JPS62104457U - - Google Patents
Info
- Publication number
- JPS62104457U JPS62104457U JP12769185U JP12769185U JPS62104457U JP S62104457 U JPS62104457 U JP S62104457U JP 12769185 U JP12769185 U JP 12769185U JP 12769185 U JP12769185 U JP 12769185U JP S62104457 U JPS62104457 U JP S62104457U
- Authority
- JP
- Japan
- Prior art keywords
- view
- lead
- semiconductor device
- showing
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000003780 insertion Methods 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims description 5
- 238000003754 machining Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12769185U JPS62104457U (me) | 1985-08-21 | 1985-08-21 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12769185U JPS62104457U (me) | 1985-08-21 | 1985-08-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62104457U true JPS62104457U (me) | 1987-07-03 |
Family
ID=31022687
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12769185U Pending JPS62104457U (me) | 1985-08-21 | 1985-08-21 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62104457U (me) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62213146A (ja) * | 1986-03-13 | 1987-09-19 | Nec Corp | リ−ドの切断成形方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5333574A (en) * | 1976-09-10 | 1978-03-29 | Hitachi Ltd | Semiconductor integrated circuit package |
-
1985
- 1985-08-21 JP JP12769185U patent/JPS62104457U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5333574A (en) * | 1976-09-10 | 1978-03-29 | Hitachi Ltd | Semiconductor integrated circuit package |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62213146A (ja) * | 1986-03-13 | 1987-09-19 | Nec Corp | リ−ドの切断成形方法 |
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