lead 12 extends downwardly from component 11. This direction is the first flow soldering part 34.
maintained through. The first flow soldering section 34 will be explained later. In the second twisted portion 35,
The twist is reversed so that the lead 13 is tilted downward from the component 11. After passing through the second flowing solder sag 36, the ribbon 16 is returned to its normal horizontal orientation through a cooling and detwisting section 37. This cooling and twist relief section can optionally include a fan. The post-cleaning section 38 has a nozzle that sprays water onto the soldered leads. The parts and tape are then dried in a drying section 39 by suitable means. When drying is completed, the parts are sent out from the device and wound onto a take-up reel 21, and stored until they are opened for use. With the exception of the first and second flow soldering sections 34, 36, the other processing sections are generally of known construction.

Please refer to Figure 3 for a moment. A satisfactory embodiment of the processing units 33-37 is shown in this figure. Those processing units 33
.about.37 are located inside the chamber or tray 40. The chamber 40 has thermally insulating walls within which the solder 38' is maintained in a molten state by a suitable heat source (not shown). A first liquid metal pump 41 continuously transports liquid solder from the chamber 40 to the first flow soldering section 34 , and a second liquid metal pump 42 also pumps liquid solder from the chamber 40 to the second flow soldering section 34 . section 36 is constantly supplied.

The ribbon 16 is fed along tracks 43, 44 from left to right through the first flowing solder run 34. The tracks 43 , 44 end directly after the first flowing solder patch 34 . The ribbon 16 is then fed through the second flowing solder patch 36 along tracks 45,46. Tracks 45 , 46 begin just before the second flowing solder patch 36 . Tracks 43,44 twist ribbon 16 approximately 20 degrees from its normal horizontal orientation to a first orientation. Track 44 and tape 15 are 9 knitted compared to track 43 and tape 14. On the other hand, since tracks 45 are higher than tracks 46, within those tracks the tape 14 is lower than the tape 15, and the ribbon 16 is twisted in a direction opposite to the previous direction and offset from the horizontal by about 20 degrees. A reverse thread 9 section 35 is configured between the tracks 43.44 and 45.46. Tape 14 first moves in track 43 and then in track 45. Since tape 15 first moves in track 44 and then in track 46, ribbon 16 is twisted 40 degrees. With this configuration, the portion “a” of the lead 12 is soldered in the first flow soldering portion 34, and then the portion “I” of the lead 130 is soldered.
L'' is soldered at the second flow soldering section 36.

Since the flow soldering sections 34, 36 are similar, only one flow soldering section will be described in detail. Flow solder runout 34 refers to a vertical riser or chimney 50. The molten solder is raised through this chimney by a suitable pump.

The pump used for this is of a commercially available type. At the top of the chimney, one side 51 is lower than the other side 52 and has rounded edges as indicated by reference numeral 53. Solder 38' over its edge 53.
flows. Component ribbon 16 moves over the top of chimney 50 from end 55 to end 56 in the direction of arrow 57.

A wave shaper 60 is provided within the chimney 50 to change the shape of the solder waves exiting the chimney 50. The waveform near end 55 is shown at 61 in FIG. 5, and the waveform near end 56 is shown at 62. Tape 14.15 indicates that when each component first enters the flow solder section, most of the lead length of that component is immersed in the wave of solder, but the ribbon advances. As the lead 12 is immersed in the solder, the length of the lead 12 becomes shorter.
The excess solder adhering to 2 flows towards the lower end, forming what can loosely be called an icicle 65. However, the icicles are not in a solid state but in a liquid state.

If the icicle were allowed to solidify, it would seriously interfere with subsequent assembly of the component onto a circuit board or the like, so means are provided to remove excess solder before it solidifies. Immediately adjacent the end 56 of the chimney 50 is a calo-heated 'block 70. This heated block 70 has a port T1 near where the parts pass as they exit the chimney. Vacuum piping 72 is connected to boat 71
is connected to the collection container 73. The collection vessel is maintained at subatmospheric pressure by means of a suitable pump connection γ4.

As each lead 12 passes through boat γ1, excess liquid solder "icicles" are removed by air into collection container 73.

In order to flow the liquid solder almost satisfactorily, the edge 51 is deformed by providing a slight bend 75, and the block 70 is provided with a recess γ6, so that the slight flow of the liquid solder is directed in the direction in which the ribbon 16 moves. Allowing yourself to flow has been found to be helpful.

