JPS6189814A - Molding method of resin product - Google Patents

Molding method of resin product

Info

Publication number
JPS6189814A
JPS6189814A JP21174184A JP21174184A JPS6189814A JP S6189814 A JPS6189814 A JP S6189814A JP 21174184 A JP21174184 A JP 21174184A JP 21174184 A JP21174184 A JP 21174184A JP S6189814 A JPS6189814 A JP S6189814A
Authority
JP
Japan
Prior art keywords
resin
mold
product
molding
molding material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21174184A
Other languages
Japanese (ja)
Inventor
Akira Yamabe
山部 晶
Toshihisa Fujiwara
稔久 藤原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Motor Co Ltd
Original Assignee
Nissan Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Motor Co Ltd filed Critical Nissan Motor Co Ltd
Priority to JP21174184A priority Critical patent/JPS6189814A/en
Publication of JPS6189814A publication Critical patent/JPS6189814A/en
Pending legal-status Critical Current

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  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

PURPOSE:To realize high quality and high strength molding of a resin product consisting of a main body part and a protruded part by a method wherein a moving mold retreats out of a product molding part when resin molding material is filled in the product molding part and, after that, takes the resin produce out of a mold. CONSTITUTION:When resin molding material 20 is filled in a mold 3 under the sate that the mold 3 is open, a moving mold 7 retreats, while applying back pressure to the resin molding material 20 by a protruding part molding part 6, and stops at its retreating limit so as to mold a resin product 21.When the moving mold advances, the protruding part 6 pushes the resin product 21 out in order to take the resin product 21 out of the mold. Consequently, the protruded part of the resin product causes to heighten the pressure in the resin molding material so as to uniformize the resin molding material and at the same time the density of the resin molding material, resulting in developing no sink, weld line and the like and obtaining a resin produce with high surface smoothness and high strength.

Description

【発明の詳細な説明】 〈産業上の利用分野〉 本発明はリブやボス等の突出部を有する樹脂製品の成形
方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a method of molding a resin product having protrusions such as ribs and bosses.

〈従来技術〉 従来、例えば第3図(5)に示すような自動車バンパー
181或いは第3図■に示すような自動車の外板部品で
あるフード2a等の樹脂製品であって、これら樹脂製品
の内表面にボス1bや補強用リブ2b等の突出部すを有
するものを成形する場合、射出成形法、圧縮成形法等に
よシ成形されるのが一般的であるが、いずれの成形法に
おいても金型の突出部bK対応する部分の容積が予め設
定されており、比較的粘度の高い樹脂成形材料が金型の
製品成形部内に充填され1ゆくときに、前記突出部すに
対応する部分で急に容積が増加して圧力が弱まる為に樹
脂が不均一になシ、これが原因で樹脂製品にひけやウェ
ルドライン等が生じ外観品質。
<Prior Art> Conventionally, resin products such as an automobile bumper 181 as shown in FIG. 3 (5) or a hood 2a which is an outer panel part of an automobile as shown in FIG. When molding items that have protrusions such as bosses 1b and reinforcing ribs 2b on their inner surfaces, injection molding, compression molding, etc. are generally used. The volume of the part corresponding to the protrusion bK of the mold is set in advance, and when the relatively high viscosity resin molding material is filled into the product molding part of the mold, the volume of the part corresponding to the protrusion bK is set in advance. As the volume suddenly increases and the pressure weakens, the resin becomes uneven, which causes sink marks and weld lines on the resin product, resulting in poor appearance.

特に表面平滑度が落ちた9、強度が落ちたシすることが
あった。
In particular, there were cases where the surface smoothness decreased and the strength decreased.

