JPS6195574A - Assembly body including photo semiconductor element - Google Patents

Abstract

PURPOSE:To mount a photo semiconductor element to a frame within a short period by providing a particular frame, a fixing member fixingly provided to the frame and an elastic member provided between the fixing member and photo semiconductor element. CONSTITUTION:A frame 12 is provided with a first hole 18 and a second hole 20 having the circular cross-section to support two optical fibers protected by the cylindrical ferrule of optical connector plug to be joined. A light receiving element 14 is mounted with a pressurized ring 40 and an O-ring 42 formed by elastic material within almost cylindrical metal box 34 fixingly provided with a third hole 26 of frame 12 under the condition that the front surface thereof 36 is pressurized to an annular intermediate metal ring 38. A light emitting element 16 is mounted into a fourth hole 28 of the frame 12 with a pressurized ring 62 and an O-ring 64.

Description

Detailed description of the invention (Ci,)Q, field of application)
16'-Z II or: 1 light-receiving or 2-t, 6:1 body containing an optical semiconductor element.

(U〉Unpaid'...te) Conventionally, when installing an optical semiconductor element in a light emitting device or a light receiving device as described above, the optical semiconductor element is placed in a hole in a frame, and the optical semiconductor element is placed in a frame. It was fixed using adhesive or screws.

(Problems to be Solved by the Invention) When installing optical semiconductor elements in a frame using an adhesive as described above, it is necessary to leave them for a relatively long time until the adhesive hardens. Therefore, this installation method is not suitable for mass production. Furthermore, when adhesive Mll is used, there is also the problem that it is difficult to securely fix it over a long period of time.

In addition, mating that is fixed using screws has problems such as the connection loosening due to vibration etc., making it difficult to identify the arm in a stable state over a long period of time.

On the other hand, it is conceivable to arrange the optical semiconductor element in the hole of the frame and fix it with a press-fit ring. However, in order to press-fit the press-fit ring into the hole in the frame, it is necessary to apply a large amount of pressure radially inward to the press-fit ring.
The optical semiconductor element that comes into contact with the press-fit ring in the axial direction will be destroyed if only a relatively small force is applied thereto. Therefore, it is relatively difficult to control the pressure when press-fitting the press-fit ring.

Furthermore, if the optical conductor element is fixed with a press-fit ring, there is a risk that a gap will form between the press-fit ring and the optical semiconductor element after long-term use. If this gap occurs, the positions of the four optical elements will shift, and for example, the intensity of light sent from the light emitting element to the optical fiber and received by the optical fiber may change inappropriately, or the light receiving element may A problem arises in that appropriate light reception may not be possible.

Furthermore, it is also possible to fix the optical semiconductor element in the hole of the frame with a screw member that is screwed into a screw provided in the hole. Even with such a fixing method, there is a risk that a gap will form between the bracket member and the optical semiconductor cable after long-term use.

More importantly, in recent years, when connecting an optical fiber and an optical semiconductor element, the end of the optical fiber is placed in front of the optical conductor element (light-receiving surface or light-emitting surface) so that the positional relationship between them is always constant. It was proposed to place it in pressure contact with the When the end of the optical fiber and the front surface of the optical semiconductor element are brought into pressure contact in this way, in the installation configuration in which the optical 24-element element is fixedly installed on the frame as described above, the optical fiber There is a risk that the optical semiconductor element, especially its light-emitting surface or light-receiving surface, will be destroyed.

(Object of the present invention) The present invention has been made in view of the above-mentioned circumstances.

SUMMARY OF THE INVENTION An object of the present invention is to provide an assembly including an optical conductor element that allows an optical semiconductor element to be attached to a banknote in a short time.

Another object of the present invention is to provide an assembly including an optical semiconductor device that can hold the optical semiconductor device accurately in a predetermined position for long periods of time.

Another object of the invention is to provide an assembly including optical semiconductor elements that can be assembled relatively easily.

