JPS6193391A - Panel type structural material using heat pipe - Google Patents

Panel type structural material using heat pipe

Info

Publication number
JPS6193391A
JPS6193391A JP21476484A JP21476484A JPS6193391A JP S6193391 A JPS6193391 A JP S6193391A JP 21476484 A JP21476484 A JP 21476484A JP 21476484 A JP21476484 A JP 21476484A JP S6193391 A JPS6193391 A JP S6193391A
Authority
JP
Japan
Prior art keywords
wick
panel
flat plate
outer skin
panel outer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21476484A
Other languages
Japanese (ja)
Inventor
Mitsuharu Suzuki
鈴木 光治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP21476484A priority Critical patent/JPS6193391A/en
Publication of JPS6193391A publication Critical patent/JPS6193391A/en
Pending legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Building Environments (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE:To provide a panel type material that dose not allow an uneven distribution of temperature around the unit by disposing a flat plate wicks under the front and back panel skins between which honeycomb structural material is disposed which is alternately filled with wick. CONSTITUTION:When a heat generating unit is mounted on the panel outer skin 1a, the operating medium inside a flat plate wick 3a near the heated spot is vaporized. Because of a fact that the vapor moves to a vapor space 5 and the vapor has a propensity to become at a uniform temperature in the space 5, the temperature across the space 5 and flat plate wick 3 becomes equalized, and any localized temperature distribution is averaged out across the entire area of the panel outer skin. The panel outer skin 1b plays a role of releasing heat, and the vaporized operating medium is cooled in the flat plate wick 4 to be condensed to return to the operating liquid, which again moves to the flat plate wick 3a due to the capillary action of the wick 4 filled in the honeycomb 2. By such a heat pipe function, the heat applied to the panel outer skin 1a is released from the panel outer skin 1b.

Description

【発明の詳細な説明】 発明の属する分野 本発明は、ヒートパイプを応用したパネル形構造材料に
関し、特に、構造材料であシながら構造自体が同時にヒ
ートパイプ機能も保有する構造材料に関するものである
[Detailed Description of the Invention] Field of the Invention The present invention relates to a panel-shaped structural material to which a heat pipe is applied, and in particular to a structural material whose structure itself also has a heat pipe function while being a structural material. .

従来の技術 一般に、パネル形構造材料は、地上機器あるいは宇宙機
器の構成ユニツ”トの取付構体パネルとして用いられ、
七のユニットが運用に伴い発熱を行なった場合には、パ
ネル形構造材料の持つ熱伝導性によシ、周辺への熱の伝
導はあるものの、そのユニットを中心に温度分布として
偏在が発生する。
BACKGROUND OF THE INVENTION In general, panel-shaped structural materials are used as mounting structure panels for component units of ground equipment or space equipment.
When unit No. 7 generates heat during operation, due to the thermal conductivity of the panel-shaped structural material, although heat is conducted to the surrounding area, an uneven temperature distribution occurs around the unit. .

従って、その発熱ユニットを中心とした温1分布の偏在
によシ、発熱ユニットを取シ巻く環境温度のユニット運
用可能温度範囲は、パネル形構造材料における温度偏在
分だけ縮少される。
Therefore, due to the uneven distribution of temperature 1 around the heat generating unit, the unit operable temperature range of the environmental temperature surrounding the heat generating unit is reduced by the uneven temperature distribution in the panel-shaped structural material.

従って、運用可能範囲を拡大する必要がある場合には、
その発熱ユニットにヒー・ドパイブ等が取付けられ、温
度の偏在幅を縮少する処置が取られる。この様に、温度
の偏在を吸収する為に、ヒートパイプが用いられた場合
、設置されたヒートパイプ分の専有容積の増大及び重量
の増大が発生する。これらの事は、特に宇宙機器に対し
ては、環境温度範囲の制限、又、ペイロード能力の増大
等の影響を引き起こす。
Therefore, if it is necessary to expand the operational range,
A heat pipe or the like is attached to the heat generating unit, and measures are taken to reduce the uneven distribution of temperature. In this way, when a heat pipe is used to absorb the uneven distribution of temperature, an increase in the exclusive volume and weight of the installed heat pipe occurs. These issues, especially for space equipment, have effects such as limiting the environmental temperature range and increasing payload capacity.

第1図はパネル外皮間の構造として、ハニカムを用いた
従来におけるパネル形構造材料の断面図であり、1はパ
ネル外皮、2はハニカムをそれぞれ示している。
FIG. 1 is a cross-sectional view of a conventional panel-shaped structural material using a honeycomb as a structure between the panel outer skins, and numeral 1 indicates the panel outer skin and 2 indicates the honeycomb.

