JPS62134223A - Liquid resin sealing mechanism - Google Patents

Liquid resin sealing mechanism

Info

Publication number
JPS62134223A
JPS62134223A JP27436285A JP27436285A JPS62134223A JP S62134223 A JPS62134223 A JP S62134223A JP 27436285 A JP27436285 A JP 27436285A JP 27436285 A JP27436285 A JP 27436285A JP S62134223 A JPS62134223 A JP S62134223A
Authority
JP
Japan
Prior art keywords
mold
cavity
resin
gap
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP27436285A
Other languages
Japanese (ja)
Other versions
JPH0310488B2 (en
Inventor
Kenichi Sekiyama
関山 憲一
Yasushi Kageyama
裕史 影山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP27436285A priority Critical patent/JPS62134223A/en
Publication of JPS62134223A publication Critical patent/JPS62134223A/en
Publication of JPH0310488B2 publication Critical patent/JPH0310488B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/72Heating or cooling
    • B29C45/73Heating or cooling of the mould

Abstract

PURPOSE:To prevent the leakage of resin perfectly by a method wherein an annular surface, constituting a gap around a top force and a bottom force, is heated to a high temperature to harden thermosetting resin during a period in which the thermosetting resin moves to an opening at the outside opening. CONSTITUTION:A block 48 is fixed through an insulating material 44 along the whole periphery of the cavity surface 30 of a backup section 18 and a plate heater 54 is embedded in the block 48. When a top force 10 and a bottom force 12 are closed, a gap 52 is formed between an upper end face 50 and the annular surface 26 of the top force 10. When liquid thermosetting resin, curing agent or the like is poured into the cavity 14, the resin, entered into the gap 52, flows toward the outside of a molding mold, heated by the heated upper end face 50 and is hardened perfectly until it arrives at an opening at the outside of the gap 52 whereby the opening is blockaded so as to remain no gap. Accordingly, the leakage of the resin between the top force 10 and the bottom force 12 may be prevented. In this case, the resin cured in the gap 52 is removed as burrs after removing the cured resin from the mold together with the molded product.

Description

【発明の詳細な説明】 技術分野 本発明は、熱硬化性樹脂の成形に使用される型において
樹脂の漏出を防止するシール機構に関するものである。
DETAILED DESCRIPTION OF THE INVENTION TECHNICAL FIELD The present invention relates to a sealing mechanism for preventing leakage of resin in a mold used for molding thermosetting resin.

従来の技術 不飽和ポリエステル、エポキシ樹脂、フェノール樹脂等
熱硬化性樹脂の成形に使用される型は、一般に、互に閉
じられてキャビティを形成する第一型と第二型とを備え
ている。この種の成形型においては、キャビティに注入
された樹脂が第一型と第二型との間から漏出することを
防止するために、従来、種々の態様でシールが行われて
いる。
BACKGROUND OF THE INVENTION A mold used for molding thermosetting resins such as unsaturated polyester, epoxy resin, and phenolic resin generally includes a first mold and a second mold that are closed together to form a cavity. In this type of mold, sealing has conventionally been performed in various ways in order to prevent the resin injected into the cavity from leaking from between the first mold and the second mold.

例えば、第一型と第二型とのキャビティ周辺の合わせ面
に、空気は逃がすが樹脂の漏出は防止する隙間を形成す
ることが行われており、・また、ガラス繊維等の繊維基
材で樹脂を強化するFRPレジンインジェクション成形
においては、第一型と第二型との間に挟む繊維基材をキ
ャビティよりも大きいものとするとともに、両型の合わ
せ面間に環状にゴムあるいは金属のピンチ部材を配設し
、繊維基材のピンチ部材によって局部的に強く圧縮され
た部分がシール機能を果たすようにすることが行われて
いる。さらに、キャビティの周囲をOリング等によって
シールし、真空ポンプ等により型内の空気を抜いた後に
樹脂を注入してOリングにより樹脂の漏出を防止するこ
とも行われている。
For example, a gap is formed between the mating surfaces of the first mold and the second mold around the cavity to allow air to escape but prevent resin from leaking. In FRP resin injection molding that strengthens the resin, the fiber base material sandwiched between the first mold and the second mold is larger than the cavity, and a rubber or metal pinch is placed in an annular shape between the mating surfaces of both molds. A member is arranged so that a portion of the fiber base material that is locally strongly compressed by the pinch member performs a sealing function. Furthermore, the circumference of the cavity is sealed with an O-ring or the like, and after the air inside the mold is removed using a vacuum pump or the like, resin is injected and the O-ring is used to prevent the resin from leaking.

