JPS62122354U - - Google Patents
Info
- Publication number
- JPS62122354U JPS62122354U JP902286U JP902286U JPS62122354U JP S62122354 U JPS62122354 U JP S62122354U JP 902286 U JP902286 U JP 902286U JP 902286 U JP902286 U JP 902286U JP S62122354 U JPS62122354 U JP S62122354U
- Authority
- JP
- Japan
- Prior art keywords
- external lead
- resin
- semiconductor device
- flat
- sealed semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP902286U JPS62122354U (da) | 1986-01-24 | 1986-01-24 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP902286U JPS62122354U (da) | 1986-01-24 | 1986-01-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62122354U true JPS62122354U (da) | 1987-08-03 |
Family
ID=30793944
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP902286U Pending JPS62122354U (da) | 1986-01-24 | 1986-01-24 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62122354U (da) |
-
1986
- 1986-01-24 JP JP902286U patent/JPS62122354U/ja active Pending