JPS6197851U - - Google Patents

Info

Publication number
JPS6197851U
JPS6197851U JP18251084U JP18251084U JPS6197851U JP S6197851 U JPS6197851 U JP S6197851U JP 18251084 U JP18251084 U JP 18251084U JP 18251084 U JP18251084 U JP 18251084U JP S6197851 U JPS6197851 U JP S6197851U
Authority
JP
Japan
Prior art keywords
heat dissipation
dissipation plate
plastic molded
shape memory
memory alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18251084U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18251084U priority Critical patent/JPS6197851U/ja
Publication of JPS6197851U publication Critical patent/JPS6197851U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本案の放熱板が展開したときの斜視図
である。第2図は第1図の平面図(放熱板が閉じ
ているときのもの)を示すものである。第3図は
従来のプラスチツク・モールドトランジスタの斜
視図を示す。第4図は従来のプラスチツクモール
ドトランジスタの組立を示す図である。ここに 3A,3B,3C…放熱板、4A,4B,4C
…形状記憶合金、1…プラスチツク・モールドト
ランジスタ本体。
FIG. 1 is a perspective view of the heat sink of the present invention when it is unfolded. FIG. 2 shows a plan view of FIG. 1 (when the heat sink is closed). FIG. 3 shows a perspective view of a conventional plastic molded transistor. FIG. 4 is a diagram showing the assembly of a conventional plastic molded transistor. Here 3A, 3B, 3C...heat sink, 4A, 4B, 4C
...Shape memory alloy, 1...Plastic molded transistor body.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 放熱板の1部もしくは全体を形状記憶合金で作
り、平常時は折りたたまれていて、所定の温度に
なると放熱面積が広くなるように前記放熱板が展
開することを特徴とするプラスチツクモールドト
ランジスタの放熱板。
Heat dissipation of a plastic molded transistor, characterized in that a part or the whole of the heat dissipation plate is made of a shape memory alloy, the heat dissipation plate is folded under normal conditions, and when a predetermined temperature is reached, the heat dissipation plate expands so that the heat dissipation area becomes wider. Board.
JP18251084U 1984-11-30 1984-11-30 Pending JPS6197851U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18251084U JPS6197851U (en) 1984-11-30 1984-11-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18251084U JPS6197851U (en) 1984-11-30 1984-11-30

Publications (1)

Publication Number Publication Date
JPS6197851U true JPS6197851U (en) 1986-06-23

Family

ID=30740045

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18251084U Pending JPS6197851U (en) 1984-11-30 1984-11-30

Country Status (1)

Country Link
JP (1) JPS6197851U (en)

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