JPS62118439U - - Google Patents
Info
- Publication number
- JPS62118439U JPS62118439U JP532286U JP532286U JPS62118439U JP S62118439 U JPS62118439 U JP S62118439U JP 532286 U JP532286 U JP 532286U JP 532286 U JP532286 U JP 532286U JP S62118439 U JPS62118439 U JP S62118439U
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- conductive path
- metal substrates
- integrated circuit
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP532286U JPS62118439U (US20090158533A1-20090625-C00001.png) | 1986-01-17 | 1986-01-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP532286U JPS62118439U (US20090158533A1-20090625-C00001.png) | 1986-01-17 | 1986-01-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62118439U true JPS62118439U (US20090158533A1-20090625-C00001.png) | 1987-07-28 |
Family
ID=30786797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP532286U Pending JPS62118439U (US20090158533A1-20090625-C00001.png) | 1986-01-17 | 1986-01-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62118439U (US20090158533A1-20090625-C00001.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03184384A (ja) * | 1989-12-13 | 1991-08-12 | Nec Corp | 光モジュール用サブマウント及びその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5792852A (en) * | 1980-12-01 | 1982-06-09 | Sanyo Electric Co Ltd | Hybrid integrated circuit |
-
1986
- 1986-01-17 JP JP532286U patent/JPS62118439U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5792852A (en) * | 1980-12-01 | 1982-06-09 | Sanyo Electric Co Ltd | Hybrid integrated circuit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03184384A (ja) * | 1989-12-13 | 1991-08-12 | Nec Corp | 光モジュール用サブマウント及びその製造方法 |