Another object of the present invention is to provide a solid body including an optical semiconductor element having the function of protecting the optical conductor element against external forces applied to the optical semiconductor element.

(Means for solving the problem) According to the present invention, the above-mentioned problem can be solved by: an optical semiconductor element, a window that sends light to or from the optical semiconductor element, and a window that is in close contact with the window. a frame including a space for accommodating the optical semiconductor element at a position and a passage for introducing the optical semiconductor satin into the space; a fixing member fixedly installed with respect to the frame; The present invention is solved by providing an assembly including an optical semiconductor element characterized by comprising an elastic member disposed between the fixing member and the optical semiconductor element.

(Embodiments) Next, preferred embodiments of the present invention will be described with reference to the accompanying drawings. In this embodiment, the present invention is applied to an assembly including both a light receiving element and a light emitting element. However, the present invention can also be applied to an assembly including only either a light receiving element or a light emitting element.

In the drawings, an assembly 10r according to this embodiment includes a frame 12, a light receiving element 14 which is an optical semiconductor element, and a light emitting element 16 which is an optical semiconductor element.

An optical connector Zorag (not shown) is connected to this assembly 10.

The frame body 12 includes a first hole 18 and a second hole 20 each having a circular cross-section and accommodating two optical fibers protected by a cylindrical ferrule of an optical connector plug to be connected. The frame 12 further includes locking claws 22 and 24 that engage the locking levers of the optical connector ZOLAG, thereby locking the assembly 10 and the optical connector plug together so that the two optical fibers are connected to the respective first While accommodated in the hole 18 and the second hole 20, they are releasably and fixedly connected. A third hole 26 and a fourth hole 28 are formed on the back side of the frame 12 to accommodate the light receiving element 14 and the light emitting element 16, respectively. The third hole 26 and the fourth hole 28 communicate with the first hole 18 and the second hole 20, respectively, with their central axes aligned. The boundary between the first hole 18 and the third hole 26 and the second hole 20 and the fourth hole 28
The boundary portion between the two constitutes a window through which light is sent to or from the optical semiconductor element. A metal back plate 32 is fixed to the back surface 30 of the frame 12.

Light-receiving element The light-receiving element 14 is placed in a substantially cylindrical metal box 34 fixedly installed in the third hole 26 of the frame 12, with its front surface 3
6 is annular and pressed against the middle ring 38 made of cod,
It is installed by a press-fit ring 40 and a Q-IJ ring 42 made of an elastic body. The light receiving element 14 can be composed of, for example, a plN photodiode or an avalanche photodiode.

As shown in the drawing, the rear outer peripheral edge of the box body 34 is provided with a groove 44 that fits into the inner circle of the circular opening provided in the back plate 32. -1 body 34 is fixedly installed in the third hole 26 of the frame body 12. Alternatively, the housing 34 can also be pressed into the third hole 26', thereby providing a fixed installation. In this case as well, it is preferable that the box body 34 and the back plate 32 be electrically connected according to the principle described below. A front wall 48 in which a k-shaped hole 46 is formed is provided at the front of the box body 34. The circular hole 46 has a central axis that is convergent with the first hole 18 and has a larger diameter than the first hole 18 . As shown in the figure, a shoulder portion 52 is formed in the middle of the substantially cylindrical side wall 50 of the box body 34, LV. As a result, the rest part 54 of the light-receiving child 14 and the Franz part 56
are in contact with the inner surfaces of the i and ij walls 50 of the box body 34, respectively, so that the light receiving element 14 cannot move in the radial direction, or in other words, in the vertical direction of the drawing, X3Dh.

An intermediate ring 38 connects the front surface 36 of the light receiving element 14 and the box body 34.
and the front wall 48 of the front wall. The intermediate ring 38 has an outer diameter approximately equal to the front inner diameter of the inner hole of the box body 34 and has an inner diameter smaller than the circular hole 46 in the front wall 48 of the box body 34 . The inner diameter of the intermediate ring 38 made of a conductor, for example a metal, is preferably larger than the diameter of the optical fiber protected by the ferrule inserted into the first hole 18. It may be preferred that the intermediate ring 38 has a thickness of 17 mm for reasons discussed below.

