JPS62136709A - Manufacture of conductive pattern - Google Patents

Manufacture of conductive pattern

Info

Publication number
JPS62136709A
JPS62136709A JP27505585A JP27505585A JPS62136709A JP S62136709 A JPS62136709 A JP S62136709A JP 27505585 A JP27505585 A JP 27505585A JP 27505585 A JP27505585 A JP 27505585A JP S62136709 A JPS62136709 A JP S62136709A
Authority
JP
Japan
Prior art keywords
pattern
oxidizing agent
membered heterocyclic
conductive pattern
heterocyclic compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP27505585A
Other languages
Japanese (ja)
Other versions
JPH0351248B2 (en
Inventor
隆一 杉本
正 浅沼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Toatsu Chemicals Inc
Original Assignee
Mitsui Toatsu Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Toatsu Chemicals Inc filed Critical Mitsui Toatsu Chemicals Inc
Priority to JP27505585A priority Critical patent/JPS62136709A/en
Publication of JPS62136709A publication Critical patent/JPS62136709A/en
Publication of JPH0351248B2 publication Critical patent/JPH0351248B2/ja
Granted legal-status Critical Current

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  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Electric Cables (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は基材の表面に導電化されたパターンを形成する
方法に関する。さらに詳しくは基材表面にパターン状に
複素5員環式化合物重合体を生成させて、導電性パター
ンを形成する方法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of forming a conductive pattern on the surface of a substrate. More specifically, the present invention relates to a method of forming a conductive pattern by forming a five-membered heterocyclic compound polymer in a pattern on the surface of a substrate.

〔従来の技術〕[Conventional technology]

複素5員環式化合物の重合体は比較的安定な導電性高分
子であって、電池材料、センサー材料、オプトエレクト
ロニクス材料、エレクトロニクスデバイスなどの種々の
機能素子などに利用できる有機導電性材料として最近注
目されている。これらの機能素子に利用する場合、これ
らの複素5員環式化合物重合体がデバイスパターン状に
形成されれば、非常に応用範囲が広くなる。このような
方法として電気化学的な方法で、絶縁高分子フィルム中
にポリピロールをパターン状に形成する方法が提案され
ている。(flikita et al、、Japan
 J。
Polymers of five-membered heterocyclic compounds are relatively stable conductive polymers, and have recently been developed as organic conductive materials that can be used for various functional devices such as battery materials, sensor materials, optoelectronic materials, and electronic devices. Attention has been paid. When used in these functional devices, if these five-membered heterocyclic compound polymers are formed into a device pattern, the range of applications will be extremely wide. As such a method, a method has been proposed in which polypyrrole is formed in a pattern in an insulating polymer film using an electrochemical method. (flikita et al, Japan
J.

Appl、 Phys、 Lett、 24 L79 
(1985) ] 、しかしながら、この方法では、特
殊な電極を必要とし、可溶性の高分子膜上にしか形成で
きず、しかも膜厚が数ミクロンのものしか得られない。
Appl, Phys, Lett, 24 L79
(1985)], however, this method requires a special electrode, can only be formed on a soluble polymer film, and can only obtain a film thickness of several microns.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

本発明の目的は、叙上の観点にたって、簡便に基材の上
に導電性パターンを形成する方法を提供することにある
In view of the above, an object of the present invention is to provide a method for easily forming a conductive pattern on a base material.

〔問題点を解決するだめの手段〕[Failure to solve the problem]

本発明者らは上記問題点を解決するため鋭息検討し、本
発明を完成した。
In order to solve the above problems, the present inventors conducted intensive studies and completed the present invention.

すなわち本発明は 表面にパターン状にみぞが加工形成された基材を用い、
そのみぞ中に液状または溶剤に溶解した酸化剤を流延し
た後、複素5員環式化合物と接触させて基材表面にパタ
ーン状に複素5員環式化合物重合体を生成させることを
特徴とする導電性パターンの形成方法である。
That is, the present invention uses a base material whose surface has grooves formed in a pattern,
The method is characterized by casting an oxidizing agent in liquid form or dissolved in a solvent into the grooves, and then contacting the oxidizing agent with the five-membered heterocyclic compound to form a polymer of the five-membered heterocyclic compound in a pattern on the surface of the substrate. This is a method for forming a conductive pattern.

