JPS6184880A - Solid-state light emitting display - Google Patents
Solid-state light emitting displayInfo
- Publication number
- JPS6184880A JPS6184880A JP59207826A JP20782684A JPS6184880A JP S6184880 A JPS6184880 A JP S6184880A JP 59207826 A JP59207826 A JP 59207826A JP 20782684 A JP20782684 A JP 20782684A JP S6184880 A JPS6184880 A JP S6184880A
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- emitting diode
- pellets
- emitting diodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
- G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Abstract
Description
【発明の詳細な説明】
く技術分野〉
本発明は複数の発光ダイオードにより形成した固体発光
表示装置（以下、ＬＥＤう・ンプという）に関する。DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a solid state light emitting display device (hereinafter referred to as an LED display device) formed by a plurality of light emitting diodes.
〈従来技術〉
一般に、発光ダイオードは、順電流ＩＰの増加と共に輝
度【Ｖが
Ｉ ＶＣＣ１、＋−ｔ、ｒ
の関係で増加する。また、順電圧ＶＦと順電流ＩＦは
ＩＦｃＣｅｘｐ （ｑ ＶＦ ／４ Ｔ）の関係を
有する。ただし、ｑは電子の電荷、ルはボルツマン定数
、Ｔは絶対温度である。この関係から、順電圧ＶＦの僅
かな変化により、順電流ＩＦ及び輝度１ｖが急激に変化
する。したがって、ＬＥＤランプの個々の発光ダイオー
ドの発光強度を制御してＬＥＤランプの表示の明るさを
制御することは困難である。<Prior Art> In general, in a light emitting diode, as the forward current IP increases, the brightness [V increases with the relationship of IVCC1,+-t,r. Further, the forward voltage VF and the forward current IF have a relationship of IFcCexp (q VF /4 T). However, q is the electron charge, le is Boltzmann's constant, and T is the absolute temperature. From this relationship, a slight change in forward voltage VF causes a sudden change in forward current IF and brightness 1v. Therefore, it is difficult to control the brightness of the display of the LED lamp by controlling the light emission intensity of each light emitting diode of the LED lamp.
一方、異なった色の発光を合成すると、個々の発光とは
異なった色調の合成光が得られる。また、この合成光の
色調は、個々の発光の明るさを変えることにより連続的
に変化する。したがって、異なった発光色をもつ２種類
以上の発光ダイオードを組み合わせ、夫々の発光ダイオ
ードの発光を合成すると、異なった色調の発光が得られ
るのであるが、上述のように、発光ダイオードの発光強
度を制御することが困難であるので、発光ダイオードの
発光強度を変えてＬＥＤランプの色調を制御することは
できない。On the other hand, when light emissions of different colors are combined, combined light with a different color tone from the individual light emissions is obtained. Moreover, the color tone of this combined light changes continuously by changing the brightness of each light emitted. Therefore, if you combine two or more types of light emitting diodes that emit light of different colors and synthesize the light emitted from each light emitting diode, you can obtain light with different tones, but as mentioned above, the light emitting intensity of the light emitting diodes can be Since it is difficult to control, it is not possible to control the color tone of the LED lamp by changing the light emission intensity of the light emitting diode.
第３図は従来から用いられているレベルメータを示して
おり、このレベルメータは、複数の発光ダイオードベレ
ット１３．１３．−・−のそれぞれが反射板１４で仕切
られ、それぞれの発光ダイオードペレット１３と反射板
１４の間に樹脂レンズ１５が充填される。そして、この
）躬脂レンズ１５の上面が発光窓１５ａを形成し、各発
光ダイオードペレット１３についてこの発光窓１５ａが
それぞれ独立して設けられるとともに、複数の発光窓１
５ａ。FIG. 3 shows a conventionally used level meter, which includes a plurality of light emitting diode pellets 13.13. -.- are each partitioned by a reflecting plate 14, and a resin lens 15 is filled between each light emitting diode pellet 13 and the reflecting plate 14. The upper surface of this) resin lens 15 forms a light emitting window 15a, and this light emitting window 15a is provided independently for each light emitting diode pellet 13, and a plurality of light emitting windows 1
5a.
１５ ａ 、 −が帯状に配列される。このレベルメー
タにおいては、入力信号のレベルに応じて、発光ダイオ
ードペレット１３の発光個数を変えることにより、光を
照射する発光窓１５ａの数を変え、帯状の発光の長さに
よって、入力信号のレベルを表示する。15 a, - are arranged in a band shape. In this level meter, the number of light emitting windows 15a that emit light is changed by changing the number of light emitting diode pellets 13 according to the level of the input signal, and the level of the input signal is changed depending on the length of the band-shaped light emission. Display.
