JPS6197837U - - Google Patents
Info
- Publication number
- JPS6197837U JPS6197837U JP18375884U JP18375884U JPS6197837U JP S6197837 U JPS6197837 U JP S6197837U JP 18375884 U JP18375884 U JP 18375884U JP 18375884 U JP18375884 U JP 18375884U JP S6197837 U JPS6197837 U JP S6197837U
- Authority
- JP
- Japan
- Prior art keywords
- parts
- heating
- hybrid
- heater
- temperature sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 3
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18375884U JPS6197837U (me) | 1984-12-04 | 1984-12-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18375884U JPS6197837U (me) | 1984-12-04 | 1984-12-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6197837U true JPS6197837U (me) | 1986-06-23 |
Family
ID=30741251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18375884U Pending JPS6197837U (me) | 1984-12-04 | 1984-12-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6197837U (me) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000045431A1 (en) * | 1999-01-27 | 2000-08-03 | Citizen Watch Co., Ltd. | Method of packaging semiconductor device using anisotropic conductive adhesive |
| JP2008112873A (ja) * | 2006-10-31 | 2008-05-15 | Nidec Tosok Corp | ボンディング装置の加熱部構造 |
-
1984
- 1984-12-04 JP JP18375884U patent/JPS6197837U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000045431A1 (en) * | 1999-01-27 | 2000-08-03 | Citizen Watch Co., Ltd. | Method of packaging semiconductor device using anisotropic conductive adhesive |
| JP2008112873A (ja) * | 2006-10-31 | 2008-05-15 | Nidec Tosok Corp | ボンディング装置の加熱部構造 |