本発明の方法において使用される基材の材質としては特
に制限はなく、半導体から絶縁体まで、はとんどの材料
が使用でき、またその形状としては薄膜、厚膜をはじめ
任意の形状の成形体を用いることができる。
There are no particular restrictions on the material of the base material used in the method of the present invention, and almost any material can be used, from semiconductors to insulators, and it can be formed into any shape, including thin films and thick films. You can use your body.

本発明の方法においてはこれらの基材の表面にあらかじ
めパターン状にみぞを加工形成しておくことが必要であ
るが、みぞを形成する方法は、通常の加工技術を用いて
行なえば良(、その方法については特に制限はない。
In the method of the present invention, it is necessary to process and form grooves in a pattern on the surface of these base materials in advance, but the grooves can be formed using ordinary processing techniques ( There are no particular restrictions on the method.

本発明の方法において酸化剤としては無機酸、金属の化
合物、あるいは無機や有機の酸化物、過酸化物などが用
いられる。具体的には例えば塩酸、硫酸、硝酸、クロル
スルホン酸などの無機酸類、チタン、ジルコニウム、ク
ロム、モリブデン、タングステン、マンガン、鉄、ルテ
ニウム、パラジウム、白金、を同、アルミニウム、スズ
などの金属のハロゲン化物、あるいはそれらの金属の無
機酸塩類が挙げられ、殊にこれらの金属の化合物でもル
イス酸として知られている化合物が好適な酸化剤として
挙げられ、さらにはそれらの金属のアセチルアセトナー
トなどの配位化合物も挙げられる。
In the method of the present invention, an inorganic acid, a metal compound, an inorganic or organic oxide, a peroxide, etc. are used as the oxidizing agent. Specifically, for example, inorganic acids such as hydrochloric acid, sulfuric acid, nitric acid, and chlorosulfonic acid, titanium, zirconium, chromium, molybdenum, tungsten, manganese, iron, ruthenium, palladium, platinum, and metal halogens such as aluminum and tin. Suitable oxidizing agents include compounds of these metals, or inorganic acid salts of these metals, and in particular compounds of these metals known as Lewis acids, as well as acetylacetonates of these metals. Coordination compounds may also be mentioned.

さらにはまたベルオキソニ硫酸や過炭酸などの過酸の塩
類や、ベンゾキノンや有機過酸化物も挙げられる。これ
らの酸化剤は単独でも、また2種以上の混合としても用
いることができる。
Further examples include salts of peracids such as beroxonisulfuric acid and percarbonic acid, benzoquinone and organic peroxides. These oxidizing agents can be used alone or in combination of two or more.

また本発明の方法において酸化剤は液状で使用すること
が必要であって、液体の酸化剤を使用するか、あるいは
酸化剤を溶剤に溶解して使用する。
Further, in the method of the present invention, it is necessary to use the oxidizing agent in a liquid state, and the oxidizing agent is used either in liquid form or dissolved in a solvent.

使用する溶剤としては酸化剤を熔解するものであれば特
に制限はなく、例えばアルコール類、ハロゲン化炭化水
素類、芳香族炭化水素類、ニトロ化炭化水素類、エーテ
ル類、ニトリル類、水などが挙げられる。またこの時に
溶剤中に種々のポリマーやオリゴマーをバインダーとし
て加えておくこともできる。
The solvent to be used is not particularly limited as long as it dissolves the oxidizing agent, and examples include alcohols, halogenated hydrocarbons, aromatic hydrocarbons, nitrated hydrocarbons, ethers, nitriles, and water. Can be mentioned. Further, at this time, various polymers and oligomers can be added to the solvent as binders.

本発明の方法で使用される複素5員環式化合物とは4(
IMの炭素原子と1 ([lilのへテロ原子を有する
不飽和5員環を基本骨格とする化合物であって、たとえ
ばビロール、チオフェン、フラン、セレノフェン、テル
ロフェンおよびそれらの誘導体である。これらの化合物
は単独でも、また2種以上を用いることもできる。
The 5-membered heterocyclic compound used in the method of the present invention is 4(
Compounds whose basic skeleton is an unsaturated 5-membered ring having a carbon atom of IM and a heteroatom of 1 can be used alone or in combination of two or more.