〈発明が解決しよ、うとする問題点〉 本発明は上記従来技術の問題点に鑑み、ボスやリプ等の
突出部を移動型によシ成形するようKしてこの突出部を
成形する部分を可動構造とし、金型内に樹脂成形材料を
充填した際、前記移動型にリ1脂成形材料より受ける押
圧力に対する背圧が加られつつ成形されることにより、
本体部と突出部とを有する樹脂製品を高品質で且つ高強
度に成形することを目的とするう 〈問題を解決するだめの手段〉 上記問題点を解決するための本発明は、コアとキャピテ
イとを有する金型内に形成した製品成形部内へ樹脂成形
材料を充填し、製品本体部と突出部とを有する樹脂製品
を成形する樹脂製品の成形方法において、前記金型の突
出部に対応する部分を移動型としてブロック化するとと
もに前記移動型を製品成形部内方向に付勢可能とし、前
記製品成形部内に樹脂成形材料が充填された際、前記移
動型は充填される樹脂成形材料に背圧を加えながら押圧
されることにより製品成形部外に後退し、その後前記樹
脂製品を金型内から取出すようにしたことを特徴とする
樹脂製品の成形方法である。
<Problems to be Solved by the Invention> In view of the above-mentioned problems of the prior art, the present invention provides a method for forming protrusions such as bosses and lips using a movable die, and a part in which the protrusions are formed. has a movable structure, and when the mold is filled with a resin molding material, molding is performed while applying back pressure to the movable mold against the pressing force received from the resin molding material,
[Means for solving the problem] The present invention aims to mold a resin product having a main body and a protruding part with high quality and high strength. In a method for molding a resin product, in which a resin molding material is filled into a product molding part formed in a mold having a product body part and a protrusion part, a resin product having a product body part and a protrusion part corresponding to the protrusion part of the mold is formed. The movable mold is made into a block as a movable mold, and the movable mold can be biased inward to the product molding section, and when the product molding section is filled with resin molding material, the movable mold applies back pressure to the resin molding material being filled. This is a method for molding a resin product, characterized in that the resin product is pushed out of the product molding section by being pressed while applying pressure, and then the resin product is taken out from inside the mold.

く作用〉 上記の成形方法により本案は突出部を移動型により成形
するようKL?この突出部を成形する部分を可動溝造と
し、金型内に樹脂成形材料を充瞑した際、前記移動型が
樹脂成形材料に背圧を加えながら成形されるので、この
部分で圧力が高まって樹脂成形材料が均一となると共に
密度が高くなシ、樹脂製品にひけやウェルドライン等が
発生せず、しかも表面平滑度が高く、且つ強度の高いも
のが得られることになる。
Effect〉 According to the above-mentioned molding method, the projecting part is molded by a movable mold. The part that molds this protrusion is made of a movable groove structure, and when the mold is filled with resin molding material, the movable mold applies back pressure to the resin molding material while molding, so the pressure increases in this part. As a result, the resin molding material becomes uniform and has a high density, and the resin product does not have sink marks or weld lines, and has a high surface smoothness and high strength.

〈実施例〉 次に、図示する本発明の実施例に基づい1説明する。第
1図囚〜Dは本発明の一実施例に係る圧縮成形法による
樹脂成形金型の要部を示す図であり、金型3はコア4と
キャピテイ5とを有しており、コア4はキャビティ5に
対して上下方向に移動自在となっている。又、樹脂製品
21の突出部すに対応しこれを成形する突出部成形部6
を先端に有する移動型7が突出部すで製品成形部内外両
方向に往復動自在に設けられており、(以下の説明では
製品成形部内方向を前進方向、製品成形部外方向を後退
方向とする。、)該移動型7にはこれを後退する方向に
付勢すべくコイルばね8が設けられていると共に、型内
に樹脂成形材料20が充填された際に、これに背圧を加
えるべく移動型7にはこれを前進させる背圧装置9が設
けられており、この背圧装置9はポンプ9a、圧力媒体
としての油9b、管9 c +弁9dよシ構成されてい
る。
<Example> Next, an explanation will be given based on the illustrated example of the present invention. FIGS. 1-D are diagrams showing essential parts of a resin molding mold by compression molding according to an embodiment of the present invention. The mold 3 has a core 4 and a cavity 5. is movable vertically with respect to the cavity 5. Further, a protrusion molding section 6 corresponding to and molding the protrusion of the resin product 21 is provided.
A movable die 7 having a protrusion at its tip is provided so as to be able to reciprocate both inside and outside the product forming section (in the following explanation, the inside direction of the product forming section is referred to as the forward direction, and the direction outside the product forming section is referred to as the backward direction). .) The movable mold 7 is provided with a coil spring 8 to bias it in the backward direction, and is also provided with a coil spring 8 to apply back pressure to the resin molding material 20 when the mold is filled with the resin molding material 20. The movable mold 7 is provided with a back pressure device 9 for moving it forward, and this back pressure device 9 is composed of a pump 9a, oil 9b as a pressure medium, a pipe 9c + a valve 9d.

