JPS62109455U - - Google Patents

Info

Publication number
JPS62109455U
JPS62109455U JP20241185U JP20241185U JPS62109455U JP S62109455 U JPS62109455 U JP S62109455U JP 20241185 U JP20241185 U JP 20241185U JP 20241185 U JP20241185 U JP 20241185U JP S62109455 U JPS62109455 U JP S62109455U
Authority
JP
Japan
Prior art keywords
clamping
clamping tools
electronic component
tools
clamps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20241185U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP20241185U priority Critical patent/JPS62109455U/ja
Publication of JPS62109455U publication Critical patent/JPS62109455U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

図面は本考案の一実施例に係る電子部品挟持装
置を具備した電子部品ハンドラを簡略化して示す
平面図である。 １４…電子部品挟持装置、１９，１９…挟持具
、２３…電子部品。 The drawing is a simplified plan view of an electronic component handler equipped with an electronic component holding device according to an embodiment of the present invention. 14... Electronic component holding device, 19, 19... Holding tool, 23... Electronic component.

補正 昭６１．３．２７ 図面の簡単な説明を次のように補正する。 明細書の第７頁第２行目「図面は」を、「第１
図は、」に補正する。Amendment March 27, 1981 The brief description of the drawing is amended as follows. In the second line of page 7 of the specification, “Drawings are” is replaced with “Drawings are”
The figure has been corrected to ``.

Claims (1)

【実用新案登録請求の範囲】 一対の挟持具で構成され、前記両挟持具の間に
電子部品を挟持するものであつて、 前記挟持具は非導電材により形成されたことを
特徴とする電子部品挟持装置。[Claims for Utility Model Registration] An electronic device comprising a pair of clamping tools, which clamps an electronic component between the clamping tools, and characterized in that the clamping tools are made of a non-conductive material. Parts clamping device.
JP20241185U 1985-12-26 1985-12-26 Pending JPS62109455U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20241185U JPS62109455U (en) 1985-12-26 1985-12-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20241185U JPS62109455U (en) 1985-12-26 1985-12-26

Publications (1)

Publication Number Publication Date
JPS62109455U true JPS62109455U (en) 1987-07-13

Family

ID=31166766

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20241185U Pending JPS62109455U (en) 1985-12-26 1985-12-26

Country Status (1)

Country Link
JP (1) JPS62109455U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150104440A (en) * 2014-03-05 2015-09-15 주식회사 에스에프에이 Substrate transfer robot

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4941806U (en) * 1972-07-15 1974-04-12
JPS59143337A (en) * 1983-02-03 1984-08-16 Rohm Co Ltd Method for measurement of semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4941806U (en) * 1972-07-15 1974-04-12
JPS59143337A (en) * 1983-02-03 1984-08-16 Rohm Co Ltd Method for measurement of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150104440A (en) * 2014-03-05 2015-09-15 주식회사 에스에프에이 Substrate transfer robot

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