JPS6191363A - Method for subjecting plastic to electroless plating - Google Patents
Method for subjecting plastic to electroless platingInfo
- Publication number
- JPS6191363A JPS6191363A JP59213986A JP21398684A JPS6191363A JP S6191363 A JPS6191363 A JP S6191363A JP 59213986 A JP59213986 A JP 59213986A JP 21398684 A JP21398684 A JP 21398684A JP S6191363 A JPS6191363 A JP S6191363A
- Authority
- JP
- Japan
- Prior art keywords
- electroless plating
- plating
- plastics
- rubber
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はプラスチック上への無電解メッキ方法に関する
ものでちる。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for electroless plating on plastics.
従来のプラスチック上への無電解メッキは第2図の如く
素材(1)を゛有機溶剤や酸化剤、酸、アルカリ−等で
エツチングして(5)、スズ(II)−パラジウム(I
I)系を主とするメッキ触[(3)を吸着させて(均か
ら無電解ハキ(4)、を施すのが一般的な方法である。Conventional electroless plating on plastic is performed by etching the material (1) with an organic solvent, oxidizing agent, acid, alkali, etc. (5) as shown in Figure 2, and then forming a tin (II)-palladium (I) plate.
I) A common method is to adsorb (3) and then apply electroless plating (4).
ところが、従来技術によれば無電解メッキの析出の
゛しやすさ1.つきまわり性、外観、及びメッキの密
着性を全て満足できるような素材はほとんどがABS糸
の樹脂に限定されてしまうが、ABS系の樹脂の物理的
、化学的特性はあまりすぐれていない。また各素材メー
カーからいくつかのメッキグレード樹脂が発売されてい
るがこれらの持つ様々な物理的、化学的特性に限界があ
り用途が限定されてしまうという欠点があるため総じて
プラスチック上への無電解メッキの適用範囲がきわめて
狭いものであった。さらにこういった欠点を除去すべく
第5図に示したような方法のためのABS系樹脂コーテ
ィング剤が市販されている。すなわち素材(1)を化学
的、物理的に活性化して(5)上記市販コーティング剤
(5)をコーティングしくB)周知の方法で解媒核(5
)を形成後(C)無電解メッキ(4)を施こす0もので
ある。しかし、上記の方法ではメッキとコーティング層
の密着性が向上する反面素材の活性化の工程が装置的、
工数的な面で不利になること更に活性化してもなお素材
の種類によっては素材とコーティング剤の密着性が充分
に得られないという欠点があり広くプラスチック全般に
適用できるものではない。However, according to the conventional technology, the precipitation of electroless plating is
Ease of use 1. Most materials that can satisfy all of the throwing power, appearance, and adhesion of plating are limited to ABS thread resins, but the physical and chemical properties of ABS resins are not very good. In addition, although several plating grade resins are released by various material manufacturers, they have the disadvantage that their various physical and chemical properties are limited and their applications are limited. The scope of application of plating was extremely narrow. Furthermore, in order to eliminate these drawbacks, ABS resin coating agents for the method shown in FIG. 5 are commercially available. That is, the material (1) is chemically and physically activated, and (5) the above-mentioned commercially available coating agent (5) is coated.
) is formed and then (C) electroless plating (4) is applied. However, while the above method improves the adhesion between the plating and coating layer, the process of activating the material is equipment-intensive and
It is disadvantageous in terms of man-hours, and even after activation, depending on the type of material, it may not be possible to obtain sufficient adhesion between the material and the coating agent, so it cannot be widely applied to plastics in general.
