JPS62126661U - - Google Patents
Info
- Publication number
- JPS62126661U JPS62126661U JP1315986U JP1315986U JPS62126661U JP S62126661 U JPS62126661 U JP S62126661U JP 1315986 U JP1315986 U JP 1315986U JP 1315986 U JP1315986 U JP 1315986U JP S62126661 U JPS62126661 U JP S62126661U
- Authority
- JP
- Japan
- Prior art keywords
- diaphragm
- reinforcing member
- outer peripheral
- outside
- lower case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003014 reinforcing effect Effects 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Diaphragms And Bellows (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1315986U JPH032769Y2 (enExample) | 1986-01-31 | 1986-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1315986U JPH032769Y2 (enExample) | 1986-01-31 | 1986-01-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62126661U true JPS62126661U (enExample) | 1987-08-11 |
| JPH032769Y2 JPH032769Y2 (enExample) | 1991-01-24 |
Family
ID=30801957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1315986U Expired JPH032769Y2 (enExample) | 1986-01-31 | 1986-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH032769Y2 (enExample) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6982488B2 (en) | 1999-08-24 | 2006-01-03 | Amkor Technology, Inc. | Semiconductor package and method for fabricating the same |
| US7061120B2 (en) | 1999-05-20 | 2006-06-13 | Amkor Technology, Inc. | Stackable semiconductor package having semiconductor chip within central through hole of substrate |
| US7190071B2 (en) | 1999-05-07 | 2007-03-13 | Amkor Technology, Inc. | Semiconductor package and method for fabricating the same |
| USRE40112E1 (en) | 1999-05-20 | 2008-02-26 | Amkor Technology, Inc. | Semiconductor package and method for fabricating the same |
| US7633144B1 (en) | 2006-05-24 | 2009-12-15 | Amkor Technology, Inc. | Semiconductor package |
| US9466545B1 (en) | 2007-02-21 | 2016-10-11 | Amkor Technology, Inc. | Semiconductor package in package |
-
1986
- 1986-01-31 JP JP1315986U patent/JPH032769Y2/ja not_active Expired
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7190071B2 (en) | 1999-05-07 | 2007-03-13 | Amkor Technology, Inc. | Semiconductor package and method for fabricating the same |
| US7061120B2 (en) | 1999-05-20 | 2006-06-13 | Amkor Technology, Inc. | Stackable semiconductor package having semiconductor chip within central through hole of substrate |
| USRE40112E1 (en) | 1999-05-20 | 2008-02-26 | Amkor Technology, Inc. | Semiconductor package and method for fabricating the same |
| US6982488B2 (en) | 1999-08-24 | 2006-01-03 | Amkor Technology, Inc. | Semiconductor package and method for fabricating the same |
| US7211900B2 (en) | 1999-08-24 | 2007-05-01 | Amkor Technology, Inc. | Thin semiconductor package including stacked dies |
| US7633144B1 (en) | 2006-05-24 | 2009-12-15 | Amkor Technology, Inc. | Semiconductor package |
| US9466545B1 (en) | 2007-02-21 | 2016-10-11 | Amkor Technology, Inc. | Semiconductor package in package |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH032769Y2 (enExample) | 1991-01-24 |