JPS62114809A - Cutting process for hollow material - Google Patents

Abstract

PURPOSE:To produce internal stress in a cut part as well as to avoid getting any deformation and breakdown at the time of cutting a hollow material, by installing a pressure medium feed passage to both inner and outer circumferential surfaces of the hollow material and an O-ring in a cutting device, and feeding this hollow material with a high pressure medium. CONSTITUTION:In a cutting process for a hollow material 23, after the material 23 is set first, and a pressure medium of high pressure P is fed out of each of pressure medium feed passages 28, 32 and 33 simultaneously. With this operation, uniform fluid pressure is added to both inner and outer circumferential surface between O-rings 25, 25 and 35, 35 in the material 23. And, the material 23 is cut at an intermediate part between these O-rings 25 and 25 (35 and 35) as internal stress is produced in both these inner and outer circumferential surface. According to this process, since no more than necessary internal stress alone is produced in a cut part of the material 23, it is in no case deformed and broken even in case it is thin or fragile and, what is more, chips and the like are not produced at all, thus a favorable cutting surface and a significant improvement in machining control are secured.

Description

Detailed Description of the Invention [Industrial Application Field] The present invention relates to a hollow material cutting method for cutting a hollow material such as a cylindrical material, and particularly relates to a method for cutting a hollow material such as a cylindrical material. Concerning methods for cutting materials.

[Prior Art] This type of cutting method is disclosed in Japanese Unexamined Patent Publication No. 50-7227.
The technique described in Publication No. 9 or the technique described in Japanese Patent Publication No. 48-23583 is known.

The technique of recording the 4th edict 50-72279 is.

As shown in FIG. 4, the outer periphery of the cut part of a round bar l made of a brittle material is formed into an airtight part 2, and hydraulic pressure or the like is applied as lateral pressure to this airtight part 2 from a pressurizing hole 3. This is a method of cutting 1.

In addition, the technology described in Japanese Patent Publication No. 48-23583 is
As shown in Figure 6, ・Hollow material (work part) 4
The mandrel 5 is inserted into the hollow part, and the passage 6 provided at the axial center of the mandrel 5 is filled with fluid such as oil, and pressure is applied to the fluid by a ram or piston 7, thereby creating a radially provided passage 6a. This is a method of cutting the hollow material 4 by applying fluid pressure to the inner wall surface of the hollow material 4 through the wafer and extruding a part of the cut portion outward as a scrap piece 8.

Note that 9 indicates the Gui block 9a.

The die structure consists of 9b, to and tt are blades, and 12 is an annular chamber.

[Problems to be Solved by the Invention] The technique described in JP-A-50-72279 is a method for cutting using only lateral pressure, so when applied to hollow materials made of thin or soft materials, deformation occurs. This resulted in fracture due to buckling and buckling, making it difficult to cut.

In addition, the technique described in Japanese Patent Publication No. 48-23583 is a method of cutting by removing the cut portion of the hollow material using hydrostatic pressure, so it has the disadvantage of generating cut pieces, and it also cuts the hollow material made of brittle material. When this method is applied to, there is a big problem that the cut surface cannot be cut smoothly and a good cut surface cannot be obtained.

The present invention has been made in view of the above-mentioned problems of the prior art, and is a hollow material that can obtain a good cut surface without buckling, breaking, or cutting pieces when cutting. The purpose of this paper is to provide a cutting method for cutting.

[Means and effects for solving the problem] The present invention applies a predetermined fluid pressure to the inner peripheral surface and outer peripheral surface of the part to be cut in a hollow material to generate internal stress in the part to be cut. It is for cutting.

[Example] Hereinafter, one example of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a side sectional view showing the configuration of a cutting section fi20 for carrying out the hollow material cutting method according to the present invention. In the figure, 21 indicates a pressure vessel main body whose axial center is hollow, and the inner diameter of the hollow portion 22 is set to be an appropriate amount larger than the outer diameter of the hollow material 23 that is the object to be cut. . Then, on the inner peripheral surface of the pressure vessel main body 21, a first spacing ring (outer surface side spacing ring) 24, a first spacing ring 2
4 O-rings (sealing members) 25.
25 and a pair of retaining rings 26.27 for retaining the O-ring 25.25 and the first spacing ring 24 are fitted. A pair of retainers, rings 26 and 27 have flange portions 2
6a, 27a are provided, and each flange portion 26a,
27a and the retaining ring 2 via the fixing screws 50 and 51.
6°27 is fixed to the pressure vessel main body 21. A pressure medium supply passage 28 extends through the pressure vessel main body 21 in a direction perpendicular to its axial direction, and a pressure medium supply port 29 is formed on the outer surface side. first spacing ring 2
A hole 30 communicating with the pressure medium supply path 28 is provided in the pressure medium supply path 28 . Hollow material 2 through hole 30
It is set to be applied to the outer surface of No. 3. The outer circumferential surface of the hollow material 23 inserted into the axial center of the retaining ring 26.27 is tightly joined to the inner circumferential surface of the O-ring 25.25 which is maintained at an appropriate interval, and the space between the O-rings 25.25 is The space is set to be a sealed chamber. As shown in FIGS. 1 and 2, on the inner circumferential surface of the first spacing ring 24, a pressure medium providing groove 31 is formed in the radial direction, the groove width being the same as the diameter of the hole 30, and communicating with the hole 30. It is shaped all around the circumference (circumferential direction).

Note that since there is an appropriate gap between the inner circumferential surface of the first spacing ring 24 and the outer circumferential surface of the hollow material 23, this gap becomes a pressure medium applying space, so that the pressure medium applying groove 31 is It is also possible to have a configuration in which no provision is made.

