JPS6185007U - - Google Patents
Info
- Publication number
- JPS6185007U JPS6185007U JP1984170363U JP17036384U JPS6185007U JP S6185007 U JPS6185007 U JP S6185007U JP 1984170363 U JP1984170363 U JP 1984170363U JP 17036384 U JP17036384 U JP 17036384U JP S6185007 U JPS6185007 U JP S6185007U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- light emitting
- large number
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984170363U JPS6346972Y2 (US20020095090A1-20020718-M00002.png) | 1984-11-12 | 1984-11-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984170363U JPS6346972Y2 (US20020095090A1-20020718-M00002.png) | 1984-11-12 | 1984-11-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6185007U true JPS6185007U (US20020095090A1-20020718-M00002.png) | 1986-06-04 |
| JPS6346972Y2 JPS6346972Y2 (US20020095090A1-20020718-M00002.png) | 1988-12-05 |
Family
ID=30728070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984170363U Expired JPS6346972Y2 (US20020095090A1-20020718-M00002.png) | 1984-11-12 | 1984-11-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6346972Y2 (US20020095090A1-20020718-M00002.png) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03116510U (US20020095090A1-20020718-M00002.png) * | 1990-03-08 | 1991-12-03 | ||
| JPH11163412A (ja) * | 1997-11-25 | 1999-06-18 | Matsushita Electric Works Ltd | Ｌｅｄ照明装置 |
| JP2005136224A (ja) * | 2003-10-30 | 2005-05-26 | Asahi Kasei Electronics Co Ltd | 発光ダイオード照明モジュール |
| JP2006128265A (ja) * | 2004-10-27 | 2006-05-18 | Kyocera Corp | 発光素子用配線基板ならびに発光装置 |
| JP2006332234A (ja) * | 2005-05-25 | 2006-12-07 | Hitachi Aic Inc | 反射機能を有するｌｅｄ装置 |
| JP2006344771A (ja) * | 2005-06-09 | 2006-12-21 | Hitachi Aic Inc | Ｌｅｄ装置用反射体およびその製造方法 |
-
1984
- 1984-11-12 JP JP1984170363U patent/JPS6346972Y2/ja not_active Expired
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03116510U (US20020095090A1-20020718-M00002.png) * | 1990-03-08 | 1991-12-03 | ||
| JPH11163412A (ja) * | 1997-11-25 | 1999-06-18 | Matsushita Electric Works Ltd | Ｌｅｄ照明装置 |
| JP2005136224A (ja) * | 2003-10-30 | 2005-05-26 | Asahi Kasei Electronics Co Ltd | 発光ダイオード照明モジュール |
| JP2006128265A (ja) * | 2004-10-27 | 2006-05-18 | Kyocera Corp | 発光素子用配線基板ならびに発光装置 |
| JP2006332234A (ja) * | 2005-05-25 | 2006-12-07 | Hitachi Aic Inc | 反射機能を有するｌｅｄ装置 |
| JP2006344771A (ja) * | 2005-06-09 | 2006-12-21 | Hitachi Aic Inc | Ｌｅｄ装置用反射体およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6346972Y2 (US20020095090A1-20020718-M00002.png) | 1988-12-05 |
