JPS62116579U - - Google Patents
Info
- Publication number
- JPS62116579U JPS62116579U JP428786U JP428786U JPS62116579U JP S62116579 U JPS62116579 U JP S62116579U JP 428786 U JP428786 U JP 428786U JP 428786 U JP428786 U JP 428786U JP S62116579 U JPS62116579 U JP S62116579U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- circuit
- component
- package type
- flat package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000007598 dipping method Methods 0.000 claims 1
- 238000000605 extraction Methods 0.000 claims 1
- 239000003779 heat-resistant material Substances 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP428786U JPS62116579U (cs) | 1986-01-16 | 1986-01-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP428786U JPS62116579U (cs) | 1986-01-16 | 1986-01-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62116579U true JPS62116579U (cs) | 1987-07-24 |
Family
ID=30784816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP428786U Pending JPS62116579U (cs) | 1986-01-16 | 1986-01-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62116579U (cs) |
-
1986
- 1986-01-16 JP JP428786U patent/JPS62116579U/ja active Pending