発明が解決しようとする問題点 しかし、第一および第二のシール機構によれば、樹脂の
注入圧を高くしたり、粘度の低い樹脂を使用した場合に
は樹脂の漏出を完全には防止できないため、成形に当た
っては粘度の高い樹脂を使用するか、樹脂の注入圧を低
くせざるを得ず、成形サイクルを短縮することが困難で
ある上、樹脂の漏出により、キャビティに充填されるべ
き樹脂の量が不足し、成形品に欠損が生じたり、また、
型外に漏出した樹脂を除去するために掃除を行わなけれ
ばならず、作業工数が増加するという問題があった。
Problems to be Solved by the Invention However, according to the first and second seal mechanisms, resin leakage cannot be completely prevented when the resin injection pressure is increased or when a resin with low viscosity is used. Therefore, during molding, it is necessary to use a resin with high viscosity or to lower the injection pressure of the resin, which makes it difficult to shorten the molding cycle, and due to resin leakage, the resin that should be filled into the cavity If the amount is insufficient, the molded product may be damaged, or
There was a problem in that cleaning had to be performed to remove resin leaked outside the mold, which increased the number of work steps.

第三のシール機構によれば、注入圧を高くしたり、粘度
の低い樹脂を使用しても樹脂が漏出することはないので
あるが、キャビティ内の空気抜きに要する時間分成形サ
イクルが長くなり、また、空気が完全に抜は切らず、キ
ャビティの隅に溜った場合にはやはり成形品に欠損が生
ずる問題があった。
According to the third sealing mechanism, resin will not leak even if the injection pressure is increased or a resin with low viscosity is used, but the molding cycle becomes longer due to the time required to bleed air from the cavity. Furthermore, if the air is not completely evacuated and accumulates in the corners of the cavity, there is a problem that the molded product may be damaged.

問題点を解決するための第一の手段 本発明呼上記の問題を解決するために為されたものであ
り、第一発明に係るシール機構は、第一型と第二型との
間に、一端がキャビティに開口し、他端が外側に開口す
る隙間がキャビティの全周にわたって設けられるととも
に、第一型と第二型とのその隙間を構成する環状の各面
のうち少なくとも一方の面の全周にわたって、その面を
キャビティの温度よりも高い温度に加熱するとともに、
キャビティに注入された熱硬化性樹脂が上記隙間のキャ
ビティ側の開口から外側の開口まで移動する間に硬化す
るのに十分な距離にわたって加熱する加熱体が埋設され
たものである。
First Means for Solving the Problems The present invention has been made in order to solve the above problems, and the sealing mechanism according to the first invention has a seal mechanism between the first mold and the second mold. A gap is provided around the entire circumference of the cavity, with one end opening into the cavity and the other end opening outside, and at least one of the annular surfaces forming the gap between the first mold and the second mold. Along the entire circumference, the surface is heated to a temperature higher than that of the cavity, and
A heating element is embedded therein to heat the thermosetting resin injected into the cavity over a distance sufficient to cure the resin while it travels from the opening on the cavity side of the gap to the opening on the outside.

第一の手段の作用 第一発明に係るシール機構によれば、樹脂の注入に伴っ
てキャビティ内の空気がその周囲に設けられた隙間から
良好に排出され、その後、樹脂が隙間内に流入するが、
キャビティよりも高い温度に加熱された隙間の面によっ
て急速に加熱されることにより、隙間の型の外側の開口
まで移動する前に硬化し、その開口を隙間なく塞いで次
に流れて来る樹脂の漏出を防止するシール材として機能
することとなる。
Effect of the first means According to the sealing mechanism according to the first invention, as the resin is injected, the air in the cavity is well discharged from the gap provided around the cavity, and then the resin flows into the gap. but,
By being rapidly heated by the surface of the gap that is heated to a higher temperature than the cavity, the resin hardens before it can travel to the outside opening of the mold, sealing that opening without any gaps and allowing the next inflowing resin to harden. It will function as a sealing material to prevent leakage.

