JPS62128656U - - Google Patents

Info

Publication number
JPS62128656U
JPS62128656U JP1450586U JP1450586U JPS62128656U JP S62128656 U JPS62128656 U JP S62128656U JP 1450586 U JP1450586 U JP 1450586U JP 1450586 U JP1450586 U JP 1450586U JP S62128656 U JPS62128656 U JP S62128656U
Authority
JP
Japan
Prior art keywords
optical fiber
emitting element
light
light emitting
back side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1450586U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1450586U priority Critical patent/JPS62128656U/ja
Publication of JPS62128656U publication Critical patent/JPS62128656U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示す平面断面図、
第２図は第１図の実施例における正面断面図であ
る。 １……光フアイバ、２……プラグ、３……レセ
プタクル、４……ケース、５……ＬＥＤ、６……
ホトダイオード、７……エラストマ。 FIG. 1 is a plan sectional view showing an embodiment of the present invention;
FIG. 2 is a front sectional view of the embodiment of FIG. 1. 1... Optical fiber, 2... Plug, 3... Receptacle, 4... Case, 5... LED, 6...
Photodiode, 7...Elastomer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 光フアイバと、該光フアイバの伝送端に密接配
設されて該光フアイバに光を供給すると共に発光
の一部を背面側へ反射させる発光素子と、該発光
素子の背面に配設されて該発光素子の反射光の大
部分を受光する受光素子とを設けたことを特徴と
する光フアイバデータリンク。 an optical fiber, a light emitting element disposed closely at the transmission end of the optical fiber to supply light to the optical fiber and to reflect a part of the emitted light to the back side; and a light emitting element disposed on the back side of the light emitting element to An optical fiber data link comprising a light receiving element that receives most of the reflected light from the light emitting element.
JP1450586U 1986-02-05 1986-02-05 Pending JPS62128656U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1450586U JPS62128656U (en) 1986-02-05 1986-02-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1450586U JPS62128656U (en) 1986-02-05 1986-02-05

Publications (1)

Publication Number Publication Date
JPS62128656U true JPS62128656U (en) 1987-08-14

Family

ID=30804553

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1450586U Pending JPS62128656U (en) 1986-02-05 1986-02-05

Country Status (1)

Country Link
JP (1) JPS62128656U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008093875A1 (en) * 2007-02-01 2008-08-07 Nippon Sheet Glass Company, Limited Optical module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008093875A1 (en) * 2007-02-01 2008-08-07 Nippon Sheet Glass Company, Limited Optical module

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