このレベルメータは、表示自体の明るさを変えるもので
はなく、さらに、複数の発光ダイオードベレン）１３．
１３．−の夫々の発光色は同一であり、しかも、個々の
発光ダイオードペレット１３゜１３、−−−の夫々の発
光は独立して外部に照射され、発光が合成されて異なっ
た色調の合成光が得られるものではない。This level meter does not change the brightness of the display itself, and it also uses multiple light emitting diodes.13.
13. The emitted light color of each of - is the same, and the emitted light of each light emitting diode pellet 13゜13, --- is independently irradiated to the outside, and the emitted light is combined to produce composite light of different colors. It's not something you can get.
〈発明の目的〉
本発明は上記事情に鑑みてなされたものであり、その目
的は、表示の色調と明るさを変えることができるように
したＬＥＤランプを提供することである。<Objective of the Invention> The present invention has been made in view of the above circumstances, and its object is to provide an LED lamp that can change the color tone and brightness of the display.
〈発明の構成〉
本発明においては、基板上に搭載された２種類以上の発
光色が異なる複数の発光ダイオードが光反射部材で包囲
されるとともに上記複数の発光ダイオードと上記光反射
部材とが樹脂レンズで一体的に覆われて形成された発光
部と、発光する発光ダイオードの数を入力信号に応じて
可変として上記複数の発光ダイオードを制御する制御回
路とを備えたことを特徴とする。<Structure of the Invention> In the present invention, a plurality of light emitting diodes mounted on a substrate and emitting two or more different colors of light are surrounded by a light reflecting member, and the plurality of light emitting diodes and the light reflecting member are made of resin. The present invention is characterized in that it includes a light emitting section formed integrally covered with a lens, and a control circuit that controls the plurality of light emitting diodes by making the number of light emitting diodes that emit light variable in accordance with an input signal.
〈実施例〉 以下、本発明の一実施例について説明する。<Example> An embodiment of the present invention will be described below.
第１図はＬＥＤランプの断面構成を示す。基板２上に２
種類以上の発光色が異なる複数の発光ダイオードペレッ
ト３，３．−が搭載され、この複数の発光ダイオードベ
レット３，３．−・を包囲して反射板４が配置され、さ
らに、反射板４の裏面側の基板２上に発光ダイオードの
制御回路を形成した集積回路５が搭載される。基板２の
裏面には、リードピン６が取り付けられる。そして、上
述の基板２．複数の発光ダイオードペレット３，３゜−
１反射板４．集槓回路５並びにリードピン６が樹脂７に
て包囲されて一体化される。樹脂７の発光ダイオードペ
レッ）３． ３．−・−と反射板４とを共通的に覆う部
分は、樹脂レンズ７ａを形成する。FIG. 1 shows a cross-sectional configuration of an LED lamp. 2 on board 2
A plurality of light emitting diode pellets 3,3. - is mounted, and the plurality of light emitting diode pellets 3, 3 . A reflector plate 4 is disposed surrounding the reflector plate 4, and an integrated circuit 5 on which a control circuit for a light emitting diode is formed is mounted on the substrate 2 on the back side of the reflector plate 4. Lead pins 6 are attached to the back surface of the substrate 2. Then, the above-mentioned substrate 2. Multiple light emitting diode pellets 3,3°-
1 Reflector 4. The collector circuit 5 and lead pin 6 are surrounded by resin 7 and integrated. Light emitting diode pellet of resin 7)3. 3. A portion that commonly covers the reflective plate 4 and the reflective plate 4 forms a resin lens 7a.