第一の手段の効果 したがって、樹脂の注入圧を高くしたり、粘度の低い樹
脂を使用しても、隙間内において硬化させられた樹脂が
シール機能を果たすことにより、注入された樹脂が型外
に漏出する恐れはないのであり、成形サイクルを短縮す
ることができる。また、樹脂の漏出が防止されることに
より、キャビティに充填すべき樹脂の量に不足が生ずる
ことがなく、完全な成形品が得られるとともに、型外に
漏れた樹脂を除去する必要がなく、作業工数を著しく低
減し得る効果が得られる。
Effect of the first means Therefore, even if the resin injection pressure is high or a resin with low viscosity is used, the hardened resin in the gap will perform a sealing function, and the injected resin will be removed from the mold. There is no risk of leakage, and the molding cycle can be shortened. In addition, by preventing resin leakage, there is no shortage of resin to be filled into the cavity, and a complete molded product can be obtained, and there is no need to remove resin leaked outside the mold. The effect of significantly reducing the number of work steps can be obtained.

問題点を解決するための第二の手段 また、第二発明に係るシール機構は、第一発明に係るシ
ール機構の隙間に多孔質弾性体が挟まれたものである。
Second Means for Solving the Problem Furthermore, the sealing mechanism according to the second invention has a porous elastic body sandwiched between the gaps of the sealing mechanism according to the first invention.

第二の手段の作用 多孔質弾性体は空気の流通には十分な通気性を備えてい
るため、樹脂によって押し出される空気の排出が妨げら
れることはないのであり、隙間内に流入した樹脂は、第
一発明に係るシール機構におけると同様に加熱されると
ともに、多孔質弾性体によって抵抗を与えられることに
より流れが遅くされる。
Effect of the second means Since the porous elastic body has sufficient air permeability for air circulation, the discharge of the air pushed out by the resin is not hindered, and the resin flowing into the gap is As in the sealing mechanism according to the first invention, it is heated and the flow is slowed down by the resistance provided by the porous elastic body.

第二の手段の効果 したがって、第二発明に係るシール機構によれば、第一
発明に係るシール機構と同様に成形サイクルを短縮し得
る効果が得られるとともに、加熱温度が同じである場合
には、樹脂の移動距離に対する温度上昇率が大きくなる
ため、樹脂が硬化するまでに要する移動距離が短くて済
み、加熱体、延いては隙間の樹脂移動方向の寸法を小さ
くして成形型を小形化し得るとともに、隙間に流入する
樹脂が少なくて済み、成形コストを低減し得る効果が得
られる。
Effect of the second means Therefore, according to the sealing mechanism according to the second invention, the effect of shortening the molding cycle can be obtained like the sealing mechanism according to the first invention, and when the heating temperature is the same, , since the rate of temperature rise relative to the distance traveled by the resin increases, the distance required for the resin to harden is shortened, and the size of the heating element and, by extension, the gap in the direction of resin movement can be reduced to make the mold more compact. At the same time, less resin flows into the gap, resulting in an effect of reducing molding costs.

実施例 以下、第一発明および第二発明の実施例を図面に基づい
て詳細に説明する。
EXAMPLES Hereinafter, examples of the first invention and the second invention will be described in detail based on the drawings.

第1図に示すのは、第一発明の一実施例である液体樹脂
シール機構を備えた成形型であり、この成形型はエポキ
シ樹脂をガラス繊維等で強化した製品の成形に使用され
る。図において10は第一型としての上型、12は第二
型としての下型であり、4これら上型10および下型1
2は共に、キャビティ14を形成するバンクアップ部1
6.18と、それらバンクアップ部16.18の背面に
固定された補助板20.22とを備えている。
What is shown in FIG. 1 is a mold equipped with a liquid resin sealing mechanism, which is an embodiment of the first invention, and this mold is used for molding products made of epoxy resin reinforced with glass fiber or the like. In the figure, 10 is an upper mold as a first mold, 12 is a lower mold as a second mold, and 4 these are the upper mold 10 and the lower mold 1.
2 is a bank up part 1 which together forms a cavity 14.
6.18, and an auxiliary plate 20.22 fixed to the back surface of the bank-up portions 16.18.

