JPS62107457U - - Google Patents

Info

Publication number
JPS62107457U
JPS62107457U JP1985202064U JP20206485U JPS62107457U JP S62107457 U JPS62107457 U JP S62107457U JP 1985202064 U JP1985202064 U JP 1985202064U JP 20206485 U JP20206485 U JP 20206485U JP S62107457 U JPS62107457 U JP S62107457U
Authority
JP
Japan
Prior art keywords
cap
circuit board
ring
alumite
covered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985202064U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0341474Y2 (US08063081-20111122-C00044.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985202064U priority Critical patent/JPH0341474Y2/ja
Publication of JPS62107457U publication Critical patent/JPS62107457U/ja
Application granted granted Critical
Publication of JPH0341474Y2 publication Critical patent/JPH0341474Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/1515Shape
    • H01L2924/15153Shape the die mounting substrate comprising a recess for hosting the device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/153Connection portion
    • H01L2924/1531Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
JP1985202064U 1985-12-24 1985-12-24 Expired JPH0341474Y2 (US08063081-20111122-C00044.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985202064U JPH0341474Y2 (US08063081-20111122-C00044.png) 1985-12-24 1985-12-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985202064U JPH0341474Y2 (US08063081-20111122-C00044.png) 1985-12-24 1985-12-24

Publications (2)

Publication Number Publication Date
JPS62107457U true JPS62107457U (US08063081-20111122-C00044.png) 1987-07-09
JPH0341474Y2 JPH0341474Y2 (US08063081-20111122-C00044.png) 1991-08-30

Family

ID=31166103

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985202064U Expired JPH0341474Y2 (US08063081-20111122-C00044.png) 1985-12-24 1985-12-24

Country Status (1)

Country Link
JP (1) JPH0341474Y2 (US08063081-20111122-C00044.png)

Also Published As

Publication number Publication date
JPH0341474Y2 (US08063081-20111122-C00044.png) 1991-08-30

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