JPS62104460U - - Google Patents
Info
- Publication number
- JPS62104460U JPS62104460U JP19672085U JP19672085U JPS62104460U JP S62104460 U JPS62104460 U JP S62104460U JP 19672085 U JP19672085 U JP 19672085U JP 19672085 U JP19672085 U JP 19672085U JP S62104460 U JPS62104460 U JP S62104460U
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- electrode
- glass
- utility
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19672085U JPS62104460U (US06650917-20031118-M00005.png) | 1985-12-20 | 1985-12-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19672085U JPS62104460U (US06650917-20031118-M00005.png) | 1985-12-20 | 1985-12-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62104460U true JPS62104460U (US06650917-20031118-M00005.png) | 1987-07-03 |
Family
ID=31155796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19672085U Pending JPS62104460U (US06650917-20031118-M00005.png) | 1985-12-20 | 1985-12-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62104460U (US06650917-20031118-M00005.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102881683A (zh) * | 2012-09-28 | 2013-01-16 | 苏州群鑫电子有限公司 | 一种双芯片玻封二极管 |
-
1985
- 1985-12-20 JP JP19672085U patent/JPS62104460U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102881683A (zh) * | 2012-09-28 | 2013-01-16 | 苏州群鑫电子有限公司 | 一种双芯片玻封二极管 |