前述したように従来技術では、無電解メッキのつきまわ
りが曖れ、外観が良くかつメッキ層の密着性の良好なメ
ッキは限られた素材にしか施せず適用範囲がきわめて狭
いという問題点を有していた0
そこで本発明は、このような問題点を解決するもので1
.その目的とするところは、メッキつきまわり、外観及
び密着性の優れた無電解メッキを公知のあらゆるプラス
チック、プラスチック混合物及び無機物混入プラスチッ
クに施こすことが可能となることである。As mentioned above, the conventional technology has the problem that the coverage of electroless plating is unclear, and plating with good appearance and good adhesion of the plating layer can only be applied to a limited number of materials, and the range of application is extremely narrow. The present invention is intended to solve these problems.1
.. The purpose is to make it possible to apply electroless plating with excellent plating coverage, appearance, and adhesion to all known plastics, plastic mixtures, and inorganic-containing plastics.
本発明のプラスチック上へのメッキ方法は、第1図に示
した如く、無電解メッキを施こそうとすルフラスチック
表面(1)にABS系樹脂とニトリル系ゴムの混合物皮
膜(2)を形成しくB)その後、化学エツチング処理と
周知の触媒核(6)形成を行なって(c)無電解メッキ
(4)を施こす◎ことを特徴とする。As shown in Fig. 1, the method of plating on plastic according to the present invention involves forming a film (2) of a mixture of ABS resin and nitrile rubber on the plastic surface (1) on which electroless plating is to be applied. B) Thereafter, chemical etching treatment and well-known formation of catalyst nuclei (6) are performed, and (c) electroless plating (4) is performed.
なお、下地となるプラスチックの種類に応じて混合物皮
膜中のニトリル系ゴムの中に、クロa 7’レンゴム、
ウレタンゴムをはじめとする合成ゴム或いは、エポキシ
樹脂、フェノール樹脂をはじめとする合成樹脂のうち一
柿若しくは二種以上のものを混合しても良いっ
さらに、本発明の方法で形成される混合物皮膜は、その
組成については必要な要素が入っていれば他は自由でろ
シメッキつきまわり性や密着性を確保するためにα5μ
m以上の厚みがあることが好ましい。Depending on the type of underlying plastic, nitrile rubber in the mixture film may contain chlora 7'lene rubber,
One or more types of synthetic rubbers such as urethane rubber or synthetic resins such as epoxy resins and phenolic resins may be mixed, and the mixture film formed by the method of the present invention may also be used. The composition is free as long as it contains the necessary elements, and α5μ is used to ensure the coverage and adhesion of filter plating.
It is preferable to have a thickness of m or more.
以下、実施例に従って本発明の詳細な説明する。Hereinafter, the present invention will be explained in detail according to examples.
〔実施例1〕 本発明をナイロン−6への無電解メッキに適用した。[Example 1] The present invention was applied to electroless plating on nylon-6.
コーテイング液は以下のようなものを使用した。The following coating liquid was used.
コーティングは等速引き上げ法にょシ4み5μmとし、
コーテイング後150℃1時間の強制乾燥を行なった。The coating was done using a constant velocity pulling method, with a thickness of 4mm and 5μm.
After coating, forced drying was performed at 150° C. for 1 hour.
コーテイング後のナイロンは以下の組成のクロム−硫酸
混合液60℃で2分間エツチング後、茨亜硫酸ナトリウ
ムで中和し、以後、周知の無電解前処理プロセスすなわ
ち、塩化第1スズ−塩化パラジウム−塩酸系キャタリス
ト浸漬、硫酸系アクセレーター浸漬を経て無電解ニッケ
ルメッキを施こした。The coated nylon was etched with a chromium-sulfuric acid mixture having the following composition at 60°C for 2 minutes, neutralized with sodium sulfite, and then subjected to a well-known electroless pretreatment process: stannous chloride-palladium chloride-hydrochloric acid. Electroless nickel plating was applied after dipping in a catalyst system and sulfuric acid accelerator.
(エツチング液)
以下に、従来のナイロン−6への無電解メッキ方法と本
発明との比較を示す。(Etching Solution) A comparison between the conventional electroless plating method for nylon-6 and the present invention will be shown below.
