JPS62114445U - - Google Patents

Info

Publication number
JPS62114445U
JPS62114445U JP206286U JP206286U JPS62114445U JP S62114445 U JPS62114445 U JP S62114445U JP 206286 U JP206286 U JP 206286U JP 206286 U JP206286 U JP 206286U JP S62114445 U JPS62114445 U JP S62114445U
Authority
JP
Japan
Prior art keywords
lead frame
grooves along
outer frame
frame
box
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP206286U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP206286U priority Critical patent/JPS62114445U/ja
Publication of JPS62114445U publication Critical patent/JPS62114445U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Packaging Frangible Articles (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の第1の実施例説明図、第2図
は同第2の実施例説明図、第3図は同第3の実施
例説明図、第4図は従来例を説明する斜視概要部
である。 1……外枠、1a……上板、1b……底板、2
……溝、2a……溝嵌合部、3……側板、4……
溝付板、5,5a……案内溝。
Fig. 1 is an explanatory diagram of a first embodiment of the present invention, Fig. 2 is an explanatory diagram of a second embodiment of the invention, Fig. 3 is an explanatory diagram of a third embodiment of the invention, and Fig. 4 is an explanatory diagram of a conventional example. This is a perspective overview part. 1...Outer frame, 1a...Top plate, 1b...Bottom plate, 2
...Groove, 2a...Groove fitting part, 3...Side plate, 4...
Grooved plate, 5, 5a...Guide groove.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 大型リードフレームを基準とした外形寸法を有
すると共に、少なくとも上板及び底板の各対応す
る位置に奥行き方向に沿つて溝を設けた箱型の外
枠と、片面にて上記外枠への挿着方向に沿いリー
ドフレーム挿入用の案内溝を多数設けると共に、
上面部及び下面部に溝嵌合部を設けた少なくとも
一種類の厚みの溝付板とを含むことを特徴とする
半導体リードフレームマガジン。
A box-shaped outer frame that has external dimensions based on a large lead frame and has grooves along the depth direction at least at corresponding positions on the top and bottom plates, and can be inserted into the outer frame on one side. In addition to providing many guide grooves along the direction for inserting the lead frame,
1. A semiconductor lead frame magazine comprising a grooved plate having at least one thickness and having groove fitting portions on an upper surface and a lower surface.
JP206286U 1986-01-13 1986-01-13 Pending JPS62114445U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP206286U JPS62114445U (en) 1986-01-13 1986-01-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP206286U JPS62114445U (en) 1986-01-13 1986-01-13

Publications (1)

Publication Number Publication Date
JPS62114445U true JPS62114445U (en) 1987-07-21

Family

ID=30780548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP206286U Pending JPS62114445U (en) 1986-01-13 1986-01-13

Country Status (1)

Country Link
JP (1) JPS62114445U (en)

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