JPS6190256U - - Google Patents
Info
- Publication number
- JPS6190256U JPS6190256U JP1984176005U JP17600584U JPS6190256U JP S6190256 U JPS6190256 U JP S6190256U JP 1984176005 U JP1984176005 U JP 1984176005U JP 17600584 U JP17600584 U JP 17600584U JP S6190256 U JPS6190256 U JP S6190256U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- package
- dielectric material
- wire
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003989 dielectric material Substances 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Filters And Equalizers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984176005U JPS6190256U (US07541385-20090602-C00001.png) | 1984-11-20 | 1984-11-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984176005U JPS6190256U (US07541385-20090602-C00001.png) | 1984-11-20 | 1984-11-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6190256U true JPS6190256U (US07541385-20090602-C00001.png) | 1986-06-12 |
Family
ID=30733603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984176005U Pending JPS6190256U (US07541385-20090602-C00001.png) | 1984-11-20 | 1984-11-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6190256U (US07541385-20090602-C00001.png) |
-
1984
- 1984-11-20 JP JP1984176005U patent/JPS6190256U/ja active Pending
