JPS62126845U - - Google Patents
Info
- Publication number
- JPS62126845U JPS62126845U JP1314986U JP1314986U JPS62126845U JP S62126845 U JPS62126845 U JP S62126845U JP 1314986 U JP1314986 U JP 1314986U JP 1314986 U JP1314986 U JP 1314986U JP S62126845 U JPS62126845 U JP S62126845U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealed
- semiconductor
- lead
- base part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 2
- 239000008188 pellet Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1314986U JPS62126845U (pt) | 1986-01-31 | 1986-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1314986U JPS62126845U (pt) | 1986-01-31 | 1986-01-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62126845U true JPS62126845U (pt) | 1987-08-12 |
Family
ID=30801939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1314986U Pending JPS62126845U (pt) | 1986-01-31 | 1986-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62126845U (pt) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000075991A1 (en) * | 1999-06-03 | 2000-12-14 | Tokyo R & D Co., Ltd. | Power feed and heat dissipating device for power semiconductor devices |
-
1986
- 1986-01-31 JP JP1314986U patent/JPS62126845U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000075991A1 (en) * | 1999-06-03 | 2000-12-14 | Tokyo R & D Co., Ltd. | Power feed and heat dissipating device for power semiconductor devices |