さらにコア4部にはこれの上下動を感知してポンプ9a
の作動を制御するスイッチ10及び制御盤10bが取付
けられ、ここからポンプ9aに配線され1いる。
Furthermore, the core 4 part detects the vertical movement of the core part 4 and pumps 9a.
A switch 10 and a control panel 10b for controlling the operation of the pump 9a are installed, and wired from there to the pump 9a.

次に、上述の゛ような金型3を用いて樹脂製品21を成
形する方法について説明すると、まず第1図(2)に示
すように金型3が開いた状態で型内に樹脂成形材料20
が充填される。このときはスイッチ10によシボンプ9
aが作動せず、移動型7はコイルばね8に付勢されて後
退限に位置し工いる。
Next, to explain the method of molding the resin product 21 using the mold 3 as described above, first, as shown in FIG. 20
is filled. At this time, switch 10 and pump 9
a does not operate, and the movable die 7 is biased by the coil spring 8 and positioned at the backward limit.

そして同図(B)に示すようにコア4が下降し、スイッ
チ10がこれを感知することによシボンプ9aが作動す
る。これにより移動型7が前進限に移動し、次いで同図
0に示すようにコア4が下降限に位置し1型締めされる
際、スイッチ10がこれを感知することにより、ポンプ
9aの出力が1氏下し、移動型7が樹脂成形材料20と
コイルばね8から受ける押圧力よりも圧力媒体9bから
受ける押圧力が小さくなシ、移動型7は突出部成形部6
で樹脂成形材料20に背圧を加えつつ後退し又後退限で
停止し、樹脂製品21が成形される。その後同図0で示
すようにコア4が上昇し、スイッチ10がこれを感知す
ることで再びポンプ9aの出力が上昇し、移動型が前進
する。これにより突出部すでひけやウェルドライン等が
発生せず、しかも表面平rR度が高く、且つ強度の高い
樹脂製品21が押出され型外に取出されることになる。
Then, as shown in FIG. 2B, the core 4 descends, and the switch 10 senses this, thereby operating the pump 9a. As a result, the movable mold 7 moves to the forward limit, and then, as shown in FIG. 1 degree, the movable mold 7 receives a smaller pressing force from the pressure medium 9b than the pressing force received from the resin molding material 20 and the coil spring 8, and the movable mold 7
At this point, the resin molding material 20 is retracted while applying back pressure and stopped at the retraction limit, thereby molding the resin product 21. Thereafter, as shown in FIG. 0, the core 4 rises, and when the switch 10 senses this, the output of the pump 9a rises again, and the movable type moves forward. As a result, a resin product 21 that does not cause sink marks or weld lines due to the protrusion, has a high surface smoothness, and has high strength is extruded and taken out of the mold.