A press-fitting ring 40 constituting a fixing member is press-fitted into an inner hole at the rear of the box body 34 and fixed thereto. Instead of the press-fit ring 40, a ring that is screwed into and fixed to a screw formed in the inner hole of the box body 34 can also be used. Further, although the illustrated press-fit ring 40 is approximately annular,
For example, a substantially solid disk member having only holes (guiding portions) for guiding the terminals 58 and 60 of the light receiving element 14 may be used instead. The press-fit ring 40 may be made of resin or metal.

The Q-IJ ring 42 constituting the elastic member is the press-fit ring 4.
0 and the light receiving element 14 in a compressed state. The Q + +7 ring 42 has a circular shape with a substantially circular cross section. The O-ring 42 can be made of rubber, for example, a soft resin such as soft vinyl chloride. 0
- Instead of the ring 42, a coil spring made of metal, for example, can be used.

An O-ring 42 is placed between the press-fit ring 40 and the light receiving element 14 to force the light emitting element assembly 4 towards the intermediate ring 38 and the front wall 48 of the box body 34.

Next, the process of installing the light receiving element 14 on the frame 12 will be explained. First, the back plate 32 is fixed to the frame 12, and the box 34 is fixedly installed in the third hole 26 of the frame 12. Next, insert the intermediate ring 38 into the inner hole (c) of the box body 34.
, the light receiving element 14 and the O-ring 42 are inserted directly into the
After that, the press ring 40 is pressed into the inner hole of the box body 34,
Fix it to this. As a result, the O-ring 42 is placed in a compressed state between the press-fit ring 40 and the light-receiving element 14, thereby pushing the light-receiving element 14f- toward the intermediate ring 38 and the front wall 48 of the box body 34. It is placed in a forced state.

As described above, when installing an optical semiconductor element, for example, the light receiving element 14, in the frame 12, even if the dimensions of the press-fit ring 400 and the press-fit position are not exactly correct, the optical semiconductor element can be placed in the desired position. can be positioned accurately. That is, the light receiving element 14 is connected to the intermediate ring 3 by the O-ring 42.
8, even if the dimensions of the press-fit ring 40 and the press-fit position γj are not accurate, as long as the intermediate ring 38 and the box body 34G are dimensioned accurately, the light-receiving element 1
4 can be positioned accurately. This is an important advantage considering that when press-fitting the press-fit ring 40, a large pressure is applied radially inward, making it relatively difficult to accurately position it in the axial direction.

Furthermore, when installed as described above, the optical semiconductor element can be accurately positioned at a desired position over a long period of time. Assume that the light receiving element 14 can be accurately positioned using only the press-fit ring 40 without using the O-ring 42. In such a case, the light receiving element 14 is positioned accurately at the beginning of the setting value. However, when used for a long time, the press-fit ring 4 may be damaged due to vibration, for example.
There is a risk that the position of 0 may shift, creating a gap between the press-fit ring 40 and the light-receiving element 14, and the light-receiving element 14 may shift from the desired position. On the other hand, when configured as described above, even if the position of the press-fit ring 40 is slightly shifted, the provision of the O-ring 42 allows the light-receiving element 14
The position of is maintained accurately.

Furthermore, when the optical semiconductor element is installed in the frame as described above, the assembly is relatively easy. According to the present invention, the optical semiconductor element is housed in a space inside the frame, and the press-fit ring 40, which is a fixing member, is fixed to the frame 12. Preferably,
As described above, the press-fit ring 40 is fixed to the passageway through which the light-receiving element 14 is introduced to a desired position, that is, the rear portion of the inner hole of the box body 34. When arranged in this way, the box body 34
, the intermediate ring 38, the light receiving element 14.0-+) ring 42, and the press-fit ring 40 can be inserted from the same direction,
Its assembly becomes easy. However, the assembled two bodies of the present invention do not necessarily need to be washed 4N in this way, and the frame body 12
A third hole and a separate hole are provided in the hole, and the light receiving element 1 is inserted through this hole.
4 may be introduced at a desired position.