表1. ナイロン−6上への無電解
メッキ比較表
表1からも明らかなように本発明によれば、一般に無電
解ニッケルがつきtlわりに<<、密着性も得にくいナ
イロン−6への無電解メッキのメッキ特性を向上させる
ことが可能になった。また、この他のナイロン−66や
レニーナイロンなど他の全てのナイロンにこの実施例−
1の内容があてはまった。Table 1. As is clear from Comparison Table 1 of electroless plating on nylon-6, according to the present invention, electroless plating on nylon-6, which is generally coated with electroless nickel and difficult to obtain adhesion, is improved. It has become possible to improve plating characteristics. In addition, this example applies to all other nylons such as nylon-66 and Renny nylon.
Item 1 applies.
〔実施例2〕 本発明をフェノール樹脂上の無電解メッキへ適用した。[Example 2] The present invention was applied to electroless plating on phenolic resin.
コーティング剤は以下のようなものを使用した。The following coating agent was used.
コーチインクハエアースプレーガンを用いたスプレー塗
装法とし、厚みは20μmとした。コーテイング後16
0℃で2時間強制乾燥を行なった。A spray coating method was used using a coach ink fly air spray gun, and the thickness was 20 μm. 16 after coating
Forced drying was performed at 0°C for 2 hours.
以下の工程については実施例1と同様で行ないメッキ層
のビール強度は従来の1.1〜O,5kg −crrを
”から1.5〜五〇に9−crIL−”へと増大し、メ
ッキ外観′も優れていた。The following steps were carried out in the same manner as in Example 1, and the beer strength of the plating layer was increased from the conventional 1.1~O, 5kg-crr to 1.5~50, 9-crIL-'', and the plating layer was The appearance was also excellent.
〔実施例3〕
本発明を通常無電解メッキが析出しにくいポリ塩化ビニ
/l/上の無電解メッキに通用した0コーテイング剤は
以下のようなものを使用した。[Example 3] The following coating agent was used in the present invention for electroless plating on polyvinyl chloride/l/, on which electroless plating is difficult to deposit.
コーティングはフローコーター法で行ない厚み30μm
とした。コーテイング後60℃で5時間強制乾燥を行な
った。Coating is done by flow coater method to a thickness of 30μm.
And so. After coating, forced drying was performed at 60° C. for 5 hours.
以下の工程については実施例1と同様で行ない従来無電
解メッキの析出が回帰であったポリ塩化ビニル上ヘビー
ル強度1.5〜2.5kg、crIL″l という゛密
着性の良好な無電解メッキ層が形成できた。The following steps were carried out in the same manner as in Example 1. Electroless plating with a heavy beer strength of 1.5 to 2.5 kg and good adhesion of crIL"l was performed on polyvinyl chloride, on which the precipitation of conventional electroless plating was regression. A layer was formed.
〔実施例4〕
実施例1と同様にしてガラスファイバーとメタルパウダ
ー含有のナイロン−6に無電解メッキを施こした。[Example 4] In the same manner as in Example 1, electroless plating was applied to nylon-6 containing glass fiber and metal powder.
但し、コーティング剤は以下のとおりでありコート方法
はスピンコード法で厚みを数水準とってそのメッキ密着
性(ビール強度)を表2(まとめた。However, the coating agent was as follows, and the coating method was the spin cord method, and several thickness levels were obtained, and the plating adhesion (beer strength) was summarized in Table 2.
(コーティング剤組成)
表2. ナイロン−6上への無電解
メッキ比較表
表2より明らかなようにコーティング厚みはCL5μm
以上であることが望ましく、密着性はコーティング厚み
と相関性がみられた。但しコーティング厚み5 p m
以上ではほぼ1.0〜2.5に9−cm−’の範囲に
入って安定している。(Coating agent composition) Table 2. As is clear from the electroless plating comparison table 2 on nylon-6, the coating thickness is CL5μm.
The above is desirable, and adhesion was found to be correlated with coating thickness. However, the coating thickness is 5 pm.
