JPS62107450U - - Google Patents
Info
- Publication number
- JPS62107450U JPS62107450U JP19918785U JP19918785U JPS62107450U JP S62107450 U JPS62107450 U JP S62107450U JP 19918785 U JP19918785 U JP 19918785U JP 19918785 U JP19918785 U JP 19918785U JP S62107450 U JPS62107450 U JP S62107450U
- Authority
- JP
- Japan
- Prior art keywords
- carrier unit
- bonding
- package
- pedestal
- raised
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 2
- 210000000078 claw Anatomy 0.000 description 1
- 238000003909 pattern recognition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985199187U JPH0230839Y2 (US20080293856A1-20081127-C00150.png) | 1985-12-26 | 1985-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985199187U JPH0230839Y2 (US20080293856A1-20081127-C00150.png) | 1985-12-26 | 1985-12-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62107450U true JPS62107450U (US20080293856A1-20081127-C00150.png) | 1987-07-09 |
| JPH0230839Y2 JPH0230839Y2 (US20080293856A1-20081127-C00150.png) | 1990-08-20 |
Family
ID=31160573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985199187U Expired JPH0230839Y2 (US20080293856A1-20081127-C00150.png) | 1985-12-26 | 1985-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0230839Y2 (US20080293856A1-20081127-C00150.png) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS577135A (en) * | 1980-06-16 | 1982-01-14 | Mitsubishi Electric Corp | Wire bonding apparatus |
| JPS57186033U (US20080293856A1-20081127-C00150.png) * | 1981-05-20 | 1982-11-26 |
-
1985
- 1985-12-26 JP JP1985199187U patent/JPH0230839Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS577135A (en) * | 1980-06-16 | 1982-01-14 | Mitsubishi Electric Corp | Wire bonding apparatus |
| JPS57186033U (US20080293856A1-20081127-C00150.png) * | 1981-05-20 | 1982-11-26 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0230839Y2 (US20080293856A1-20081127-C00150.png) | 1990-08-20 |
