JPS6196424A - Optical semiconductor module structure - Google Patents

Abstract

PURPOSE:To improve coupling efficiency by deforming an elastic ring through a taper ring by clamping a set screw, grasping a semiconductor optical package in the radius direction and adjusting the position of the optical axis direction. CONSTITUTION:An optical semiconductor package fixing means 21 is constituted of a taper ring 22 forming a conical surface on its inside and a taper ring 23 having a slitting and forming a conical surface on its outside and the ring 22 is engaged with the outer periphery of the ring 23 between a lens holder 2 and a spacer 3. The optical semiconductor package 4 is fixed on the leading end of an optical axis adjusting cylinder 27 and the ring 23 is opposed to the outer periphery of the leading end of the adjusting cylinder 27. For example, the Y axis is adjusted by an adjusting pin 162 inserted into a hole 15C and a micrometer 172 in a hole 15D, the Z axis (optical axis) is adjusted by a fine movement board 29, and after determining an optical position by irradiating light, the set screw 12 is clamped and the optical package 4 is fixed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to improvements in optical semiconductor module structures.

Recently, various devices using optical fibers have been developed, including optical semiconductor modules in which a light emitting element such as a semiconductor laser, a light receiving element such as an APD (avalanche photodiode), and an optical fiber are integrally formed.

Since the core diameter of the optical fiber is small, the optical fiber and the optical semiconductor element are integrally formed and fixed, so that the light output from the light emitting element can efficiently enter the optical fiber and exit from the optical fiber. This allows the light to be efficiently received by the light receiving element.

[Conventional technology]

12th conventional optical semiconductor module structure 100 of this kind
．． It is shown in Figure 13. FIG. 12 is a front view, and FIG. 15 is a side view. In the figures, 1 is an outer cylinder, 2 is a lens holder, 3 is an optical fiber, and 4 is an optical semiconductor package.

The lens holder 2 has a through hole 5 in the center, and a lens 6 is press-fitted and fixed into the through hole 5.

This lens holder 2 is attached to the bottom of the outer tube 1 tD hole 7 (D). The tail is inserted into the hole 10 and its tip end is in contact with one side surface FC of the lens holder 2.

The optical semiconductor package 4 contains an optical semiconductor element such as an APD or a semiconductor laser, and is mounted inside the sleeve 7 of the outer cylinder 1.

This optical semiconductor package 4 is fitted with a spacer 13 which is secured in the circumferential direction within the hole 7 by tightening a hollow set screw 12 which is brazed to a female thread 11 formed at the entrance of the hole 7. It is pressed and fixed to the other side surface of the lens holder 2 through an adapter 14 installed in the hole 7 .

Position adjustment of the optical semiconductor package 4 of the optical semiconductor module assembly 100 configured as described above in the x and y axis directions (directions perpendicular to each other on a plane orthogonal to the optical axis) is performed in the following manner.

As shown in detail in FIG. 16, outside f#i1 has four holes 15A, 15B, and 15C for performing this position adjustment.

15D is provided. Position adjustment is performed using two adjustment pins 161. inserted into these holes as shown in FIG.
16* and two micrometers 17t-17g. That is, the optical semiconductor package 4 is moved in the X-axis direction by the adjustment pin 161 biased by the spring 181 and the spindle of the micrometer 171, and in the Y-axis direction by the adjustment pin 16 biased by the spring 18! Press and hold the micrometer 17z on the spindle of the micrometer 17z. ．． Position adjustment is performed by operating the 17m to move each spindle forward or backward. In this case, the optical fiber 3 is also used to introduce light (in the case of a light-receiving element -8- or in the case of a light-emitting element that outputs output light from the optical fiber 3 to the outside), and adjust the position while measuring to find the optimal position. Find. During this position adjustment (do not completely tighten the setscrew 12)
Adjust the position with the optical semiconductor package 4 in a movable state, and then completely tighten the setscrew 12 to remove the optical semiconductor package 4.
Of course, it is necessary to fix the .

When tightening the set screw 12, the spacer 13 is locked in the circumferential direction and does not rotate but only moves in the optical axis direction, so the adjustment made will not be disturbed and the optical semiconductor package 4 will be accurately fixed. be done.

