JPS62116661A - Polyamide resin composition - Google Patents

Polyamide resin composition

Info

Publication number
JPS62116661A
JPS62116661A JP25511485A JP25511485A JPS62116661A JP S62116661 A JPS62116661 A JP S62116661A JP 25511485 A JP25511485 A JP 25511485A JP 25511485 A JP25511485 A JP 25511485A JP S62116661 A JPS62116661 A JP S62116661A
Authority
JP
Japan
Prior art keywords
polyamide resin
polyamide
compsn
nylon
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP25511485A
Other languages
Japanese (ja)
Inventor
Hiroaki Kamei
亀井 裕晃
Hiromi Morimoto
森本 宏海
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DAISERU HIYURUSU KK
Daicel Evonik Ltd
Original Assignee
DAISERU HIYURUSU KK
Daicel Huels Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DAISERU HIYURUSU KK, Daicel Huels Ltd filed Critical DAISERU HIYURUSU KK
Priority to JP25511485A priority Critical patent/JPS62116661A/en
Publication of JPS62116661A publication Critical patent/JPS62116661A/en
Pending legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE:To provide the titled compsn. having good injection moldability and excellent mold release characteristics and suitable for use as a molding material giving thin-wall moldings having a complicated shape, by blending a polyamide resin with a specified polyalkylene ether glycol. CONSTITUTION:The titled compsn. is obtd. by blending 100pts.wt. polyamide resin (e.g., nylon 12, etc.) with 0.01-5pts.wt. polyalkylene ether glycol having an average MW of 300-3,000 (e.g., polyethylene glycol, etc.). The compsn. has good injection moldability, particularly excellent mold release characteristics without detriment to mechanical properties inherent to polyamide. The compsn. can be used as a molding material for the production of conventional moldings as well as thin-wall moldings having a complicated shape, such as clocks, cassette decks, video decks, printers, precision gears, etc.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は安価かつ簡便に製造可能で、しかもポリアミド
本来の優れた機械的物性を損うことなく、良好な成形性
と離型性を有するポリアミド樹脂組成物に関するもので
ある。
Detailed Description of the Invention (Field of Industrial Application) The present invention can be manufactured easily and inexpensively, and has good moldability and mold release properties without impairing the excellent mechanical properties inherent to polyamide. The present invention relates to a polyamide resin composition.

(従来の技術と問題点) 従来ポリアミドは機械的、化学的性質に優れているため
、エンジニアリングプラスチックとして種々の精密成形
品に使用されている。しかし、成形品の厚みが薄く、複
雑な形状を有する例えば時計ギヤーの様な成形品を成形
する場合、離型性に大きな問題がある。
(Prior Art and Problems) Polyamide has conventionally been used as an engineering plastic in various precision molded products because of its excellent mechanical and chemical properties. However, when molding a molded product that is thin and has a complicated shape, such as a watch gear, there is a major problem in mold releasability.

離型性を向上させる為に冷却時間を長くする事は成形効
率が低下することになり、又一般に使用されるシリコン
系離型剤等をキャビティー内に塗布する方法は、成形を
繰り返す間に離型効果が低下し、成形バラツキを生じ、
製品の品質のバラツキにつながる。
Prolonging the cooling time to improve mold releasability will reduce molding efficiency, and the commonly used method of applying silicone-based mold release agents, etc. inside the cavity, The mold release effect decreases, causing molding variations,
This leads to variations in product quality.

他方、離型性を改良する目的で、シリコンオイル又は脂
肪酸及び脂肪酸エステル等をポリアミドにあらかじめ添
加、混練する方法も知られているが、これらの添加剤は
比較的分子…が小さく、又ポリアミドとの相容性が悪い
為、ウェルド部に滲出しやすくウェルド強度を低下せし
め、成形品の衝撃強度、引張強度を低下せしめる問題が
ある。
On the other hand, it is also known to add silicone oil or fatty acids and fatty acid esters to polyamide in advance and knead them for the purpose of improving mold release properties, but these additives have relatively small molecules and do not interact with polyamide. Because of their poor compatibility, they tend to leak into the weld area, reducing weld strength and reducing the impact strength and tensile strength of molded products.

そこで本発明は、上述した様に薄肉かつ形状が複雑な成
形品の機械的強度を低下させずに離型性を改良する為(
転)鋭意検討した結果、ポリアミド樹脂と限られた平均
分子間を有するポリアルキレンエーテルグリコールとの
組合せにより、h 、id 要求性能を満足する割出成
形用ポリアミド樹脂組成物を作り17る事を児出し本発
明に到達した。
Therefore, the present invention aims to improve the mold releasability of thin-walled and complex-shaped molded products without reducing their mechanical strength (as described above).
As a result of extensive studies, we have found that a polyamide resin composition for index molding that satisfies the required performance of h and id can be created by combining a polyamide resin and polyalkylene ether glycol having a limited average molecular distance. As a result, we have arrived at the present invention.

