JPS62120345U - - Google Patents
Info
- Publication number
- JPS62120345U JPS62120345U JP1986007716U JP771686U JPS62120345U JP S62120345 U JPS62120345 U JP S62120345U JP 1986007716 U JP1986007716 U JP 1986007716U JP 771686 U JP771686 U JP 771686U JP S62120345 U JPS62120345 U JP S62120345U
- Authority
- JP
- Japan
- Prior art keywords
- section
- semiconductor
- opening process
- tank
- heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Weting (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986007716U JPH0128674Y2 (enExample) | 1986-01-24 | 1986-01-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986007716U JPH0128674Y2 (enExample) | 1986-01-24 | 1986-01-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62120345U true JPS62120345U (enExample) | 1987-07-30 |
| JPH0128674Y2 JPH0128674Y2 (enExample) | 1989-08-31 |
Family
ID=30791426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986007716U Expired JPH0128674Y2 (enExample) | 1986-01-24 | 1986-01-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0128674Y2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015109313A (ja) * | 2013-12-03 | 2015-06-11 | 日本サイエンティフィック株式会社 | プラスチックモールドされた半導体集積回路パッケージの開封装置及びプラスチックモールドされた半導体集積回路パッケージの開封方法 |
-
1986
- 1986-01-24 JP JP1986007716U patent/JPH0128674Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015109313A (ja) * | 2013-12-03 | 2015-06-11 | 日本サイエンティフィック株式会社 | プラスチックモールドされた半導体集積回路パッケージの開封装置及びプラスチックモールドされた半導体集積回路パッケージの開封方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0128674Y2 (enExample) | 1989-08-31 |