JPS62111812U - - Google Patents
Info
- Publication number
- JPS62111812U JPS62111812U JP20466985U JP20466985U JPS62111812U JP S62111812 U JPS62111812 U JP S62111812U JP 20466985 U JP20466985 U JP 20466985U JP 20466985 U JP20466985 U JP 20466985U JP S62111812 U JPS62111812 U JP S62111812U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- rollers
- breaking device
- break
- chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 1
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
第１図は本考案のウエハブレーキング装置の斜
視図、第２図は本考案のウエハブレーキング装置
によつたウエハブレーキング説明図、第３図は従
来のウエハブレーキング説明図である。
１１……ウエハブレーク本体、１２……支持板
、１３……下部ローラ、１４……上部ローラ、１
５……把手、１６……スプリング、１７……ウエ
ハブレーク台、１８……ウエハ、１９……キズ防
止用紙、２０……分離されたチツプ。
FIG. 1 is a perspective view of the wafer breaking device of the present invention, FIG. 2 is an explanatory diagram of wafer braking by the wafer breaking device of the present invention, and FIG. 3 is a diagram of conventional wafer braking. 11... Wafer break main body, 12... Support plate, 13... Lower roller, 14... Upper roller, 1
5...Handle, 16...Spring, 17...Wafer break table, 18...Wafer, 19...Scratch prevention paper, 20...Separated chip.
Claims (1)
するウエハブレーキング装置において、ウエハブ
レーク本体に設けられる一対のローラの間隔を弾
力的に設定する手段を設け、該ローラ間に表面及
び裏面にキズ防止用紙を敷いたウエハがセツトさ
れたブレーク台を挟着し、該ローラ間を通過させ
チツプ化することを特徴とするウエハブレーキン
グ装置。 In a wafer breaking device that breaks a partially cut wafer and separates it into individual chips, a means for elastically setting the distance between a pair of rollers provided on the wafer break body is provided to prevent scratches on the front and back surfaces between the rollers. A wafer breaking device characterized in that a wafer covered with paper is sandwiched between break tables on which the wafer is set, and the wafer is made into chips by passing between the rollers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20466985U JPS62111812U (en) | 1985-12-28 | 1985-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20466985U JPS62111812U (en) | 1985-12-28 | 1985-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62111812U true JPS62111812U (en) | 1987-07-16 |
Family
ID=31170667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20466985U Pending JPS62111812U (en) | 1985-12-28 | 1985-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62111812U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0657599U (en) * | 1993-01-14 | 1994-08-09 | 正和産業株式会社 | Substrate splitting device with rectangular slits |
-
1985
- 1985-12-28 JP JP20466985U patent/JPS62111812U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0657599U (en) * | 1993-01-14 | 1994-08-09 | 正和産業株式会社 | Substrate splitting device with rectangular slits |