(問題貞を解決するだめの手段) 即ち本発明はポリアミド樹脂100手1’1部に平均分
子口が300以上50oO以下であるポリアルキレンエ
ーテルグリコールの一種又は二種以上を001重む1部
以−[5重化部以1−配合されてなるポリアミド樹脂組
成物である。
(Means for Solving the Problem) That is, the present invention is to add one or more polyalkylene ether glycols having an average molecular weight of 300 to 50oO to 1 part of 100 parts of polyamide resin. - A polyamide resin composition containing 5 or more parts.

本発明におけるポリアミドとはナイロン6、ナイロン6
.6、ナイロン6.10、ナイ〔]ラン。
Polyamide in the present invention is nylon 6, nylon 6
.. 6, nylon 6.10, nylon.

12.1イロン11、ナイロン12、又は上記ナイロン
のモノマーを主成分とする共重合体及びこれら重合体の
混合物が挙げられる。また共重合体としてはポリテトラ
ヒドロフラン又はポリテトラヒドロフランの両末端基を
アミノ基又はカルホヤシル塁変成されたものなどの、ソ
フトログメントとの共重合体であるポリエーテルエステ
ルアミド又はポリニーフルアミドなどのポリアミドエラ
ストマーがある。 望ましくは吸湿による物性変化の小
さいナイロン11、ナイロン12、あるいはこれらの七
ツアーを主成分としたポリアミドが好適に用いられる。
12.1 Ylon 11, Nylon 12, copolymers containing the above-mentioned nylon monomers as main components, and mixtures of these polymers. Examples of copolymers include polyamides such as polyetheresteramide or polynyfluamide, which are copolymers with soft logments, such as polytetrahydrofuran or polytetrahydrofuran in which both terminal groups have been modified with amino groups or carfoyacyl groups. There is an elastomer. Preferably, nylon 11, nylon 12, or polyamide containing these heptads as a main component, which have little change in physical properties due to moisture absorption, are preferably used.

 本発明において用いられるポリフルキレンエーテルグ
リコールとは、アルキル基の炭素数が2以上10以−ト
でありポリエチレングリコール、ポリプロピレングリコ
ール、ボリアトラメチレンエーテルグリロールあるいは
これらの混合物が好適に使用する事が出来る。又これら
ポリアルキレングリコールの平均分子口は、300以上
5000以下であり好ましくは500以上2000以F
である。分子間が200以下であると離型性は改善され
るが、成形品のウェルド強度、衝撃強度を低下させる恐
れがある。平均分子口が5000を越えると離型性改良
効果が低下する。
The polyfulkylene ether glycol used in the present invention has an alkyl group having 2 or more carbon atoms and 10 or more carbon atoms, and polyethylene glycol, polypropylene glycol, boriatramethylene ether glycol, or a mixture thereof can be suitably used. . The average molecular weight of these polyalkylene glycols is 300 or more and 5000 or less, preferably 500 or more and 2000 or less F.
It is. If the molecular weight is 200 or less, the mold releasability will be improved, but there is a risk that the weld strength and impact strength of the molded product will be reduced. When the average molecular weight exceeds 5,000, the effect of improving mold releasability decreases.

これらポリアルキレンエーテルグリコールを上記ポリア
ミドに配合するに当っては1種又は2種以上の混合系で
も良く、その配合mはポリアミド樹脂100重量部に対
し0.011重部以h5重J部以下であり、好ましくは
011重部以上2市桁部以下である。その配合量が0.
011重部より少ないと離型性の改善がなされず、5重
世部より多いと、離型性は改善されるが、成型品のウェ
ルド強度、衝撃強度を低下させる。
When blending these polyalkylene ether glycols into the above-mentioned polyamide, one type or a mixed system of two or more types may be used. It is preferably 011 parts or more and 2 parts or less. Its blending amount is 0.
If the amount is less than 0.011 parts, the mold releasability will not be improved, and if it is more than 5 parts, the mold releasability will be improved, but the weld strength and impact strength of the molded product will be reduced.

また上記ポリアミド樹脂組成物には、常用の樹脂添加物
例えば酸化防止剤、可塑剤、紫外線吸収剤、核剤等を配
合づる事が出来る。
Further, commonly used resin additives such as antioxidants, plasticizers, ultraviolet absorbers, nucleating agents, etc. can be added to the polyamide resin composition.