すなわち、樹脂成形材料20が型内に充」ヌされた際に
該61 rI成形材料20に背圧を加える移動型7は製
品成形後に樹脂製品21を型内より押し出す為のエジェ
クトピンとしての役割をも有していることになる−その
後同図(4)に示す工程が始まシ以下同様のサイクルが
繰り返される。
That is, the movable die 7 that applies back pressure to the 61rI molding material 20 when the resin molding material 20 is filled into the mold serves as an eject pin to push out the resin product 21 from the mold after the product is molded. After that, the process shown in (4) of the same figure begins, and the same cycle is repeated thereafter.

第2図(4)〜0は本発明の他の実施例に係る射出成形
方法による樹脂成形金型の要部を示す図であリ、第1図
(A)〜0と同一部材には同一符号を付し、一部説明を
省略する。その措成を説明すると、金型3aはコア4と
キャビティ5とを有し、キャビティ5には型内に樹脂成
形材料20を射出する射出成形機のノズル30が取付け
られており、第1図で示したものと同様にコイルばね8
によジ後退方向に付勢された移動型8及び移動型8に背
圧を加えるべく背圧装置9が取9付けられていると共に
1金型3a型内にはこれの流体圧を検知する圧力検知装
置10aが取付けられており、ポンプ9aK配線されて
いる。
FIGS. 2(4) to 0 are views showing the main parts of a resin molding die formed by an injection molding method according to another embodiment of the present invention. Reference numerals are given and some explanations are omitted. To explain its structure, the mold 3a has a core 4 and a cavity 5, and a nozzle 30 of an injection molding machine for injecting a resin molding material 20 into the mold is attached to the cavity 5, as shown in FIG. Coil spring 8 similar to the one shown in
A back pressure device 9 is installed in order to apply back pressure to the movable mold 8 and the movable mold 8 which are urged in the backward direction, and the fluid pressure of this is detected in the mold 1 mold 3a. A pressure detection device 10a is attached and a pump 9aK is wired.

次に、上述のような金型3aを用いて樹脂製品21を成
形する方法について説明すると、まず金型3aが第2図
囚に示すようにポンプ9aの作動により移動型7が突出
した状態から第2図(B)に示すように金型3内に樹脂
成形材料20が射出充填される。すると圧力検知装置1
0aがこれを感知し、ポンプ9aの出力が低下する。す
ると同図0で示したように移動型7が樹脂成形材料20
とコイルばね8から受ける押圧力よりも圧力媒体9bか
ら受ける押圧力が小さくなり、移動型7は突出部成形部
6で樹脂成形材料20に背圧を加えつつ後退して後退限
で停止し、樹脂製品21が成形される。
Next, a method for molding the resin product 21 using the mold 3a as described above will be explained. First, the mold 3a is moved from the state in which the movable mold 7 protrudes by the operation of the pump 9a as shown in FIG. As shown in FIG. 2(B), a resin molding material 20 is injected and filled into the mold 3. Then pressure detection device 1
0a senses this and the output of pump 9a decreases. Then, as shown in Figure 0, the movable mold 7 moves the resin molding material 20.
The pressing force received from the pressure medium 9b becomes smaller than the pressing force received from the coil spring 8, and the movable mold 7 retreats while applying back pressure to the resin molding material 20 with the protrusion molding part 6, and stops at the retreat limit. A resin product 21 is molded.

その後、同図■で示すようにコア4が上昇し、圧力検知
装置10aの作用により再びポンプ9aの出力が上昇し
、移動型7が前進する。これにより突出部すでひけやウ
ェルドライン等が発生せず、しかも表面平滑度が高く、
且つ強度の高い樹脂製品が押出され型外に取出されるこ
とになる。その後同図囚に示す工程が始まシリ下同様の
サイクルが繰り返される。
Thereafter, the core 4 rises as shown by ``■'' in the same figure, and the output of the pump 9a rises again due to the action of the pressure detection device 10a, and the movable die 7 moves forward. As a result, no sink marks or weld lines occur due to the protrusion, and the surface is highly smooth.
Moreover, a resin product with high strength is extruded and taken out of the mold. After that, the process shown in the figure begins, and the same cycle is repeated.