With the configuration as described above, damage to the optical semiconductor element can be prevented. In order to accurately position the optical semiconductor element and the optical fiber of the optical connector-plug relative to each other, the optical fiber of one optical connector plug is supported and connected so that it can move elastically in its axial direction. A configuration has been proposed in which the tip of the fiber is pressed into contact with the light-receiving surface or the light-emitting surface of an optical semiconductor element. The light receiving element 14 is connected to the above-mentioned passage.
When installed in the frame 12, even if the tip of the optical fiber comes into contact with the front surface of the light receiving element 14, the light receiving element 14 is elastically supported by the ViO-ring 42, so the light receiving element 1
4 is less likely to be damaged. Further, even if the front surface of the light receiving Yonago 14 is formed of glass having a relatively large area, the optical fiber and the ferrule holding the optical fiber do not come into direct contact with the glass, but through the intermediate ring 38. This allows the front glass of the light-receiving element 14 to be covered. The configuration is such that the pressure from the optical fiber and the ferrule to the intermediate ring 38 is not applied to the glass of the light receiving element 14, but is applied only to the outer cover of the light receiving element.
Additionally, it can be configured to protect the glass.

Moreover, when configured as described above, an electromagnetic shield can be easily formed and the optical semiconductor element can be protected from disturbance. The frame 12 can be made of various materials. For example, if it is made of metal or conductive resin, an electromagnetic shield can be formed. On the other hand, if the frame 12 is made of resin, for example, it is necessary to consider electromagnetic shielding separately. Frame body 12
Even in the case where the box 34, the intermediate ring 38, and the back plate 32 are made of a conductor, such as a metal, as described above, and they are electrically connected to each other, an electromagnetic shield can be easily formed. can. Furthermore, the ferrule holding the optical fiber of the optical connector bladder connected to the solid body is made of metal, and as described above, this ferrule is pressed against the intermediate ring 38 and electrically connected. If configured as above, the electromagnetic shielding will be more complete. By grounding the gold-containing outer cover of the optical semiconductor element, an electromagnetic shield can be formed to some extent. However, in order to make the electromagnetic shield more complete or to prevent electromagnetic disturbance from entering from the terminals of the optical semiconductor element, it is preferable to do as described above.

The light emitting element 16 is installed in the fourth hole 28 of the frame 12 by a press-fit ring 62 and an O-ring 64.The light emitting element 16 is placed in the fourth hole 28 of the frame 12, unlike the above-mentioned installation of the light receiving element 14.
A metal box and an intermediate ring are not used, and the light emitting element 16 is directly housed in the hole of the frame 12, that is, the fourth hole 28. The pressure flange 62 and the Q-IJ ring 64 are configured similarly to the pressure ring 40 and the Q-IJ ring 42 for the light receiving element 14. However, unlike the case described above, the pressure ring 62 is fixed in the fourth hole 28 by direct press fitting. This ring 62 may have a 1':A fit with a threaded portion provided in the fourth hole 28.

The fourth hole 28 has a shoulder portion 66 as shown, and the flanged portion 68 of the light emitting element 16 is attached to the shoulder portion 66.
They are pressed together by a ring 64. According to this K, the positioning of the light emitting element 16 is performed. Therefore, unlike the case described above, the main part of the light emitting element 16 contains O
- No axial pressure is applied by the ring.

The light emitting surface on the front side of the light emitting element 16 shown in the figure has a circular shape with a small area.
An annular portion, which is part of the metallic outer cover, is located at. For this reason, the metal ferrule that holds the optical fiber of the predicated optical connector plug comes into contact with the annular portion.

