JPS6212966U - - Google Patents
Info
- Publication number
- JPS6212966U JPS6212966U JP1985129026U JP12902685U JPS6212966U JP S6212966 U JPS6212966 U JP S6212966U JP 1985129026 U JP1985129026 U JP 1985129026U JP 12902685 U JP12902685 U JP 12902685U JP S6212966 U JPS6212966 U JP S6212966U
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting diode
- wavelength
- receiving
- emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985129026U JPS6212966U (en:Method) | 1985-08-24 | 1985-08-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985129026U JPS6212966U (en:Method) | 1985-08-24 | 1985-08-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6212966U true JPS6212966U (en:Method) | 1987-01-26 |
Family
ID=31025230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985129026U Pending JPS6212966U (en:Method) | 1985-08-24 | 1985-08-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6212966U (en:Method) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06326364A (ja) * | 1993-03-22 | 1994-11-25 | Sanyo Electric Co Ltd | 発光ダイオードランプ |
-
1985
- 1985-08-24 JP JP1985129026U patent/JPS6212966U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06326364A (ja) * | 1993-03-22 | 1994-11-25 | Sanyo Electric Co Ltd | 発光ダイオードランプ |