本発明における重合方法はまずパターン状に形成された
みぞに液状または溶剤に溶解した酸化剤を流延する。流
延方法には特別な制限はなく、一般の方法が用いられる
。例えば基材の表面に液状の酸化剤を全面に流延したの
ち、余分の酸化剤をぬぐいさるなどの方法が用いられる
In the polymerization method of the present invention, first, an oxidizing agent in liquid form or dissolved in a solvent is cast into grooves formed in a pattern. There are no special restrictions on the casting method, and a general method can be used. For example, a method is used in which a liquid oxidizing agent is spread over the entire surface of the base material, and then the excess oxidizing agent is wiped off.

ついで複素5員環式化合物と接触させる。この接触方法
としては基材及び酸化剤を溶解しない溶媒中に複素5員
環式化合物を溶解し、その中に上記基材を浸す方法や、
あるいは複素5員環式化合物の蒸気中に上記基材をさら
す方法などが用いられ、特に基材と複素5員環式化合物
の英気を接触させる方法が好適である。
It is then brought into contact with a 5-membered heterocyclic compound. This contact method includes a method in which the five-membered heterocyclic compound is dissolved in a solvent that does not dissolve the base material and the oxidizing agent, and the base material is immersed therein;
Alternatively, a method of exposing the base material to the vapor of the five-membered heterocyclic compound may be used, and a method of bringing the base material into contact with the vapor of the five-membered heterocyclic compound is particularly preferred.

かくして基材表面にパターン状に複素5員環式化合物を
生成させることができ、導電性パターンを形成すること
ができる。
In this way, a five-membered heterocyclic compound can be formed in a pattern on the surface of the base material, and a conductive pattern can be formed.

〔実施例〕〔Example〕

以下実施例により本発明をさらに詳細に説明する。 The present invention will be explained in more detail with reference to Examples below.

実施例−1 ポリメチルメタクリル酸の板(2cmX5cm、厚さ2
1■)の表面に巾50ミクロン、長さ3墓膳、深さ30
ミクロンのみぞを100ミクロン間隔で刻み、かつ連結
した第1図に示したパターンを形成した。
Example-1 Polymethyl methacrylic acid plate (2 cm x 5 cm, thickness 2
1■) Width 50 microns, length 3 graves, depth 30 on the surface
The pattern shown in FIG. 1 was formed by cutting micron grooves at intervals of 100 microns and connecting them.

なお図中A、Bは蒸着した金を示し、Cは導電性パター
ンを形成後取り除いた部分を示す。塩化鉄(III) 
 ・6水和物1gをメタノール50mffに溶解した溶
液を酸化剤として用い、上記板上に流延したのち余分の
酸化剤をふき取った。この板をデシケータ中に入れ、ピ
ロールで飽和した窒素ガスを流通させたところ第1図に
示したパターンに従ってポリピロールがパターン状に重
合しており、A。
In the figure, A and B indicate the deposited gold, and C indicates the portion removed after the conductive pattern was formed. iron(III) chloride
- A solution of 1 g of hexahydrate dissolved in 50 mff of methanol was used as an oxidizing agent, and after casting on the plate, excess oxidizing agent was wiped off. When this plate was placed in a desiccator and nitrogen gas saturated with pyrrole was passed through it, polypyrrole was polymerized in a pattern according to the pattern shown in FIG.

B間の抵抗値は]9にΩであり、図の0部を取り除いた
時の抵抗値は20MΩ以上であった。
The resistance value between B was ]9Ω, and when the 0 part in the figure was removed, the resistance value was 20MΩ or more.