Inside the hollow shaft center of the retaining ring 26.27, there is an inner pressure medium supply member 34 having a pressure medium supply passage 32.33 for applying pressure medium to the inner peripheral surface of the hollow material 23, which is the object to be cut. It has interior decoration. Inner pressure medium supply member 3
4 is composed of a head 34a that is joined (does not need to be joined) to the inner circumferential surface of the hollow material 23, and a main body 34b that is formed to have a smaller diameter than the head 34a. 3
On the outer peripheral surface of 4a, there are O-rings 35.35 arranged at appropriate intervals, a second spacing ring (inner-side spacing ring) 36 disposed between the O-rings 35.35, and a holding cylinder 3.
7 is fitted. Each O-ring 35.35 is set to be in close contact with the inner peripheral surface of the hollow material 23, and the inside of the gap between each O-ring 35.35 is set to form a sealed chamber. The O-ring 35.35 and the second spacing ring 36 are the O-rings 25, 25.

The holes 38 for applying pressure medium in the second spacing ring 36 are arranged at positions corresponding to the first spacing ring 24 , and the holes 38 for applying pressure medium in the second spacing ring 36 are located at the positions corresponding to the holes 28 in the first spacing ring 24 .
It is set to match the line. Further, the hole 38 is communicated with the pressure medium supply path 33, and the outer peripheral surface of the second spacing ring 36 is provided with a pressure medium similar to that of the first spacing ring 24, as shown in FIG. A groove 39 is formed. Note that, similarly to the first spacing ring 24, this groove 39 does not need to be formed.

Next, a method of cutting the hollow material 23 using the device 20 will be described.

First, the hollow material 23 is set at a predetermined position within the apparatus 20 as shown in FIG.

Next, the pressure medium (fluid) of high pressure P is simultaneously supplied from the pressure medium supply path 2B, 32.33. As a result, high-pressure pressure medium is pumped into the sealed chamber between the O-rings 25.25 and 35.35 and into the pressure-medium application groove 31.39, and the outer periphery between the O-rings 25.25 and 35.35 in the hollow material 23 An equal fluid pressure P is applied to the surface and the inner peripheral surface as shown in FIG. Due to the addition of this high-pressure fluid, internal stress is generated on the outer circumferential surface and inner circumferential surface of the hollow material 23 according to a distribution curve 40 as shown in FIG. Cut at the middle position between (35°35).

If you want to cut at an accurate position, that is, if you want to improve the precision of the cutting position, you can make an indentation on the outer circumferential surface of the hollow material 23 at the desired cutting position using a diamond indenter (not shown) or the like.

When the hollow material 23 was cut by the method of the present embodiment, when the object to be cut was optical glass, the diameter was 600 to 1000.
Cutting was possible with a fluid pressure of kg/cm2. or,
Regarding the cutting pressure, even when the thickness of the hollow material 23 was changed, there was no significant difference. In addition, in the above method, only the internal stress necessary for cutting is generated in the cut portion of the hollow material 23, so even when this method is applied to thin or brittle materials, deformation or destruction may occur. It can be cut without any trouble. Furthermore, according to the above method, since the hollow material 23 is cut by cracking at the position where the internal stress is greatest, no chips or the like are generated, resulting in a good cut surface and improved processing control. In addition, in the above embodiment, a method for cutting the cylindrical hollow material 23 has been described, but the cross-sectional shape of the hollow material 23 is not limited to this, and may be triangular, square, or other shapes, for example. Of course, it can also be cut in the same way.

[Effects of the Invention] As described above, according to the present invention, since fluid pressure is applied to the inner and outer circumferential surfaces of the part to be cut in a hollow material to cut it, thin or brittle materials can be cut easily. Even when the cutting surface is cut, it can be cut with a good cutting surface without causing deformation or destruction, and it can be cut without generating chips.

[Brief explanation of drawings]

FIG. 1 is a side sectional view showing an embodiment of an apparatus for carrying out the method according to the present invention, FIG. 2 is a front sectional view of the main part of FIG. 1,
Fig. 3 is an explanatory diagram showing the state of stress distribution at the cut section; Fig. 4;
FIGS. 5 and 6 are explanatory diagrams of the prior art. 23...Hollow material 25.35...0 ring 28.32.33...Pressure medium supply path Patent applicant
Olympus Optical Industry Co., Ltd. = C Figure 3 Procedural Amendment (Voluntary) January 29, 1985 No. 1. L. ,~ Michibe Uga, Commissioner of the Patent Office1, Indication of s Patent Application No. 253392 of 19852, Name of the invention Method for cutting hollow materials3, Relationship with the case of the person making the amendment Patent application Person Address: 2-43-2-5 Hatagaya, Shibuya-ku, Tokyo Date of amendment order
, 7. Contents of the amendment (11 "Blade" written in the 15th line of the 2nd page of the specification to the 16th line of the same page is amended to be "blade". ・2) The 19th line of the 2nd page of the specification Insert "from the outer periphery" after "in" in . (3) “Kamiminamare” written on page 3, line 1 O of the specification is amended to “Kamiminare J”. ・14 “Pressure medium (fluid)” written on page 7, line 12 of the specification " is corrected to "pressure medium (fluid)." .

Claims (1)

[Claims] (1) In a method of cutting a hollow material, a predetermined fluid pressure is applied to the inner and outer circumferential surfaces of the part to be cut in the hollow material to generate internal stress in the part to be cut. Method.