上述のり、、ＥＤランプ１においては、複数の発光ダイ
オードペレット３，３．・−のそれぞれの発光は、共通
の反射板４および樹脂レンズ７ａにより合成されて外部
に照射される。この樹脂レンズ７ａから照射される光は
、個々の発光ダイオードペレット３の発光色とは異なる
合成された色調を有する。そして、複数の発光ダイオー
ドペレット３゜３、−・のうちの発光色の種類ごとに発
光する発光ダイオードペレット３の数を変えると、樹脂
レンズ７ａから外部に照射される光の色調と明るさが変
わる。すなわち、集積回路５に与える入力信号のレベル
を変えることにより、この入力信号のレベルに応じて発
光ダイオードベレット３，３．−の発光色の種類ごとに
発光個数を変え、ＬＥＤランプ１の表示の色調と明るさ
を変えることができる。例えば、発光ダイオードペレッ
ト３，３．−のうち発光色が赤色である発光ダイオード
ペレット３，３．−・と発光色が緑色である発光ダイオ
ードペレット３，３．−・をそれぞれ等しい数だけ発光
させると、樹脂レンズ７ａから照射される光は黄色であ
る。そして、発光色が赤色の発光ダイオードペレッＩ−
３，３，−と発光色が緑色の発光ダイオードベレット３
，３．−・の発光する発光ダイオードペレット３の個数
の割合を変えると、ＬＥＤランプ１の表示の色調は赤と
緑の間で段階的に変化する。In the above-mentioned glue, ED lamp 1, a plurality of light emitting diode pellets 3, 3 . The respective light emissions of - are combined by the common reflecting plate 4 and resin lens 7a and irradiated to the outside. The light emitted from the resin lens 7a has a combined color tone that is different from the emission color of the individual light emitting diode pellets 3. Then, by changing the number of light emitting diode pellets 3 that emit light for each type of emitted light color among the plurality of light emitting diode pellets 3゜3, -., the color tone and brightness of the light irradiated from the resin lens 7a to the outside can be changed. change. That is, by changing the level of the input signal applied to the integrated circuit 5, the light emitting diode pellets 3, 3, . - By changing the number of light emitting lights for each type of light emitting color, the color tone and brightness of the display of the LED lamp 1 can be changed. For example, light emitting diode pellets 3, 3. -Light emitting diode pellets whose luminescent color is red 3, 3. -・ and light emitting diode pellets 3, 3. whose luminescent color is green. -. When the same number of lights are emitted, the light emitted from the resin lens 7a is yellow. Then, a light emitting diode pellet I- whose luminescent color is red
3, 3, - and light emitting diode bellet 3 with green emission color
,3. - When the ratio of the number of light emitting diode pellets 3 that emit light is changed, the color tone of the display of the LED lamp 1 changes stepwise between red and green.
第２図はＬＥＤランプ１とその周辺回路の回路構成を示
す。破線の枠内の回路がＬＥＤランプ１の回路であり、
上述の複数の発光ダイオードペレッ）３．３．−・−に
より形成される複数の発光ダイオードＤＩ、Ｄ２．−・
・及び複数の発光ダイオードＤＩ’、Ｄ２’、−・−と
、上述の集積回路５に形成されるレベルメータ用発光ダ
イオード駆動回路１２とを備える。発光ダイオードＤｌ
、０２．−は発光が赤色であり、発光ダイオードＤＩ’
、Ｄ２’。FIG. 2 shows the circuit configuration of the LED lamp 1 and its peripheral circuits. The circuit within the dashed line is the circuit of LED lamp 1,
(a plurality of light emitting diode pellets as described above) 3.3. A plurality of light emitting diodes DI, D2. −・
and a plurality of light emitting diodes DI', D2', --, and a level meter light emitting diode drive circuit 12 formed in the above-mentioned integrated circuit 5. light emitting diode Dl
, 02. − indicates red light emission, and the light emitting diode DI'
, D2'.
−は発光が線色である。端子８は発光ダイオードＤｌ、
Ｄ２．− を点灯制御する信号が入力される信号端子、
端子９は電源端子、端子１０は接地端子、端子１１は発
光ダイオードＤｌ’、Ｄ２’。- indicates that the light emission is line color. Terminal 8 is a light emitting diode Dl,
D2. − A signal terminal into which a signal to control lighting is input;
Terminal 9 is a power supply terminal, terminal 10 is a ground terminal, and terminal 11 is a light emitting diode Dl', D2'.
−を点灯制御する信号が入力される信号端子である。This is a signal terminal into which a signal to control the lighting of - is input.
レベルメータ用発光ダイオード駆動回路１２は、発光ダ
イオードＤＩ、Ｄ２．−のうち端子８に与えられた入力
信号のレベルに応じた数の発光ダイオードを発光させ、
発光ダイオードＤｌ’、、Ｄ２’−のうち端子１１に与
えられた入力信号のレベルに応じた数の発光ダイオード
を発光させる。したがって、端子８と端子１１の入力信
号のレベルを個々に変えることによって、ＬＥＤランプ
１の表示の色調を赤と緑の間で変化させることができる
とともに、ＬＥＤランプｌの表示の明るさを変化させる
ことができる。The level meter light emitting diode drive circuit 12 includes light emitting diodes DI, D2. - cause a number of light emitting diodes to emit light according to the level of the input signal given to terminal 8,
Among the light emitting diodes Dl', D2'-, the number of light emitting diodes corresponding to the level of the input signal applied to the terminal 11 is caused to emit light. Therefore, by individually changing the levels of the input signals to the terminals 8 and 11, the color tone of the display of the LED lamp 1 can be changed between red and green, and the brightness of the display of the LED lamp 1 can be changed. can be done.