、上型10のバックアップ部1Gには、キャビティ14
を構成するキャビテイ面24およびその周囲の環状面2
6に沿って複数本のパイプ28が互に平行に埋設される
一方、バックアップ部18には、キャビティ14を構成
するキャビテイ面3゜に沿ってのみ複数本のパイプ32
が互に平行に埋設されており、それらパイプ28.32
にオイルが流されることにより、キャビティ面24.3
0が130℃に加熱されるようになっている。また、上
型10には、上下方向に延びる樹脂注入穴34が形成さ
れており、成形時には、この樹脂注入穴34にミキサ3
6を介して樹脂供給装置(図示せず)に接続された注入
ガン40が挿入され、上型10の樹脂注入孔42からキ
ャビティ14に樹脂が注入されるようになっている。
, a cavity 14 is provided in the backup part 1G of the upper die 10.
The cavity surface 24 and the annular surface 2 surrounding it
6, a plurality of pipes 28 are buried in parallel to each other, while a plurality of pipes 32 are buried in the backup part 18 only along the cavity surface 3° constituting the cavity 14.
are buried parallel to each other, and these pipes 28.32
By flowing oil into the cavity surface 24.3
0 is heated to 130°C. Further, a resin injection hole 34 extending in the vertical direction is formed in the upper mold 10, and a mixer 3 is inserted into this resin injection hole 34 during molding.
An injection gun 40 connected to a resin supply device (not shown) through a resin supplying device 6 is inserted, and resin is injected into the cavity 14 from a resin injection hole 42 of the upper mold 10.

バックアップ部18のキャビテイ面30の周囲には、第
1図および第2図に示すように、全周にわたり、断熱材
44を介してブロック4日が固定されている。ブロック
48は、外側の端面が下型10の側面とちょうど一致す
るとともに、その上端部がキャビテイ面30から突出し
た状態となるように配設されている。また、ブロック4
8の上端面50には図示しない複数のスペーサが適度の
間隔で載置されており、上型10と下型12とが閉じら
れたとき、上端面5oと上型10の環状面26との間に
、厚さが0.2mmであって、一端がキャビティ14に
開口し、他端が型外に開口する隙間52が形成されるよ
うになっている。
As shown in FIGS. 1 and 2, a block 4 is fixed around the cavity surface 30 of the backup part 18 over the entire circumference with a heat insulating material 44 interposed therebetween. The block 48 is arranged so that its outer end surface exactly matches the side surface of the lower die 10 and its upper end protrudes from the cavity surface 30. Also, block 4
A plurality of spacers (not shown) are placed at appropriate intervals on the upper end surface 50 of the upper mold 8, and when the upper mold 10 and the lower mold 12 are closed, the upper end surface 5o and the annular surface 26 of the upper mold 10 are A gap 52 having a thickness of 0.2 mm is formed between them, with one end opening into the cavity 14 and the other end opening outside the mold.

前記ブロック48内には、加熱体としてのプレートヒー
タ54が埋設されており、このプレートヒータ54は、
図示しない温度調節器によってブロック48の前記上端
面50を250℃に加熱し得るようにされている。また
、ブロック48の幅、すなわちキャビティ24側の端か
ら外側の端に至る長さは200mmとされている。この
長さは、キャビティ14から隙間52に流入したエポキ
シ樹脂が、250℃の上端面50により加熱されつつキ
ャビティ14側の開口から外側の開口まで移動する間に
完全に硬化するのに十分な長さである。
A plate heater 54 as a heating body is embedded in the block 48, and this plate heater 54 has the following functions:
The upper end surface 50 of the block 48 can be heated to 250° C. by a temperature regulator (not shown). Further, the width of the block 48, that is, the length from the end on the cavity 24 side to the outer end is 200 mm. This length is long enough for the epoxy resin that has flowed into the gap 52 from the cavity 14 to be completely cured while being heated by the upper end surface 50 at 250° C. and moving from the opening on the side of the cavity 14 to the opening on the outside. It is.