[Brief explanation of drawings]

Fig. 1 is a partial plan view showing how parts having axial leads are packed with tape, Fig. 2 is a block diagram of the lead wire soldering device of the present invention, and Fig. 3 is a diagram of the device of the present invention. 4 is an enlarged plan view of a portion of FIG. 3; FIG. 5 is a partial cross-sectional view taken along line 5--5 of FIG. 4 showing properly positioned parts; 6 is a partial cross-sectional view taken along line 6-6 of FIG. 4 showing the parts in proper position; FIG. 7 is a cross-sectional view similar to FIG. 5 taken along line 7-7 of FIG. 3; Figure 8 is a plan view showing part of the packaging for parts having radial leads. 31...Front dirt removal part, 32...Flux adhesion part, 33...Twisted part, 34.36...Flow soldering part, 35...Reverse twist part, 37... ...
Cooling and twist removal section, 38... Post-cleaning section, 39
...Drying section, 40...Chamber, 42...
Liquid metal pump, 43.44, 45.46...Truck, 50...Chimney-160...Wave shaper,
70...Karo-heated block, 73...Collection container. Patent Applicant Honeywell Incorporated Sub-Agent Masaki Yamakawa (f/2) Statement 7) +T:l': (P': No change in content)! f
:! G. Procedural amendment (method) 1. Display of 1 case filed in 1985 Patent Application No. 278064 2 Name of the invention Conductor soldering device 3 Relationship with the person making the amendment JI Patent Applicant name (name) Honeywell I/Corborated, ~ ' 5,1lli iE Q '7 Date February 25, 1986

Claims (5)

[Claims] (1) A flow soldering part that has a convex shape transverse to a certain axis and raises waves of liquid solder whose cross-sectional area decreases with distance in a first direction along the axis; and means for feeding an electrical component having at least one straight conductor extending along said axis and through said wave. (2) a flow soldering portion that has a convex shape transverse to a certain axis and raises waves of liquid solder whose cross-sectional area decreases with distance in a first direction along the axis; means for feeding a series of electrical components, each having a cut-and-extending conductor, in a first orientation along said axis, first through said wave and then out of said wave; remaining on said conductor; means disposed across the wave for removing excess solder from the conductor, the electrical component being oriented such that the conductor is angled downwardly from the electrical component. Fried equipment. (3) a flow soldering section that creates waves of liquid solder having a convex shape transverse to a certain axis; and an electrical component having at least one straight conductor extending transverse to the axis; a heater for keeping excess solder remaining on the conductor in a liquid phase; and suction means for sucking the excess solder from the conductor; and further means placed beyond the wave for removing excess solder remaining on the conductor from the conductor. (4) In an apparatus for soldering a predetermined portion of a conductor extending laterally from a set of electrical components held by a tape means that interconnects both ends of the conductors of the electrical components at right angles, the tape means and the component are connected together. means for moving generally horizontally along a path, said path comprising: a supply reel; a pre-staining section having nozzle means for depositing a cleaning solution on said conductor; and a pre-staining section for depositing a liquid flux on said portion of said conductor. a fluxing section having bubble head means for the purpose of: means for orienting said tape means such that the conductor slopes downwardly from a first end of said component; and removing excess solder from a lower end of said conductor. a flow forming a wave of liquid solder having a convex shape across the path such that the selected portion of the conductor passes into and out of the wave of liquid solder; A conductor of an electrical component, comprising: a soldering section; a cooling section; a post-cleaning section having nozzle means for applying a cleaning solution to the portion of the conductor; a drying section; and a take-up reel. A device that solders specified parts. (5) In an apparatus for soldering a predetermined portion of a conductor extending in an opposite direction from a series of electrical components held by a tape means that interconnects both ends of the conductors of the electrical components at right angles, the tape means and the component generally horizontally moving the conductor along a path, said path comprising: a supply reel; a pre-staining section having nozzle means for depositing a cleaning solution on said conductor; and a pre-staining section for depositing a liquid flux on said portion of said conductor. a fluxing section having foam head means for causing the first conductor to slope downwardly from the first end of the component; forming a convex shape across the path such that the selected portion of the first conductor passes into and out of the wave of liquid solder, removing excess solder from the portion of the conductor; forming a wave of the liquid solder with a first
means for redirecting said tape means so that a second conductor slopes downwardly from a second end of said component; and removing excess solder from a lower end of said second conductor. of the liquid solder having a convex shape across the path such that the selected portion of the second conductor passes through and exits the wave of liquid solder. a second flow soldering section for forming waves; a cooling section; a post-cleaning section having nozzle means for applying a cleaning solution to the portion of the conductor; a drying section; and a take-up reel. A device for soldering specified parts of the conductors of electrical parts.