実施例−2 ガラス板(2cm X 5 CJI+、厚さ0.5mm
)表面に中50ミクロン、深さ20ミクロンのみぞで第
1図に示したパターンをエツチングした。酸化剤溶液と
して無水塩化鉄(II[)を飽和したニトロメタン溶液
を使用して上記ガラス板上に流延したのち、余分の酸化
剤をふき取った。このガラス板をデシケータ中に入れ、
チオフェンで飽和した窒素ガスを流通させたところポリ
チオフェンがパターン状に重合しており、A、 I3間
の抵抗値は4にΩであり、0部を取り除いたあとの抵抗
値は20MΩ以上であった。
Example-2 Glass plate (2cm x 5 CJI+, thickness 0.5mm
) The pattern shown in Figure 1 was etched into the surface with grooves of 50 microns in diameter and 20 microns in depth. A nitromethane solution saturated with anhydrous iron chloride (II[) was used as the oxidizing agent solution and was cast onto the glass plate, and then the excess oxidizing agent was wiped off. Place this glass plate in a desiccator,
When nitrogen gas saturated with thiophene was passed through, polythiophene was polymerized in a pattern, and the resistance between A and I3 was 4Ω, and after removing part 0, the resistance was more than 20MΩ. .

実施例−3,4 実施例−2において、チオフェンの代りにフラン及びセ
レノフェンを用いた以外は実施例−2と同様に行なった
ところそれぞれポリフラン、ポリセレノフェンがパター
ン状に重合した。A、B間の抵抗値はそれぞれ15MΩ
、 850 KΩであり、Cを取り除いたあとの抵抗は
どちらも20MΩ以上であった。
Examples 3 and 4 Example 2 was carried out in the same manner as in Example 2, except that furan and selenophene were used instead of thiophene. Polyfuran and polyselenophene were polymerized in a pattern, respectively. The resistance value between A and B is 15MΩ each.
, 850 KΩ, and the resistances after removing C were both 20 MΩ or more.

〔発明の効果〕〔Effect of the invention〕

本発明の方法によれば種々の材質の基材の表面に容易に
かつ工業的に有利に導電性パターンを形成することがで
きる。
According to the method of the present invention, conductive patterns can be easily and industrially advantageously formed on the surfaces of substrates made of various materials.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の導電性パターンの一例を示す。 FIG. 1 shows an example of the conductive pattern of the present invention.

Claims (1)

【特許請求の範囲】[Claims]  表面にパターン状にみぞが加工形成された基材を用い
、そのみぞ中に液状または溶剤に溶解した酸化剤を流延
した後、複素5員環式化合物と接触させて基材表面にパ
ターン状に複素5員環式化合物重合体を生成させること
を特徴とする導電性パターンの形成方法。
Using a base material with patterned grooves formed on its surface, a liquid or solvent-dissolved oxidizing agent is cast into the grooves, and then brought into contact with a five-membered heterocyclic compound to create a patterned pattern on the surface of the substrate. 1. A method for forming a conductive pattern, which comprises producing a five-membered heterocyclic compound polymer.
JP27505585A 1985-12-09 1985-12-09 Manufacture of conductive pattern Granted JPS62136709A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27505585A JPS62136709A (en) 1985-12-09 1985-12-09 Manufacture of conductive pattern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27505585A JPS62136709A (en) 1985-12-09 1985-12-09 Manufacture of conductive pattern

Publications (2)

Publication Number Publication Date
JPS62136709A true JPS62136709A (en) 1987-06-19
JPH0351248B2 JPH0351248B2 (en) 1991-08-06

Family

ID=17550213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27505585A Granted JPS62136709A (en) 1985-12-09 1985-12-09 Manufacture of conductive pattern

Country Status (1)

Country Link
JP (1) JPS62136709A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2657423B2 (en) * 1988-03-03 1997-09-24 ブラスベルク・オーベルフレヒェンテヒニーク・ゲー・エム・ベー・ハー Novel through-hole plated printed circuit board and manufacturing method thereof
JP2002340306A (en) * 2001-05-17 2002-11-27 Babcock Hitachi Kk Burner for burning solid fuel and combustion device equipped therewith

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2657423B2 (en) * 1988-03-03 1997-09-24 ブラスベルク・オーベルフレヒェンテヒニーク・ゲー・エム・ベー・ハー Novel through-hole plated printed circuit board and manufacturing method thereof
JP2002340306A (en) * 2001-05-17 2002-11-27 Babcock Hitachi Kk Burner for burning solid fuel and combustion device equipped therewith

Also Published As

Publication number Publication date
JPH0351248B2 (en) 1991-08-06

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