(発明の効果) 本発明のポリアミド樹脂組成物は、ポリアミド本来の機
械物性を損う$なく良好な射出成形性を有しており、特
に離型性において優れている。通常一般の成形品は言う
までもなく、時計、カセットデツキ、ビデオデツキ、プ
リンター等の精密ギレー、バ1−ミン1−ンシャトルコ
ック等の薄肉かつ複雑な形状を有する成形品の成形用飼
料として好適に用いる事が出きる。
(Effects of the Invention) The polyamide resin composition of the present invention has good injection moldability without impairing the mechanical properties inherent to polyamide, and is particularly excellent in mold releasability. Suitable for use as molding feed for molded products with thin walls and complex shapes, such as watches, cassette decks, video decks, precision gills for printers, printer shuttlecocks, etc., as well as general molded products. Things can happen.

(実施例) 以下に本発明を実施例をもって説明づるが、本発明はこ
れらの実施例によって限定されるものではない。
(Examples) The present invention will be explained below with reference to Examples, but the present invention is not limited by these Examples.

実施例1〜2 可塑化ナイロン12(ダイはルヒュルス社製:ダイアミ
l:I−1724ン 100重X′li部に平均分子l
Pt400のポリエチレングリコールを混合し、30.
φ二軸押出機で程練しペレット化した。
Examples 1 to 2 Plasticized nylon 12 (Die manufactured by Ruhuls: Diamil: I-1724) Average molecular l in 100 weight X'li part
Mix Pt400 polyethylene glycol, 30.
The mixture was kneaded and pelletized using a φ twin-screw extruder.

このペレットを用いて直径が10 mrn厚みが7 m
mである時計1゛17−の成形を行ない、離型性の良否
を判定した。
Using this pellet, the diameter is 10 mrn and the thickness is 7 m.
A watch 1-17-m was molded, and the quality of the mold releasability was determined.

離型性が悪い場合はギV−に反りを生ずる。If the mold releasability is poor, warpage will occur in the gear V-.

他方厚み1MのJ l5K6301.3月形ダンベルの
形状をイiするウェルド形成用金をで試験片を射出成形
し、ウェルド強度保持率の測定を行なった。
On the other hand, a test piece was injection molded using a weld-forming gold having the shape of a J15K6301.3-shaped dumbbell having a thickness of 1M, and the weld strength retention rate was measured.

結果を表−1に示ず。The results are not shown in Table-1.

実施例3 実施例1のポリエチレングリコールの平均分子53が1
500である事以外、実施例1と同様にして試験を行っ
た。
Example 3 The average molecule 53 of the polyethylene glycol of Example 1 is 1
The test was conducted in the same manner as in Example 1, except that the test temperature was 500.

結果を表−1に示す。The results are shown in Table-1.

実施例4 実施例1のポリエチレングリコールの代りに、平均分子
間850のボリアトラメチレンエーテルグリロール(保
土谷化学社製: p T G 1oo)を使用する1以
外、実施例1と同様にして試験を行った。
Example 4 Test was carried out in the same manner as in Example 1 except for using boriatramethylene ether glycol (manufactured by Hodogaya Chemical Co., Ltd.: p T G 1oo) with an average molecular weight of 850 instead of the polyethylene glycol in Example 1. I did it.

結果を表−1に示す。The results are shown in Table-1.

実施例5 実施例4のポリテトラメブレングリコールの平均分子宙
が2000である1以外、実施例4と同様にして試験を
行った。
Example 5 A test was conducted in the same manner as in Example 4, except that the average molecular weight of polytetrameblene glycol in Example 4 was 2000.

結果を表−1に示ず。The results are not shown in Table-1.

実施例6 実施例3のポリアミド樹脂が無可塑ポリアミド(ダイセ
ルヒュルス社製:L1600)とポリニーデルエステル
アミド(ダイセルヒュルス社製:PAE  E62MS
−3)とのブレンド、物である1以外、実施例3と同様
にして試験を行った。
Example 6 The polyamide resin of Example 3 was composed of unplasticized polyamide (manufactured by Daicel Huls: L1600) and polyneedle ester amide (manufactured by Daicel Huls: PAE E62MS).
The test was conducted in the same manner as in Example 3, except for 1, which was a blend with -3).

結果を表−1に示す。The results are shown in Table-1.

比較例1 実施例1の可塑化ナイロン12のみで実施例1と同様に
して試験を行った。
Comparative Example 1 A test was conducted in the same manner as in Example 1 using only the plasticized nylon 12 of Example 1.

結果は表−1に示す。The results are shown in Table-1.

比較例2 実施例1のポリエチレングリコールの平均分子坦が20
0ある1以外、実施例1と同様にして試験を行なった。
Comparative Example 2 The average molecular weight of the polyethylene glycol of Example 1 was 20
The test was conducted in the same manner as in Example 1, except for 0 and 1.