発明の目的 本発明は従来の上記事情に鑑みてなされたものであり、
従って本発明の目的は、上記諸欠点を除去し、ユニット
の発熱にかかわらず、本発明による構造材料自体が保有
している大きな熱伝導性により、ユニット周辺に温度の
偏在を生じない新規なパネル形構造材料を提供すること
にある。
Purpose of the Invention The present invention has been made in view of the above-mentioned conventional circumstances.
Therefore, an object of the present invention is to eliminate the above-mentioned drawbacks and to provide a novel panel that does not cause uneven distribution of temperature around the unit due to the high thermal conductivity of the structural material itself of the present invention, regardless of the heat generated by the unit. Our goal is to provide shaped structural materials.

発明の構成 本発明は、上記目的を達成する為に、表裏のパネル外皮
の内側にそれぞれ平板ウィックを配置し、平板ウィック
の間にはハニカム構造材を配置する。
Structure of the Invention In order to achieve the above object, the present invention arranges flat wicks inside the front and back panel skins, and arranges a honeycomb structure material between the flat wicks.

このハニカム構造材の内部には、交互にウィックを充填
する。平板ウィックの構造としては動作液が平板ウィッ
ク面全域に分配できる構造となっており、また、ハニカ
ムとパネル外皮間の構成としては、パネル外皮に加わる
応力及び張力に対し充分な構造的強度を発揮できる支持
構造を備えているものとする。
The inside of this honeycomb structure material is alternately filled with wicks. The structure of the flat wick is such that the working liquid can be distributed over the entire surface of the flat wick, and the structure between the honeycomb and the panel skin provides sufficient structural strength against stress and tension applied to the panel skin. It shall be equipped with a supporting structure that allows for

発明の実施例 以下、図面を参照して、本発明をその好ましい一実施例
について具体的に説明する。
EMBODIMENT OF THE INVENTION Hereinafter, a preferred embodiment of the present invention will be specifically explained with reference to the drawings.

第2図は本発明の一実施例を示す概略断面図であり、第
1図と同様な部材には、同じ参照符号を附1している。
FIG. 2 is a schematic cross-sectional view showing an embodiment of the present invention, and the same reference numerals as in FIG. 1 are given the same reference numerals.

第2図において、パネル外皮1aに発熱ユニットを搭載
した場合には、加熱された附近の平板ウィック3aの内
部の動作液が蒸気化される。そして、この蒸気は蒸気空
間5に移動すると共に、蒸気温度が蒸気空間5内で一様
な温度になろうとする性質により、蒸気空間5、平板ウ
ィック3内で全域が等温となる。この為に、局所的な温
度の偏在がパネル外皮全域に平均化される。この場合、
パネル外皮11)は放熱の役目をしておシ、蒸気化され
た動作液は平板ウィック3bにおいて冷却されて凝縮し
て動作液に戻る。この動作液はハニカム内充填ウィック
4の毛細管作用により再び平板ウィック3aK移動する
。このヒートパイプ機能によシ、パネル外皮1aに加え
られた熱はパネル外皮1bよシ外部に放熱される。
In FIG. 2, when a heat generating unit is mounted on the panel outer skin 1a, the working liquid inside the heated flat plate wick 3a is vaporized. Then, as this steam moves to the steam space 5, the temperature of the steam tends to be uniform within the steam space 5, so that the entire area within the steam space 5 and the flat wick 3 becomes isothermal. For this reason, local temperature unevenness is averaged over the entire panel skin. in this case,
The panel outer skin 11) serves as a heat dissipator, and the vaporized working fluid is cooled in the flat wick 3b, condensed, and returned to working fluid. This working liquid moves again to the flat wick 3aK by the capillary action of the wick 4 filled in the honeycomb. Due to this heat pipe function, the heat applied to the panel outer cover 1a is radiated to the outside through the panel outer cover 1b.

発明の作用、効果 以上説明した様に、本発明によれば、発熱ユニット周辺
の温度の偏在は、パネル外皮1a全域に平均化されると
共に、発熱ユニットによってパネル外皮1aに加えられ
た熱はパネル外皮1bの外部に放熱される為に、発熱ユ
ニット周辺における外皮パネルlaの環境温度に対する
温度上昇は従来のパネル形構造材料を用いた場合に比較
し、て、相対的に小さいものとなる。従って、発熱ユニ
ットを取り巻く9境温度のユニツ:・運用可能温度範囲
は、従来のパネル形構造材料を用いた場合に比較して相
対的に広く取ることができる。
Functions and Effects of the Invention As explained above, according to the present invention, the uneven distribution of temperature around the heat generating unit is averaged over the entire panel skin 1a, and the heat applied to the panel skin 1a by the heat generating unit is distributed throughout the panel skin 1a. Since heat is radiated to the outside of the outer skin 1b, the temperature rise of the outer skin panel la around the heat generating unit relative to the environmental temperature is relatively small compared to the case where a conventional panel-shaped structural material is used. Therefore, the operational temperature range of the nine temperature ranges surrounding the heat generating unit can be relatively wide compared to when conventional panel-shaped structural materials are used.