以上のように構成された成形型による樹脂成形時には、
樹脂供給装置から供給された液状の熱硬化性樹脂、硬化
剤等がミキサ36において混合された後、注入ガン40
から樹脂注入孔42を経てキャビティ14内に注入され
、予めキャビティ14内にセントされた繊維基材の隙間
を埋めるとともにキャビティ14内の空気を排除しなが
ら流れ、隙間52内に流入する。隙間52内に流入した
樹脂は成形型の外側に向かって流れるのであるが、この
際、250°Cに加熱された上端面50によって加熱さ
れることにより急速に硬化し、30kgf/cd程度の
圧力で注入された場合であっても、隙間52の型の外側
の開口に達するまでの間に完全に硬化してその開口を隙
間なく閉塞することとなるのであり、それによって上型
lOと下型12との間からの樹脂の漏出が防止されるこ
ととなる。
During resin molding using the mold configured as above,
After the liquid thermosetting resin, curing agent, etc. supplied from the resin supply device are mixed in the mixer 36, the injection gun 40
The resin is injected into the cavity 14 through the resin injection hole 42, fills the gap in the fiber base material previously placed in the cavity 14, flows while eliminating air in the cavity 14, and flows into the gap 52. The resin that has flowed into the gap 52 flows toward the outside of the mold, but at this time, it is rapidly hardened by being heated by the upper end surface 50 heated to 250°C, and a pressure of about 30 kgf/cd is applied. Even if it is injected, it will completely harden by the time it reaches the opening on the outside of the mold in the gap 52, and the opening will be closed without any gap. This will prevent the resin from leaking between the two and 12.

なお、隙間52内で硬化した樹脂は、パリとして成形品
と共に金型から外した後、切除する。
Note that the resin that has hardened within the gap 52 is removed from the mold together with the molded product and then cut out.

第3図に第二発明の実施例を示す。この実施例は、第1
図および第2図に示した成形型と同様に構成された成形
型において、隙間52に多孔質弾性体としての厚さ5m
mの軟質ウレタンフオーム材60を挟んだものである。
FIG. 3 shows an embodiment of the second invention. In this example, the first
In a mold configured similarly to the mold shown in FIG. 2 and FIG.
A soft urethane foam material 60 of m is sandwiched therebetween.

軟質ウレタンフオーム材60は多孔性のものであり、空
気の排出を許容しつつ、隙間52を流れる樹脂に抵抗を
与えることができる。したがって、樹脂の流動速度が遅
くなり、移動距離に対する温度上昇率が大きくなるため
、樹脂が完全に硬化するまでに要する移動距離が短くて
済み、ブロック48の幅を短く (本実施例においては
150mm)することができる。
The soft urethane foam material 60 is porous and can provide resistance to the resin flowing through the gap 52 while allowing air to be discharged. Therefore, the flow rate of the resin becomes slower and the rate of temperature rise relative to the moving distance increases, so the moving distance required for the resin to completely harden is shortened, and the width of the block 48 is shortened (150 mm in this example). )can do.

また、隙間52には、ガラス繊維コンティニュアススト
ランドマント等、多孔質弾性体である有機あるいは無機
の繊維基材等にメタキシリレンジアミン等の反応促進剤
を含浸させたものを挟んでもよく、そのようにすれば、
樹脂の硬化が促進されて硬化時間が短くて済み、ブロッ
ク48の幅を更に短く (例えば120mm)すること
ができる。
Further, in the gap 52, a material such as a glass fiber continuous strand cloak, which is a porous elastic organic or inorganic fiber base material impregnated with a reaction accelerator such as metaxylylene diamine, may be sandwiched. If you do that,
The curing of the resin is accelerated, the curing time is shortened, and the width of the block 48 can be made even shorter (for example, 120 mm).

なお、上記実施例においては、いずれも加熱体たるプレ
ートヒータ54が下型12にのみ埋設されていたが、上
型10に、あるいは上型10.下型12のいずれにも埋
設するようにしてもよい。
In the above embodiments, the plate heater 54 serving as a heating element was buried only in the lower mold 12, but it was buried in the upper mold 10 or in the upper mold 10. It may be buried in any of the lower molds 12.

