JPS62135441U - - Google Patents
Info
- Publication number
- JPS62135441U JPS62135441U JP1986023793U JP2379386U JPS62135441U JP S62135441 U JPS62135441 U JP S62135441U JP 1986023793 U JP1986023793 U JP 1986023793U JP 2379386 U JP2379386 U JP 2379386U JP S62135441 U JPS62135441 U JP S62135441U
- Authority
- JP
- Japan
- Prior art keywords
- flip
- mounting structure
- chip
- hole
- flip chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 239000011241 protective layer Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986023793U JPS62135441U (enrdf_load_stackoverflow) | 1986-02-20 | 1986-02-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986023793U JPS62135441U (enrdf_load_stackoverflow) | 1986-02-20 | 1986-02-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62135441U true JPS62135441U (enrdf_load_stackoverflow) | 1987-08-26 |
Family
ID=30822419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986023793U Pending JPS62135441U (enrdf_load_stackoverflow) | 1986-02-20 | 1986-02-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62135441U (enrdf_load_stackoverflow) |
-
1986
- 1986-02-20 JP JP1986023793U patent/JPS62135441U/ja active Pending