また、この効果は、パネル外皮1aに搭載される発熱ユ
ニットの発熱量が増大するにつれ、また発熱ユニットの
数が増えるにつれ、より一層顕著なものとなる。
Moreover, this effect becomes even more remarkable as the amount of heat generated by the heat generating units mounted on the panel outer skin 1a increases, and as the number of heat generating units increases.

また1本発明によれば、構造材料自体がヒートパイプ効
果を持っている為に、発熱ユニットによる加熱を放熱す
る為のヒートパイプを新らたに設置する必要がなくなる
。これによシ、従来、ヒートパイプの設置による専有容
積及び重量の増加がなくなる事はもとよシ、ヒートパイ
プ設置の為のヒートパイプ自体の設計、また構体上レイ
アウト設計等の作業工数が不要となる。ヒートパイプ不
要による専有面積及び重量の減少は、衛星機器あるいは
、地上機器に対しそれぞれ減少分相当の搭載ユニットの
増大あるいは保有機能の充実が予想される。
Furthermore, according to the present invention, since the structural material itself has a heat pipe effect, there is no need to newly install a heat pipe for dissipating the heat generated by the heat generating unit. This not only eliminates the conventional increase in volume and weight due to heat pipe installation, but also eliminates the need for man-hours such as designing the heat pipe itself and designing the structural layout for installing the heat pipe. becomes. The reduction in area and weight due to the need for heat pipes is expected to result in an increase in the number of on-board units or enhancement of the functions possessed by satellite equipment or ground equipment, respectively.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はパネル外皮間の構造としてハニカムを用いた従
来におけるパネル形構造材料の断面図、第2図は本発明
に係るパネル形構造材料の一実施例を示す断面図である
。 1・・・パネル外皮、2・・・ハニカム、3・・・平板
ウィック、4・・・ハニカム内充填ウィック、5・・・
蒸気空間
FIG. 1 is a cross-sectional view of a conventional panel-shaped structural material using a honeycomb as a structure between panel outer skins, and FIG. 2 is a cross-sectional view showing an embodiment of the panel-shaped structural material according to the present invention. 1... Panel outer skin, 2... Honeycomb, 3... Flat wick, 4... Honeycomb filling wick, 5...
steam space

Claims (1)

【特許請求の範囲】[Claims] 宇宙機器及び地上機器に用いられる構造材料において、
表裏の両構造外皮の内側にそれぞれ配置される二枚の平
板ウイツクおよび上記二枚の平板ウイツクにはさまれる
形で配置される蒸気空間とハニカム内充填ウイツクとに
よりヒートパイプ機能を保有し、かつ上記の構造全体で
構造材料の機能も保有していることを特徴とするヒート
パイプを応用したパネル形構造材料。
In structural materials used for space equipment and ground equipment,
It has a heat pipe function by two flat plate wicks placed inside both the front and back structural skins, and a steam space and a honeycomb filling wick placed between the two flat plate wicks, and A panel-shaped structural material using a heat pipe, which is characterized in that the entire structure described above also has the function of a structural material.
JP21476484A 1984-10-13 1984-10-13 Panel type structural material using heat pipe Pending JPS6193391A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21476484A JPS6193391A (en) 1984-10-13 1984-10-13 Panel type structural material using heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21476484A JPS6193391A (en) 1984-10-13 1984-10-13 Panel type structural material using heat pipe

Publications (1)

Publication Number Publication Date
JPS6193391A true JPS6193391A (en) 1986-05-12

Family

ID=16661148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21476484A Pending JPS6193391A (en) 1984-10-13 1984-10-13 Panel type structural material using heat pipe

Country Status (1)

Country Link
JP (1) JPS6193391A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02115669U (en) * 1989-02-20 1990-09-17
US7726384B2 (en) * 2006-06-02 2010-06-01 Foxconn Technology Co., Ltd. Heat pipe
JP2011069608A (en) * 2009-09-28 2011-04-07 Asml Netherlands Bv Heat pipe, lithographic apparatus and device manufacturing method
NO339680B1 (en) * 2014-07-02 2017-01-23 Goodtech Recovery Tech As lattice Manifold

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02115669U (en) * 1989-02-20 1990-09-17
US7726384B2 (en) * 2006-06-02 2010-06-01 Foxconn Technology Co., Ltd. Heat pipe
JP2011069608A (en) * 2009-09-28 2011-04-07 Asml Netherlands Bv Heat pipe, lithographic apparatus and device manufacturing method
NO339680B1 (en) * 2014-07-02 2017-01-23 Goodtech Recovery Tech As lattice Manifold

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