結果は表−1に示す。The results are shown in Table-1.

比較例3 実施例1のポリエチレングリコールの平均分子端が60
00である1以外、実施例1と同様にして試験を行った
Comparative Example 3 The average molecular end of the polyethylene glycol of Example 1 was 60
The test was conducted in the same manner as in Example 1 except for 1 which is 00.

結果は表−1に示す。The results are shown in Table-1.

比較例4 実施例1のポリエチレングリコールの代りにポリジメチ
ルシロキナン(30000cs)を使用する1以同様の
試験を行った。
Comparative Example 4 A test similar to Example 1 was conducted using polydimethylsilokinane (30,000 cs) instead of polyethylene glycol in Example 1.

結果は表−1に示す。The results are shown in Table-1.

Claims (1)

【特許請求の範囲】[Claims] ポリアミド樹脂100重量部に平均分子間が300以上
5000以下であるポリアルキレンエーテルグリコール
の一種又は二種以上を0.01重量部以上5重量部以下
配合されてなるポリアミド樹脂組成物。
A polyamide resin composition comprising 0.01 parts by weight or more and 5 parts by weight or less of one or more polyalkylene ether glycols having an average molecular weight of 300 or more and 5,000 or less in 100 parts by weight of a polyamide resin.
JP25511485A 1985-11-15 1985-11-15 Polyamide resin composition Pending JPS62116661A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25511485A JPS62116661A (en) 1985-11-15 1985-11-15 Polyamide resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25511485A JPS62116661A (en) 1985-11-15 1985-11-15 Polyamide resin composition

Publications (1)

Publication Number Publication Date
JPS62116661A true JPS62116661A (en) 1987-05-28

Family

ID=17274293

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25511485A Pending JPS62116661A (en) 1985-11-15 1985-11-15 Polyamide resin composition

Country Status (1)

Country Link
JP (1) JPS62116661A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001123079A (en) * 1999-10-28 2001-05-08 Daicel Huels Ltd Resin composition having improved low-temperature impact strength
WO2002028943A1 (en) * 2000-10-04 2002-04-11 Asahi Kasei Kabushiki Kaisha Flame-retardant reinforced polyamide resin composition
US6800677B2 (en) 2000-10-04 2004-10-05 Asahi Kasei Kabushiki Kaisha Flame retardant reinforced polyamide resin composition
JP2007143530A (en) * 2005-11-30 2007-06-14 Iseki & Co Ltd Unloading device for combine harvester
US20210269620A1 (en) * 2018-10-24 2021-09-02 Hewlett-Packard Development Company, L.P. Three-dimensional printing

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4916746A (en) * 1972-06-02 1974-02-14
JPS51144453A (en) * 1975-06-09 1976-12-11 Asahi Chem Ind Co Ltd Preparation of polyamide resin chips
JPS5991149A (en) * 1982-10-08 1984-05-25 バイエル・アクチエンゲゼルシヤフト Polyamide molding composition
JPS61188458A (en) * 1985-02-15 1986-08-22 Asahi Chem Ind Co Ltd Nylon 46 resin composition for molding
JPS61246246A (en) * 1985-04-24 1986-11-01 Teijin Ltd Antistatic thermoplastic resin composition

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4916746A (en) * 1972-06-02 1974-02-14
JPS51144453A (en) * 1975-06-09 1976-12-11 Asahi Chem Ind Co Ltd Preparation of polyamide resin chips
JPS5991149A (en) * 1982-10-08 1984-05-25 バイエル・アクチエンゲゼルシヤフト Polyamide molding composition
JPS61188458A (en) * 1985-02-15 1986-08-22 Asahi Chem Ind Co Ltd Nylon 46 resin composition for molding
JPS61246246A (en) * 1985-04-24 1986-11-01 Teijin Ltd Antistatic thermoplastic resin composition

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001123079A (en) * 1999-10-28 2001-05-08 Daicel Huels Ltd Resin composition having improved low-temperature impact strength
WO2002028943A1 (en) * 2000-10-04 2002-04-11 Asahi Kasei Kabushiki Kaisha Flame-retardant reinforced polyamide resin composition
US6800677B2 (en) 2000-10-04 2004-10-05 Asahi Kasei Kabushiki Kaisha Flame retardant reinforced polyamide resin composition
JP2007143530A (en) * 2005-11-30 2007-06-14 Iseki & Co Ltd Unloading device for combine harvester
US20210269620A1 (en) * 2018-10-24 2021-09-02 Hewlett-Packard Development Company, L.P. Three-dimensional printing
US11780988B2 (en) 2018-10-24 2023-10-10 Hewlett-Packard Development Company, L.P. Three-dimensional printing

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