、また、加熱体はプレートヒータ54に限られず、例え
ば、キャビティ14を加熱するパイプのうち、隙間52
に沿って配設されたパイプを利用して、隙間52を構成
する面をキャビテイ面よりも高い温度に加熱するように
することも可能である。
Furthermore, the heating body is not limited to the plate heater 54, but for example, the heating body may be a gap 52 of a pipe that heats the cavity 14.
It is also possible to heat the surface forming the gap 52 to a higher temperature than the cavity surface by using a pipe disposed along the gap 52.

その他、いちいち例示することはしないが、本発明は当
業者の知識に基づいて種々の変形、改良を施した態様で
実施することができる。
Although not illustrated in detail, the present invention can be implemented with various modifications and improvements based on the knowledge of those skilled in the art.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は第一発明の一実施例である液体樹脂シール機構
を備えた成形型を示す正面断面図である。 第2図は上記シール機構を示す正面断面図である。 第3図は第二発明の一実施例である液体樹脂シール機構
を示す正面断面図である。 lO:上型(第一型)  12:下型(第二型)14:
キャビティ   48ニブロック50:上端面    
 52:隙間 54ニブレートヒータ(加熱体) 60:軟質ウレタンフオーム材(多孔質弾性体)出願人
 工業技術院長 等々力 達 第1図 第2図      第3図
FIG. 1 is a front sectional view showing a mold equipped with a liquid resin sealing mechanism according to an embodiment of the first invention. FIG. 2 is a front sectional view showing the sealing mechanism. FIG. 3 is a front sectional view showing a liquid resin sealing mechanism which is an embodiment of the second invention. lO: Upper mold (first mold) 12: Lower mold (second mold) 14:
Cavity 48 Ni block 50: Upper end surface
52: Gap 54 Nibrate heater (heating body) 60: Soft urethane foam material (porous elastic body) Applicant: Todoroki Director, Agency of Industrial Science and Technology Figure 1 Figure 2 Figure 3

Claims (3)

【特許請求の範囲】[Claims] (1)互に閉じられてキャビティを形成する第一型と第
二型とを備えた熱硬化性樹脂の成形型において、前記キ
ャビティに注入された液状の熱硬化性樹脂が前記第一型
と第二型との間から型外へ漏出することを防止するシー
ル機構であって、 前記第一型と第二型との間に、一端が前記キャビティに
開口し、他端が外側に開口する隙間がキャビティの全周
にわたって設けられるとともに、前記第一型と第二型と
のその隙間を構成する環状の各面のうち少なくとも一方
の面の全周にわたって、その面を前記キャビティの温度
よりも高い温度に加熱するとともに、キャビティに注入
された熱硬化性樹脂が前記隙間のキャビティ側の開口か
ら外側の開口まで移動する間に硬化するのに十分な距離
にわたって加熱する加熱体が埋設されたことを特徴とす
る液体樹脂シール機構。
(1) In a thermosetting resin mold comprising a first mold and a second mold that are closed to each other to form a cavity, the liquid thermosetting resin injected into the cavity is mixed with the first mold. A sealing mechanism that prevents leakage from between the first mold and the second mold, the seal mechanism having one end opening into the cavity and the other end opening outside the first mold and the second mold. A gap is provided over the entire circumference of the cavity, and the temperature of at least one of the annular surfaces forming the gap between the first mold and the second mold is lower than that of the cavity. A heating element is embedded that heats the resin to a high temperature and over a distance sufficient to cure the thermosetting resin injected into the cavity as it moves from the opening on the cavity side of the gap to the opening on the outside. A liquid resin seal mechanism featuring:
(2)互に閉じられてキャビティを形成する第一型と第
二型とを備えた熱硬化性樹脂の成形型において、前記キ
ャビティに注入された液状の熱硬化性樹脂が前記第一型
と第二型との間から型外へ漏出することを防止するシー
ル機構であって、 前記第一型と第二型との間に、一端が前記キャビティに
開口し、他端が外側に開口する隙間がキャビティの全周
にわたって設けられるとともに、その隙間に多孔質弾性
体が挟まれ、かつ、前記第一型と第二型とのその隙間を
構成する環状の各面のうち少なくとも一方の面の全周に
わたって、その面を前記キャビティの温度よりも高い温
度に加熱するとともに、キャビティに注入された熱硬化
性樹脂が前記隙間のキャビティ側の開口から外側の開口
まで移動する間に硬化するのに十分な距離にわたって加
熱する加熱体が埋設されたことを特徴とする液体樹脂シ
ール機構。
(2) In a thermosetting resin mold comprising a first mold and a second mold that are closed to each other to form a cavity, the liquid thermosetting resin injected into the cavity is connected to the first mold. A sealing mechanism that prevents leakage from between the first mold and the second mold, the seal mechanism having one end opening into the cavity and the other end opening outside the first mold and the second mold. A gap is provided around the entire circumference of the cavity, a porous elastic body is sandwiched in the gap, and at least one of the annular surfaces forming the gap between the first mold and the second mold is provided. The surface is heated to a temperature higher than the temperature of the cavity over the entire circumference, and the thermosetting resin injected into the cavity is cured while moving from the opening on the cavity side of the gap to the opening on the outside. A liquid resin seal mechanism characterized by having a heating element embedded therein that heats over a sufficient distance.
(3)前記多孔質弾性体が反応促進剤を担持したもので
ある特許請求の範囲第2項記載の液体樹脂シール機構。
(3) The liquid resin sealing mechanism according to claim 2, wherein the porous elastic body supports a reaction accelerator.
JP27436285A 1985-12-07 1985-12-07 Liquid resin sealing mechanism Granted JPS62134223A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27436285A JPS62134223A (en) 1985-12-07 1985-12-07 Liquid resin sealing mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27436285A JPS62134223A (en) 1985-12-07 1985-12-07 Liquid resin sealing mechanism

