JPS6211570U - - Google Patents
Info
- Publication number
- JPS6211570U JPS6211570U JP1985102754U JP10275485U JPS6211570U JP S6211570 U JPS6211570 U JP S6211570U JP 1985102754 U JP1985102754 U JP 1985102754U JP 10275485 U JP10275485 U JP 10275485U JP S6211570 U JPS6211570 U JP S6211570U
- Authority
- JP
- Japan
- Prior art keywords
- wire insertion
- insertion hole
- tweezers
- guide groove
- provided around
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000037431 insertion Effects 0.000 claims description 8
- 238000003780 insertion Methods 0.000 claims description 8
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
Description
第１図ａ，ｂは本考案の一実施例によるピンセ
ツトの先端拡大側面図および断面図、第２図は本
考案の一実施例によるピンセツトの使用例を示す
斜視図である。第３図は従来のピンセツトの例を
示す斜視図である。 １……ピンセツト本体、２……ワイヤ挿通孔、
２ａ……ワイヤ差込口、３……ワイヤ誘導溝、３
ａ……ワイヤ誘導溝底部、４……ボンデイングワ
イヤー。
ツトの先端拡大側面図および断面図、第２図は本
考案の一実施例によるピンセツトの使用例を示す
斜視図である。第３図は従来のピンセツトの例を
示す斜視図である。 １……ピンセツト本体、２……ワイヤ挿通孔、
２ａ……ワイヤ差込口、３……ワイヤ誘導溝、３
ａ……ワイヤ誘導溝底部、４……ボンデイングワ
イヤー。
Claims (1)
- ピンセツトの２本の保持部のうち片側の先端の
平担部にワイヤー挿通孔を設け、該挿通孔のワイ
ヤ差込口側の周囲に誘導溝を、ワイヤ挿通孔の周
囲を取囲みその底部をワイヤ差込口に向け傾斜さ
せて成形したことを特徴とするピンセツト。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985102754U JPS6211570U (ja) | 1985-07-04 | 1985-07-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985102754U JPS6211570U (ja) | 1985-07-04 | 1985-07-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6211570U true JPS6211570U (ja) | 1987-01-24 |
Family
ID=30974683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985102754U Pending JPS6211570U (ja) | 1985-07-04 | 1985-07-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6211570U (ja) |
-
1985
- 1985-07-04 JP JP1985102754U patent/JPS6211570U/ja active Pending