尚、本発明の成形方法に適用する為の樹脂成形金型の実
施例では、移動型をコイルばねと油圧回路により駆動さ
せていたが、こ五に限らず、機械的に例えばカム等を使
用して上型の位置によシ移動型を駆動させてもよいし、
又移動型をばね等の弾性体によシ前進方向に付勢させる
のみであってもよい。(但し、この場合には移動型は成
形後に樹脂製品を型内より押出すことはできないのでエ
ジェクトピンが別途必要となる。)又、この移動型は製
品形状、又は型の製作上により上型に取付けてもよい。
In the embodiment of the resin molding mold applied to the molding method of the present invention, the movable mold was driven by a coil spring and a hydraulic circuit, but the movable mold is not limited to a rotor, and mechanical devices such as a cam etc. can also be used. The movable mold may be driven according to the position of the upper mold, or
Alternatively, the movable mold may be simply urged in the forward direction by an elastic body such as a spring. (However, in this case, the movable mold cannot extrude the resin product from inside the mold after molding, so a separate eject pin is required.) Also, this movable mold cannot be used with the upper mold depending on the product shape or mold manufacturing. It may be installed on.

さらに又、移動型の制御についても第1図で示した圧縮
成形法でスイッチ10を使用し、第2図で示した射出成
形法で圧力検知装置10aを使用したが、伺ら成形法に
よシ限定されるものではなく、前者、後者を逆に使用し
′″LL制御なつ1もよい。
Furthermore, regarding the control of the mobile mold, the switch 10 was used in the compression molding method shown in FIG. 1, and the pressure sensing device 10a was used in the injection molding method shown in FIG. However, the former and the latter may be used inversely to perform LL control.

〈発明の効果〉 以上のように本発明によればコアとキャビティとを有す
る金型内に形成した製品成形部内へ樹脂成形材料を充填
し、製品本体部と突出部とを1丁する樹脂製品を成形す
る樹脂製品の成形方法において、前記金型の突出部に対
応する部分を移動型とじ1ブロツク化するとともに前記
移動型を製品成形部内方向に付勢h」能とし、前記製品
成形部内に樹脂成形材料が充がされた際、前記移動型は
充実される樹脂成形材料に背圧を加えながら押圧される
ことにより %品成形部外に後退し、七の後前記樹脂製
品を金型内から取出すようにしたので、樹脂製品の突出
部で圧力が高まって樹脂成形材料が均一になると共に、
密度が高まる為にひけやウェルドライン等が発生せず、
しかも表面平滑度が高く、且つ強度の高いものが得られ
る。さらに、本発明の成形方法に適用する為の樹脂成形
金型の実施例にあつ工は、樹脂成形材料が型内に充填さ
れた際に該樹脂成形材料に背圧を加える移動型は成形後
に樹脂製品を型内より押出す為のエジェクトピンとし又
の役割も兼ね備えているので、エジェクトピンが不用と
゛なり、型費が大幅に低減できる。
<Effects of the Invention> As described above, according to the present invention, a resin molding material is filled into a product molding part formed in a mold having a core and a cavity, and a resin product having a product main body part and a protrusion part is produced. In a method for molding a resin product, a portion of the mold corresponding to the protrusion is closed into one block by a movable mold, and the movable mold is biased toward the inside of the product molding section, When the resin molding material is filled, the movable mold is pressed while applying back pressure to the resin molding material being filled, and retreats to the outside of the product molding section. Since the resin product is taken out from the outside, the pressure increases at the protruding parts of the resin product, making the resin molding material uniform, and
Due to the increased density, sink marks and weld lines do not occur,
Moreover, a product with high surface smoothness and high strength can be obtained. Furthermore, in the embodiment of the resin molding mold for application to the molding method of the present invention, a movable mold that applies back pressure to the resin molding material when the resin molding material is filled into the mold is used after molding. Since it also serves as an eject pin for extruding the resin product from the mold, the eject pin becomes unnecessary and mold costs can be significantly reduced.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図囚〜■は本発明の一実施例に係る樹脂製品の成形
方法及びこれを適用するだめの圧縮成形型を示す要部断
面図。 第2図囚〜■は本発明の他の実施例に係る樹脂製品の成
形方法及びこれを適用するための射出成形型を示す要部
断面図。 第3図回出)は突出部を有する樹脂製品を示す斜視図で
ある。 3.3a・・・金型、4・・・コア、5・・・キャビテ
ィ、6・・・突出部成形部、7・・・移動型、8・・・
コイルばね、9・・・背圧装置、20・・・樹脂成形材
料、21・・・樹脂製品 第1図 (A) 乙 第1図 (C) (D) 第2図 (A) (Bン 第2図 (C) (D) 第3図
FIGS. 1-3 are cross-sectional views of essential parts showing a method for molding a resin product according to an embodiment of the present invention and a compression mold to which the method is applied. FIGS. 2-2 are sectional views of essential parts showing a method of molding a resin product according to another embodiment of the present invention and an injection mold for applying the same. FIG. 3 is a perspective view showing a resin product having a protrusion. 3.3a...Mold, 4...Core, 5...Cavity, 6...Protrusion molding part, 7...Movable mold, 8...
Coil spring, 9...Back pressure device, 20...Resin molding material, 21...Resin product Figure 1 (A) Figure 1 (C) (D) Figure 2 (A) (B Figure 2 (C) (D) Figure 3

