JPS62133382U - - Google Patents
Info
- Publication number
- JPS62133382U JPS62133382U JP1986021611U JP2161186U JPS62133382U JP S62133382 U JPS62133382 U JP S62133382U JP 1986021611 U JP1986021611 U JP 1986021611U JP 2161186 U JP2161186 U JP 2161186U JP S62133382 U JPS62133382 U JP S62133382U
- Authority
- JP
- Japan
- Prior art keywords
- electrical component
- mounting board
- connection wire
- component mounting
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986021611U JPS62133382U ( ) | 1986-02-18 | 1986-02-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986021611U JPS62133382U ( ) | 1986-02-18 | 1986-02-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62133382U true JPS62133382U ( ) | 1987-08-22 |
Family
ID=30818209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986021611U Pending JPS62133382U ( ) | 1986-02-18 | 1986-02-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62133382U ( ) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2016151762A1 (ja) * | 2015-03-24 | 2018-03-01 | オリンパス株式会社 | 電子回路モジュール |
-
1986
- 1986-02-18 JP JP1986021611U patent/JPS62133382U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2016151762A1 (ja) * | 2015-03-24 | 2018-03-01 | オリンパス株式会社 | 電子回路モジュール |