JPS62120126U - - Google Patents

Info

Publication number
JPS62120126U
JPS62120126U JP836386U JP836386U JPS62120126U JP S62120126 U JPS62120126 U JP S62120126U JP 836386 U JP836386 U JP 836386U JP 836386 U JP836386 U JP 836386U JP S62120126 U JPS62120126 U JP S62120126U
Authority
JP
Japan
Prior art keywords
cooling
heat
radiator
heat dissipation
plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP836386U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP836386U priority Critical patent/JPS62120126U/ja
Publication of JPS62120126U publication Critical patent/JPS62120126U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本考案の一実施例示すもので第1図はサ
ーモモジユールの構成略図、第2図は本考案の構
成を示す斜視図である。 1……直流電源、2……N型半導体、3……P
型半導体、4……熱吸収版、5……熱放出版、6
,7……断熱版、8……冷却側ラジエーター、9
……熱放出側ラジエーター、10……ブローワー
、11……換気フアン、12,13……ハウジン
グ、14……電気伝導体。
The drawings show one embodiment of the present invention, and FIG. 1 is a schematic diagram of the configuration of a thermomodule, and FIG. 2 is a perspective view showing the configuration of the present invention. 1...DC power supply, 2...N-type semiconductor, 3...P
type semiconductor, 4... heat absorption plate, 5... heat dissipation plate, 6
, 7...Insulation plate, 8...Cooling side radiator, 9
... Heat release side radiator, 10 ... Blower, 11 ... Ventilation fan, 12, 13 ... Housing, 14 ... Electric conductor.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 直流電源1に依り加熱、冷却が自由にできるN
,P半導体2,3を利用して、一方に熱吸収版4
を、又他方には熱放出版5を各々断熱版6,7を
介して連設し、更に各々アルミ等の放熱版による
ラジエーター8,9を設け、冷却側ラジエーター
8のブローワー10で冷却風を送風し、熱放出側
ラジエーター9には換気フアン11を設け、各々
ハウジング12,13で隔離するようにした冷風
器。
Heating and cooling can be done freely using DC power supply 1.
, using P semiconductors 2 and 3, and a heat absorbing plate 4 on one side.
On the other hand, a heat dissipation plate 5 is connected to each other via heat insulating plates 6 and 7, and radiators 8 and 9 each made of heat dissipation plates such as aluminum are provided, and a blower 10 of the cooling side radiator 8 blows cooling air. This air cooler is provided with a ventilation fan 11 on a radiator 9 on the heat release side and isolated by housings 12 and 13, respectively.
JP836386U 1986-01-23 1986-01-23 Pending JPS62120126U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP836386U JPS62120126U (en) 1986-01-23 1986-01-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP836386U JPS62120126U (en) 1986-01-23 1986-01-23

Publications (1)

Publication Number Publication Date
JPS62120126U true JPS62120126U (en) 1987-07-30

Family

ID=30792668

Family Applications (1)

Application Number Title Priority Date Filing Date
JP836386U Pending JPS62120126U (en) 1986-01-23 1986-01-23

Country Status (1)

Country Link
JP (1) JPS62120126U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101012641B1 (en) * 2008-03-05 2011-02-09 대우조선해양 주식회사 Boil-off gas cooling system and method of lng carrier

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4034527Y1 (en) * 1964-04-09 1965-12-03

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4034527Y1 (en) * 1964-04-09 1965-12-03

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101012641B1 (en) * 2008-03-05 2011-02-09 대우조선해양 주식회사 Boil-off gas cooling system and method of lng carrier

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