Claims (1)

【特許請求の範囲】[Claims] コアとキャビティとを有する金型内に形成した製品成形
部内へ樹脂成形材料を充填し、製品本体部と突出部とを
有する樹脂製品を成形する樹脂製品の成形方法において
、前記金型の突出部に対応する部分を移動型としてブロ
ック化するとともに前記移動型を製品成形部内方向に付
勢可能とし、前記製品成形部内に樹脂成形材料が充填さ
れた際、前記移動型は充填される樹脂成形材料に背圧を
加えながら押圧されることにより製品成形部外に後退し
、その後前記樹脂製品を金型内から取出すようにしたこ
とを特徴とする樹脂製品の成形方法。
In a method for molding a resin product, in which a resin molding material is filled into a product molding part formed in a mold having a core and a cavity, and a resin product having a product main body part and a protrusion part is molded, the protrusion part of the mold is The movable mold is made into a block by a movable mold, and the movable mold can be biased inward to the product molding section, and when the product molding section is filled with the resin molding material, the movable mold can be used as a movable mold to block the movable mold. A method for molding a resin product, characterized in that the resin product is pushed out of the product molding section by being pressed while applying back pressure, and then the resin product is taken out from inside the mold.
JP21174184A 1984-10-09 1984-10-09 Molding method of resin product Pending JPS6189814A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21174184A JPS6189814A (en) 1984-10-09 1984-10-09 Molding method of resin product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21174184A JPS6189814A (en) 1984-10-09 1984-10-09 Molding method of resin product

Publications (1)

Publication Number Publication Date
JPS6189814A true JPS6189814A (en) 1986-05-08

Family

ID=16610813

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21174184A Pending JPS6189814A (en) 1984-10-09 1984-10-09 Molding method of resin product

Country Status (1)

Country Link
JP (1) JPS6189814A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02219613A (en) * 1989-02-21 1990-09-03 Sekisui Chem Co Ltd Compression molding method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58122835A (en) * 1982-01-18 1983-07-21 Omron Tateisi Electronics Co Mold for injection molding

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58122835A (en) * 1982-01-18 1983-07-21 Omron Tateisi Electronics Co Mold for injection molding

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02219613A (en) * 1989-02-21 1990-09-03 Sekisui Chem Co Ltd Compression molding method

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