JPS62122357U - - Google Patents
Info
- Publication number
- JPS62122357U JPS62122357U JP1986009024U JP902486U JPS62122357U JP S62122357 U JPS62122357 U JP S62122357U JP 1986009024 U JP1986009024 U JP 1986009024U JP 902486 U JP902486 U JP 902486U JP S62122357 U JPS62122357 U JP S62122357U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- bonding
- wiring
- ground side
- semiconductor integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986009024U JPS62122357U (US07122547-20061017-C00273.png) | 1986-01-24 | 1986-01-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986009024U JPS62122357U (US07122547-20061017-C00273.png) | 1986-01-24 | 1986-01-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62122357U true JPS62122357U (US07122547-20061017-C00273.png) | 1987-08-03 |
Family
ID=30793948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986009024U Pending JPS62122357U (US07122547-20061017-C00273.png) | 1986-01-24 | 1986-01-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62122357U (US07122547-20061017-C00273.png) |
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1986
- 1986-01-24 JP JP1986009024U patent/JPS62122357U/ja active Pending
