JPS62131468U - - Google Patents
Info
- Publication number
- JPS62131468U JPS62131468U JP1958486U JP1958486U JPS62131468U JP S62131468 U JPS62131468 U JP S62131468U JP 1958486 U JP1958486 U JP 1958486U JP 1958486 U JP1958486 U JP 1958486U JP S62131468 U JPS62131468 U JP S62131468U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- patterned circuit
- circuit copper
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1958486U JPS62131468U (es) | 1986-02-13 | 1986-02-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1958486U JPS62131468U (es) | 1986-02-13 | 1986-02-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62131468U true JPS62131468U (es) | 1987-08-19 |
Family
ID=30814312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1958486U Pending JPS62131468U (es) | 1986-02-13 | 1986-02-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62131468U (es) |
-
1986
- 1986-02-13 JP JP1958486U patent/JPS62131468U/ja active Pending