JPS62138457U - - Google Patents

Info

Publication number
JPS62138457U
JPS62138457U JP1986025841U JP2584186U JPS62138457U JP S62138457 U JPS62138457 U JP S62138457U JP 1986025841 U JP1986025841 U JP 1986025841U JP 2584186 U JP2584186 U JP 2584186U JP S62138457 U JPS62138457 U JP S62138457U
Authority
JP
Japan
Prior art keywords
island
lead
pellet
flame
stretched
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986025841U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986025841U priority Critical patent/JPS62138457U/ja
Publication of JPS62138457U publication Critical patent/JPS62138457U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1986025841U 1986-02-24 1986-02-24 Pending JPS62138457U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986025841U JPS62138457U (zh) 1986-02-24 1986-02-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986025841U JPS62138457U (zh) 1986-02-24 1986-02-24

Publications (1)

Publication Number Publication Date
JPS62138457U true JPS62138457U (zh) 1987-09-01

Family

ID=30826364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986025841U Pending JPS62138457U (zh) 1986-02-24 1986-02-24

Country Status (1)

Country Link
JP (1) JPS62138457U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003078167A1 (fr) * 2002-03-18 2003-09-25 Seiko Epson Corporation Tete et dispositif de projection de liquide

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003078167A1 (fr) * 2002-03-18 2003-09-25 Seiko Epson Corporation Tete et dispositif de projection de liquide
EP1493568A1 (en) * 2002-03-18 2005-01-05 Seiko Epson Corporation Liquid jet head and liquid jet device
EP1493568A4 (en) * 2002-03-18 2005-08-17 Seiko Epson Corp LIQUID HEAD HEAD AND LIQUID BEAM DEVICE
US7407270B2 (en) 2002-03-18 2008-08-05 Seiko Epson Corporation Liquid jet head and liquid jet apparatus

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