JPS62124850U - - Google Patents
Info
- Publication number
- JPS62124850U JPS62124850U JP1986013423U JP1342386U JPS62124850U JP S62124850 U JPS62124850 U JP S62124850U JP 1986013423 U JP1986013423 U JP 1986013423U JP 1342386 U JP1342386 U JP 1342386U JP S62124850 U JPS62124850 U JP S62124850U
- Authority
- JP
- Japan
- Prior art keywords
- electric torch
- thin metal
- spark
- tip
- generates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/78268—Discharge electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986013423U JPS62124850U (US06815460-20041109-C00097.png) | 1986-01-30 | 1986-01-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986013423U JPS62124850U (US06815460-20041109-C00097.png) | 1986-01-30 | 1986-01-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62124850U true JPS62124850U (US06815460-20041109-C00097.png) | 1987-08-08 |
Family
ID=30802470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986013423U Pending JPS62124850U (US06815460-20041109-C00097.png) | 1986-01-30 | 1986-01-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62124850U (US06815460-20041109-C00097.png) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5759446B2 (US06815460-20041109-C00097.png) * | 1974-09-20 | 1982-12-15 | Hiroshi Teramachi | |
| JPS58103145A (ja) * | 1981-12-16 | 1983-06-20 | Hitachi Ltd | ボンデイング用ワイヤのボ−ル形成方法 |
| JPS6059532B2 (ja) * | 1978-09-27 | 1985-12-25 | 株式会社日立製作所 | 分光光度計 |
| JPS61194736A (ja) * | 1985-02-25 | 1986-08-29 | Hitachi Ltd | ボンデイング装置及びそれに用いる放熱用電極 |
-
1986
- 1986-01-30 JP JP1986013423U patent/JPS62124850U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5759446B2 (US06815460-20041109-C00097.png) * | 1974-09-20 | 1982-12-15 | Hiroshi Teramachi | |
| JPS6059532B2 (ja) * | 1978-09-27 | 1985-12-25 | 株式会社日立製作所 | 分光光度計 |
| JPS58103145A (ja) * | 1981-12-16 | 1983-06-20 | Hitachi Ltd | ボンデイング用ワイヤのボ−ル形成方法 |
| JPS61194736A (ja) * | 1985-02-25 | 1986-08-29 | Hitachi Ltd | ボンデイング装置及びそれに用いる放熱用電極 |
