JPS62116555U - - Google Patents
Info
- Publication number
- JPS62116555U JPS62116555U JP1986002697U JP269786U JPS62116555U JP S62116555 U JPS62116555 U JP S62116555U JP 1986002697 U JP1986002697 U JP 1986002697U JP 269786 U JP269786 U JP 269786U JP S62116555 U JPS62116555 U JP S62116555U
- Authority
- JP
- Japan
- Prior art keywords
- board
- integrated circuit
- area
- adhesive sheet
- assembly structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 4
- 239000011551 heat transfer agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986002697U JPS62116555U (enrdf_load_stackoverflow) | 1986-01-13 | 1986-01-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986002697U JPS62116555U (enrdf_load_stackoverflow) | 1986-01-13 | 1986-01-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62116555U true JPS62116555U (enrdf_load_stackoverflow) | 1987-07-24 |
Family
ID=30781778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986002697U Pending JPS62116555U (enrdf_load_stackoverflow) | 1986-01-13 | 1986-01-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62116555U (enrdf_load_stackoverflow) |
-
1986
- 1986-01-13 JP JP1986002697U patent/JPS62116555U/ja active Pending