[Problem that the invention seeks to solve]

The conventional optical semiconductor module structure is constructed as described above, and the optical semiconductor package that has completed the position adjustment 11 in the X and Y directions is pressed against the lens holder and fixed. Therefore, the distance between the optical semiconductor X' element and the optical fiber is determined by the dimensional accuracy of the lens holder's thickness, and in order to guarantee the coupling efficiency, the dimensional accuracy of the lens holder's thickness must be strictly controlled. I had no choice but to do it.

However, there are variations in the lens press-fitting position of the lens holder, and in order to obtain high coupling efficiency, it is necessary to change the above-mentioned spacing to account for this variation, but the conventional structure cannot deal with this. Therefore, improvement measures are requested. This demand has recently been met by the need for light-receiving elements to have smaller light-receiving diameters in order to improve S/N, and optical fibers with small core diameters (single-mode optical fibers) are being used (this allows light-emitting elements to As it has become difficult to insert into optical fibers, it has become even stronger.

Additionally, in order to solve these problems, attempts have been made in the past to fill adhesive between the optical semiconductor package and the lens holder, and to cure the adhesive after completing the adjustment of the above-mentioned distance to fix the optical semiconductor package. However, because adhesive is used, there are problems with reliability when the temperature rises, and it is difficult to ground the optical semiconductor module, leading to long lead wires that adversely affect electrical characteristics. there were.

[Failure to solve the problem]

The present invention provides an optical semiconductor that can solve the various problems mentioned above.
The purpose is to provide a module structure, and as a means for that purpose, an optical fiber, a lens holder that holds a lens, and an optical semiconductor package that contains an optical semiconductor element are connected to each other, with the lens holder in the middle. The optical semiconductor package is mounted in an outer cylinder with its axes aligned, and a spacer is provided in the outer cylinder that is movable in the optical axis direction through a gap with the optical semiconductor package, and an optical semiconductor package fixing means is provided in the gap. In the optical semiconductor module structure, the optical semiconductor package is fixed via the optical semiconductor package fixing means by pressing and moving the spacer by tightening a set screw screwed into the outer cylinder on the outside of the spacer. , the optical semiconductor package fixing means includes a tapered ring having a tapered conical surface on its inner surface, and an outer periphery thereof engages with the tapered conical surface of the tapered ring, and when the spacer is moved by tightening the set screw, the tapered ring The optical semiconductor package is configured to include an elastic ring which is compressed between the spacer and the lens holder and is elastically deformed in a direction in which the inner diameter is reduced to securely hold the optical semiconductor package in the radial direction.

[Function] By tightening the setscrew, the spacer is pressed and moved, which causes the tapered ring to be cut and elastic rings such as slotted tapered rings to be elastically deformed inward to grip the outer periphery of the optical semiconductor package in the radial direction. Is it supposed to be fixed? It is possible to adjust the position of the optical semiconductor package in the optical axis direction.

Therefore, it is possible to obtain an optical semiconductor module assembly with high coupling efficiency and small variations in coupling efficiency.

〔Example〕

The present invention will now be described in detail with reference to FIGS. 1-11.

FIGS. 1 to 6 show a first embodiment, and members having the same structure as the conventional one are given the same reference numerals.

FIG. 1 is a front view of the optical semiconductor module structure 101, and FIG.
The figure is a cross-sectional view of FIG. 1, and in the figure, 21 is an optical semiconductor package fixing means.

The optical semiconductor package fixing means 21 includes a tapered ring 22
and a slotted taper ring (elastic ring) 26. The taper ring 22 is shown in FIG. 3(a).

(b) (As shown in detail in Fig. 3 (a+ is a front view, Fig. 3 (b) is a side view), it is provided with a tapered conical surface 24 formed on the inner surface. ring 2
3 has the same taper as the tapered conical surface 24 on the outer surface, as shown in detail in Figures 4 (a) and 4 (b) (Figure 4 (&) is a front view, Figure 4 (b) is a side view). It has a tapered conical surface 25 and a slot 26 formed by. The tapered ring 22 is fitted onto the outer periphery of a slotted tapered ring 23 between the lens holder 2 and the spacer 15. That is, the taper ring 22 and the slotted taper ring 23
are engaged through tapered conical surfaces 24 and 25.