Above, it is stable within the range of approximately 1.0 to 2.5 and 9 cm-'.
以上述べたように本発明によれば、被メッキ体であるプ
ラスチック表面にABS−ニトリルゴム系のコーティン
グを行なうことによシ通常無電解メッキが困難なプラス
チック素材にも密着性−外観ともに優れた無電解メッキ
が施こせ、プラスチックのメタライジングの可能性に幅
が出るという効果を有する。As described above, according to the present invention, by applying an ABS-nitrile rubber coating to the plastic surface of the object to be plated, it is possible to achieve excellent adhesion and appearance even on plastic materials for which electroless plating is normally difficult. It has the effect of allowing electroless plating to be performed and expanding the possibilities of metallizing plastics.
なお、本発明は、全てのプラスチック及び複合プラスチ
ックの成形品、シートなどに適用が可能である。Note that the present invention can be applied to molded products, sheets, etc. of all plastics and composite plastics.
第1図A−Dは本発明の無電解メッキ工程を示す断面図
。
第2図A−C、第5図A−Dは従来法の工程図1・・・
プラスチック素祠
2・・・ABS糸樹脂+ニトリ〜系ゴム層5・・・触媒
4・・・無電解メッキ層
5・・・ABSコーティング層
以上FIGS. 1A-1D are cross-sectional views showing the electroless plating process of the present invention. Figures 2A-C and 5A-D are process diagrams 1 of the conventional method...
Plastic base 2...ABS thread resin + Nitri-based rubber layer 5...Catalyst 4...Electroless plating layer 5...ABS coating layer or above
Claims (3)
にABS系樹脂とニトリル系ゴムの混合物の皮膜を形成
後、エッチング処理及び無電解メッキ処理を行なうこと
を特徴とするプラスチック上への無電解メッキ方法。(1) Electroless plating on plastic, which is characterized by forming a film of a mixture of ABS resin and nitrile rubber on the surface of the plastic to be electrolessly plated, and then performing etching treatment and electroless plating treatment. Method.
ロプレンゴム、ウレタンゴムをはじめとする合成ゴム或
いはエポキシ樹脂、アクリル樹脂、フェノール樹脂をは
じめとする合成樹脂のうち少なくとも一種若しくは二種
以上の混合物で置換した特許請求の範囲第1項に記載の
プラスチック上への無電解メッキ方法。(2) In the above film composition, a part of the nitrile rubber is replaced by at least one or more of synthetic rubbers such as chloroprene rubber and urethane rubber, or synthetic resins such as epoxy resins, acrylic resins, and phenolic resins. A method for electroless plating on plastics according to claim 1, wherein the method is replaced with a mixture of.
くとも0.5μm以上である特許請求の範囲第1項又は
第2項に記載されたプラスチック上への無電解メッキ方
法。(3) The method for electroless plating on plastics according to claim 1 or 2, wherein the thickness of the film formed on the plastic surface is at least 0.5 μm or more.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59213986A JPS6191363A (en) | 1984-10-12 | 1984-10-12 | Method for subjecting plastic to electroless plating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59213986A JPS6191363A (en) | 1984-10-12 | 1984-10-12 | Method for subjecting plastic to electroless plating |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6191363A true JPS6191363A (en) | 1986-05-09 |
Family
ID=16648353
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59213986A Pending JPS6191363A (en) | 1984-10-12 | 1984-10-12 | Method for subjecting plastic to electroless plating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6191363A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0909119A2 (en) * | 1997-10-06 | 1999-04-14 | Ford Motor Company | Method for adhering a metallization to a substrate |
-
1984
- 1984-10-12 JP JP59213986A patent/JPS6191363A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0909119A2 (en) * | 1997-10-06 | 1999-04-14 | Ford Motor Company | Method for adhering a metallization to a substrate |
EP0909119A3 (en) * | 1997-10-06 | 2000-08-23 | Ford Motor Company | Method for adhering a metallization to a substrate |
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