Compared to the installation of the light receiving element 14 described above, the installation of the light emitting element 16 as described above does not use the box 34 and the intermediate bracket 38, so it can be assembled relatively easily. The difference is that no O-ring force is applied to the main part, and the metal outer cover and the ferrule connecting the optical fiber are electrically connected, preventing electromagnetic disturbance from the front. .

In the above description, the light-receiving element and the light-emitting element are installed in a relatively large size. These can be purchased in the same form or installed in opposite forms.

(Effects of the Invention) As described above, according to the present invention, it is possible to provide an assembly including an optical semiconductor element in which the optical semiconductor element is installed at a predetermined position relatively easily and in a stable state over a long period of time. .

According to the present invention, it is possible to provide an assembly including an optical semiconductor element in which the optical semiconductor element is protected against external forces.

[Brief explanation of the drawing]

The drawing is a partial cross-sectional view of an assembly including an optical semiconductor device according to an embodiment of the invention. 10... Assembly 12... Frame body 14... Light receiving element 16... Light emitting element 18... First hole 20... Second hole 26... Third hole 28. ...Fourth hole 32...Q Plate 34...: White Body 38... Intermediate ring 40.62...Press-fit ring 42, 64...0-ring

Claims (1)

[Claims] 1. An optical semiconductor element, a window for sending light to or from the optical semiconductor element, and a space for accommodating the optical semiconductor element in close proximity to the window. , a frame including a passage for introducing the optical semiconductor element into the space, a fixing member fixedly installed with respect to the frame, and between the fixing member and the optical semiconductor element. 1. An assembly including an optical semiconductor element, comprising an elastic member arranged therein. 2. The assembly according to claim 1, wherein the optical semiconductor element is a photodiode. 3. The assembly according to claim 2, wherein the optical semiconductor element is a PIN photodiode. 4. The assembly according to claim 2, wherein the optical semiconductor element is an avalanche photodiode. 5. The assembly according to claim 1, wherein the optical semiconductor element is a light emitting diode. 6. The assembly according to claim 1, wherein the optical semiconductor element is a laser diode. 7. The assembly according to any one of claims 1 to 6, wherein the frame is made of resin. 8. The assembly according to claim 7, wherein the frame is made of conductive resin. 9. The assembly according to any one of claims 1 to 6, wherein the frame is made of metal. 10. The assembly according to any one of claims 1 to 9, wherein the fixing member is a member fixed to a hole provided in the frame. 11. The assembly according to claim 10, wherein the fixing member is a member press-fitted into the passage of the frame. 12. The assembly according to claim 10, wherein the fixing member is a member screwed into a screw provided in the passage of the frame. 13. The assembly according to any one of claims 1 to 12, wherein the fixing member is made of resin. 14. The assembly according to any one of claims 1 to 12, wherein the fixing member is made of metal. 15. The assembly according to any one of claims 1 to 14, wherein the fixing member includes a guide portion for a terminal of the optical semiconductor element. 16. The assembly according to any one of claims 1 to 15, wherein the elastic member is made of rubber. 17. The assembly according to any one of claims 1 to 15, wherein the elastic member is made of soft resin. 18. Claim 1, wherein the elastic member is made of soft PVC.
Assembly according to item 7. 19. The assembly according to any one of claims 1 to 15, wherein the elastic member is a metal spring. 20. The assembly of claim 19, wherein the elastic member is a coil spring. 21. Claim 1, wherein a box made of a conductor is fixedly installed in the space and the passage of the frame, and the fixing member is a member fixed to the box. Items to 9th
21. The assembly according to item 1 and any one of items 13 to 20. 22. The assembly according to claim 21, wherein the fixing member is a member press-fitted into the box body. 23. The assembly according to claim 21, wherein the fixing member is a member screwed into a screw provided on the box body. 24. Claim 23, wherein the optical semiconductor element is separated from the window of the frame by an annular metal ring, and the ring and the box are electrically connected. Assembly as described.