Further, the optical semiconductor package 4 is fixed to the tip of the optical axis adjustment tube 27 by soldering or the like, and the slotted taper ring 25 covering the optical semiconductor package 4 is attached to the tip of the optical axis adjustment tube 27. They face each other with a small gap on the outer periphery.

The position adjustment of the optical semiconductor element (optical semiconductor package 4) is performed in the following manner.

ii in the X and Y axis directions! The adjustment is performed using an adjustment bin and a micrometer in the same manner as in the conventional method explained in FIG. However, whereas conventionally the optical semiconductor package is directly held and adjusted using an adjustment bottle and a micrometer, in the present invention, the optical semiconductor package is held via the optical semiconductor package fixing means 21. FIG. 5 shows the adjustment procedure in the Y-axis direction, with an adjustment bottle 16 inserted into the hole 15C and biased by a spring, and a micrometer 17 inserted into the hole 15D with a spindle. Adjustments are made by

Although the illustration of the X-axis direction perpendicular to the plane of FIG. 5 is omitted, the same applies! ! 1 with a regular bottle and a micrometer
A look is made.

Adjustment in the two-axis (optical axis) direction is performed by operating the fixed micrometer 28 shown in Figure 5. A fine movement table 29 connected to the spindle of the micrometer 28 is configured to move in two axial directions by operating the micrometer 28, and the fine movement table 29 is connected to an arm 51 via a fine movement table 30. . The arm 61 is fixed to the optical axis adjustment tube 27 with a screw 32, and the fine movement table 30 is fixed to the arm 31 and is movable relative to the fine movement table 29 in the X and Y axis directions. In other words, the fine movement tables 29 and 50 are connected only in the two-axis directions, so that adjustment in the X and Y-axis directions is not hindered. When the micrometer 28 is operated during adjustment in the two-axis directions, the fine movement table 29 moves in the two-axis directions, thereby causing the arm 31 to align with the optical axis adjustment tube 27.
At the same time, adjustments are made by making slight movements in two axial directions. Note that these position adjustments are made without completely tightening the setscrew 121, and the optimum position is determined by either inputting the light from the optical fiber 6 (in the case of a light receiving element) or extracting the output light from the optical fiber 5 to the outside. (For light-emitting devices) After the position adjustment is completed, set screw 12 f
jt is completely tightened, but in this case, the spacer 13 and the lens holder 2, which are pressed by this tightening and move to the left in FIG. Move to the left. The slotted taper ring 23 having the slots 26 is elastically deformed in a direction in which the radius decreases to grip the outer periphery of the optical axis adjustment tube 27 in the radial direction, and the optical semiconductor package 4 is fixed.

In this way, since the optical semiconductor package is gripped and fixed in the radial direction, it is possible to adjust the position of the optical semiconductor package in the optical axis direction, and a high-performance optical semiconductor module structure can be obtained. be able to.

Note that the same effect can be obtained by using a notched tapered ring (elastic ring) 33 shown in FIG. 6 instead of the slotted tapered ring 250.

The slotted tapered ring 33 has a collet-like structure and has a taper conical surface 24, a taper conical surface 34 formed by the same taper, and a notch 35 on the outer surface. Four notches 55 are formed at equal intervals in the circumferential direction, and stop halfway in the axial direction.

FIG. 7 shows a second embodiment.

In the case of the optical semiconductor module structure 102 of this example, the arrangement of the tapered ring 22 and slotted taper ring 26 is reversed from the previous example, and the tapered ring 22 is attached to the lens holder 2.
The slotted taper ring 23 is arranged on the spacer 13 side.

Also in case 6 of this example, both rings 22 and 23 are pinched by the leftward movement of the spacer 13, and the slotted taper ring 25 is elastically deformed to grip the optical axis adjustment tube 27.

A third embodiment is shown in FIGS. 8 to 11.

FIG. 8 is a front view of the optical semiconductor module structure 103. In FIG. do.