Publications (2)

Publication Number Publication Date
JPS62134223A true JPS62134223A (en) 1987-06-17
JPH0310488B2 JPH0310488B2 (en) 1991-02-13

Family

ID=17540601

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27436285A Granted JPS62134223A (en) 1985-12-07 1985-12-07 Liquid resin sealing mechanism

Country Status (1)

Country Link
JP (1) JPS62134223A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5266259A (en) * 1991-09-17 1993-11-30 Ford Motor Company Molding a reinforced plastics component
EP1207031A1 (en) * 1999-07-27 2002-05-22 Dai Nippon Toryo Co., Ltd. Method of forming coating on inner surfaces of metal mold
FR2888526A1 (en) * 2005-07-18 2007-01-19 Inoplast Sa Thermosetting material piece producing mold, has resistors permitting localized heating of compression chamber in order to locally increase temperature in chamber with respect to temperature in impression
KR100704406B1 (en) * 1999-11-17 2007-04-09 다이니폰 도료 가부시키가이샤 In-mold coating formation mold and in-mold coating formation method utilizing said mold

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4894859U (en) * 1972-02-12 1973-11-12

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4894859U (en) * 1972-02-12 1973-11-12

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5266259A (en) * 1991-09-17 1993-11-30 Ford Motor Company Molding a reinforced plastics component
EP1207031A1 (en) * 1999-07-27 2002-05-22 Dai Nippon Toryo Co., Ltd. Method of forming coating on inner surfaces of metal mold
EP1207031A4 (en) * 1999-07-27 2003-04-09 Dainippon Toryo Kk Method of forming coating on inner surfaces of metal mold
US7832999B2 (en) 1999-07-27 2010-11-16 Dai Nippon Toryo Co., Ltd. Method of forming a coating layer on the surface of a molded product within a mold
US7837918B2 (en) 1999-07-27 2010-11-23 Dai Nippon Toryo Co., Ltd. Method of forming a coating layer on the surface of a molded product within a mold
KR100704406B1 (en) * 1999-11-17 2007-04-09 다이니폰 도료 가부시키가이샤 In-mold coating formation mold and in-mold coating formation method utilizing said mold
FR2888526A1 (en) * 2005-07-18 2007-01-19 Inoplast Sa Thermosetting material piece producing mold, has resistors permitting localized heating of compression chamber in order to locally increase temperature in chamber with respect to temperature in impression

Also Published As

Publication number Publication date
JPH0310488B2 (en) 1991-02-13

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