JPS62104956U - - Google Patents
Info
- Publication number
- JPS62104956U JPS62104956U JP19668885U JP19668885U JPS62104956U JP S62104956 U JPS62104956 U JP S62104956U JP 19668885 U JP19668885 U JP 19668885U JP 19668885 U JP19668885 U JP 19668885U JP S62104956 U JPS62104956 U JP S62104956U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- conductive foil
- printer head
- resin layer
- metal base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Exposure Or Original Feeding In Electrophotography (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19668885U JPS62104956U (ko) | 1985-12-20 | 1985-12-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19668885U JPS62104956U (ko) | 1985-12-20 | 1985-12-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62104956U true JPS62104956U (ko) | 1987-07-04 |
Family
ID=31155739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19668885U Pending JPS62104956U (ko) | 1985-12-20 | 1985-12-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62104956U (ko) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58121005A (ja) * | 1982-01-14 | 1983-07-19 | Japan Radio Co Ltd | ハ−ドコピ−装置 |
| JPS6013575A (ja) * | 1983-07-05 | 1985-01-24 | Rohm Co Ltd | 表示装置 |
-
1985
- 1985-12-20 JP JP19668885U patent/JPS62104956U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58121005A (ja) * | 1982-01-14 | 1983-07-19 | Japan Radio Co Ltd | ハ−ドコピ−装置 |
| JPS6013575A (ja) * | 1983-07-05 | 1985-01-24 | Rohm Co Ltd | 表示装置 |