The taber ring 41 has a tapered conical surface formed on the inner surface, as shown in detail in FIGS. 9(a) + (b) (FIG. 9(a) is a front view and FIG. 9(b) is a side view). It is equipped with 43.

In addition, the slotted taper ring 42 is shown in FIG. 10 (al.
, (b) (Figure 10 tml is a front view, 101g
As shown in detail in (b) is a side view, there are provided on both sides of the outer periphery a taber conical surface 44 formed of the same taber as the taber conical surface 43, and a slot 45.

In this case, the only difference is that the slotted tapered ring 42 is pressed by the tapered rings 41 and 41 from both sides and is elastically deformed, and the position adjustment and fixing procedures of the optical semiconductor package 4 are the same as in the previous example.

In addition, instead of the slotted taper ring 420, a C ring (elastic ring) shown in Fig. 11 (a) and (b) (Fig. 11 (a) is a front view, Fig. 11 (b) is a side view)
46 may also be used. In this case, the C-ring 46 can be easily formed by simply curving a wire rod with a circular cross section.
The price can be reduced.

〔Effect of the invention〕

Since the present invention is configured as described above, it is possible to achieve the following various excellent effects.

(1) Since the optical semiconductor package is now fixed by holding it in the radial direction, it is now possible to fix it by adjusting the position in two axes (optical axis) in addition to the conventional X and Y axes. This makes it possible to obtain a high-performance optical semiconductor module structure.

(2) Since it is mechanically fixed without using adhesives, it has excellent temperature characteristics and reliability.

[Brief explanation of the drawing]

1 to 11 show embodiments of the present invention, and FIGS. 1 and 2 are front and side views of the optical semiconductor module structure of the first embodiment, and FIG. ). (b) is a front view and side view of the same taper ring, $4 figure (
al, (bl is a front view and side view of the same slotted taper ring, Fig. 5 is an explanatory diagram of the position adjustment procedure of the same optical semiconductor package, and Fig. 6 is a diagram of the slotted taper ring as an alternative to the slotted taper ring. 7 is a front view of the optical semiconductor module structure of the second embodiment, FIG. 8 is a front view of the optical semiconductor module structure of the sixth embodiment, and FIG.
), (b) is a front view and side view of the same taber ring,
The tenth factor (a) and (b) are a front view and a side view of the tapered ring with the same slot, and FIG. 11 (a). (b) is a front view and a side view of a C ring that replaces the slotted taber ring. FIG. 12 is a front view of a conventional optical semiconductor module assembly, FIG. 16 is a side view of the same, and FIG. 14 is an explanatory diagram of the position adjustment procedure of the optical semiconductor package. In the figure, 1 is an outer cylinder, 2 is a lens holder, 6 is an optical fiber,
4 is an optical semiconductor package, 6 is a lens, 8 is a ferrule, 12 is a hollow set screw, 15 is a spacer, 15A, 1
5B, 15C, 15D are holes, 21.47 is a semiconductor package fixing means, 22.41 is a taper ring, 23°4
2 is a slotted taper ring (elastic ring), 24
゜25.54, 45.44 are Taber conical surfaces, 26.4
5 is a slot, 27 is an optical axis adjusting tube, 33 is a taper ring with a notch (elastic ring), 46 is a C ring (elastic ring), and 101, 102, and 103 are optical semiconductor module structures, respectively. Patent ratio/applicant Fujitsu Limited

Claims (1)

[Claims] An optical fiber, a lens holder for holding a lens, and an optical semiconductor package containing an optical semiconductor element are installed in an outer cylinder with the lens holder in the middle, and the optical semiconductor package is installed in the outer cylinder. an optical semiconductor module assembly comprising: a spacer provided movably in the optical axis direction through a gap; and an optical semiconductor package fixing means provided within the gap, the optical semiconductor package fixing means comprising: It is composed of a tapered ring having a tapered conical surface on its inner surface, and an elastic ring whose outer periphery engages with the tapered conical surface of the tapered ring, and as the spacer moves in the optical axis direction, the tapered ring moves and the elastic ring moves. An optical semiconductor module structure, wherein the inner diameter of the ring is elastically deformed to fix the optical semiconductor package by gripping it in a radial direction.