JPS62112200U - - Google Patents
Info
- Publication number
- JPS62112200U JPS62112200U JP20448785U JP20448785U JPS62112200U JP S62112200 U JPS62112200 U JP S62112200U JP 20448785 U JP20448785 U JP 20448785U JP 20448785 U JP20448785 U JP 20448785U JP S62112200 U JPS62112200 U JP S62112200U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- electronic device
- thin copper
- electronic circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20448785U JPS62112200U (sh) | 1985-12-27 | 1985-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20448785U JPS62112200U (sh) | 1985-12-27 | 1985-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62112200U true JPS62112200U (sh) | 1987-07-17 |
Family
ID=31170492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20448785U Pending JPS62112200U (sh) | 1985-12-27 | 1985-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62112200U (sh) |
-
1985
- 1985-12-27 JP JP20448785U patent/JPS62112200U/ja active Pending
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