上述の回路では、電源端子９と接地端子１０の間に電源
電圧Ｖｃｃ （例えば１２ｖ）が印加され、信号端子８
，１１に入力信号電圧ＶＩＮ△＋ ｖｘＮｅ（例えば
Ｏ〜１２ｖ）がそれぞれ印加される。そして、この入力
信号電圧ＶＩＮ＾、ＶＩＮＢの大小に応じて、発光ダイ
オードＤ１．Ｄ２．・・−と発光ダイオードＤＩ’、Ｄ
２’、−・−のそれぞれの発光個数が増減する。レベル
メータ用発光ダイオード駆動回路１２には電流増幅回路
が内蔵されるので、入力電流としては極めて僅かな電流
（例えば２０μＡ）以下でよい。In the above circuit, the power supply voltage Vcc (for example, 12V) is applied between the power supply terminal 9 and the ground terminal 10, and the signal terminal 8
, 11 are applied with input signal voltages VINΔ+vxNe (for example, O to 12V). Then, depending on the magnitude of the input signal voltages VIN^ and VINB, the light emitting diode D1. D2. ...- and light emitting diodes DI', D
The number of light emitted from each of 2' and -.- increases or decreases. Since the level meter light emitting diode drive circuit 12 has a built-in current amplification circuit, the input current may be an extremely small current (for example, 20 μA) or less.
〈発明の効果〉
以上説明したように、本発明においては、２種類以上の
発光色が異なる複数の発光ダイオードを共通の光反射板
と樹脂レンズにより一体的に形成し、発光色の種類毎に
発光する発光ダイオードの数を変えることにより、ＬＥ
Ｄランプの表示の色調と明るさを変えることができ、こ
のＬＥＤランプを多数組み合わせて構成したインテリゼ
ントディスプレイや屋外の大型インジケータ等における
表示の多様化が可能になる。<Effects of the Invention> As explained above, in the present invention, a plurality of light emitting diodes emitting two or more different light emitting colors are integrally formed using a common light reflecting plate and a resin lens, and each type of emitting color is By changing the number of light emitting diodes that emit light, LE
The color tone and brightness of the display of the D lamp can be changed, making it possible to diversify the display on intelligent displays constructed by combining a large number of LED lamps, large outdoor indicators, etc.
第１図は本発明の実施例を示す断面図、第２図は本発明
の実施例を示す回路図、第３図は従来例を示す断面図で
ある。
１−Ｌ Ｅ Ｄランプ
２一基板
３−発光ダイオードベレソト
４−・反射板
５−集積回路
７ａ−樹脂レンズ
８．１１−・信号端子FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a circuit diagram showing an embodiment of the invention, and FIG. 3 is a sectional view showing a conventional example. 1-L E D lamp 2-Substrate 3-Light emitting diode beam 4-・Reflector 5-Integrated circuit 7a-Resin lens 8.11-・Signal terminal
Claims (2)
複数の発光ダイオードが光反射部材で包囲されるととも
に上記複数の発光ダイオードと上記光反射部材とが樹脂
レンズで一体的に覆われて形成された発光部と、発光す
る発光ダイオードの数を入力信号に応じて可変として上
記複数の発光ダイオードを制御する制御回路とを備えた
ことを特徴とする固体発光表示装置。(1) A plurality of light emitting diodes mounted on a substrate that emit light of two or more different colors are surrounded by a light reflecting member, and the plurality of light emitting diodes and the light reflecting member are integrally covered with a resin lens. What is claimed is: 1. A solid-state light-emitting display device, comprising: a light-emitting section formed using a light-emitting section; and a control circuit that controls the plurality of light-emitting diodes by making the number of light-emitting diodes that emit light variable in accordance with an input signal.
に対応した２つ以上の独立した入力回路を有し、この入
力回路に与えられる入力信号により各種類の上記発光ダ
イオードを独立して制御する特許請求の範囲第１項記載
の固体発光表示装置。(2) It has two or more independent input circuits corresponding to two or more types of light emitting diodes that emit light of different colors, and each type of light emitting diode is independently controlled by an input signal given to this input circuit. A solid-state light emitting display device according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59207826A JPS6184880A (en) | 1984-10-02 | 1984-10-02 | Solid-state light emitting display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59207826A JPS6184880A (en) | 1984-10-02 | 1984-10-02 | Solid-state light emitting display |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6184880A true JPS6184880A (en) | 1986-04-30 |
Family
ID=16546150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59207826A Pending JPS6184880A (en) | 1984-10-02 | 1984-10-02 | Solid-state light emitting display |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6184880A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05113762A (en) * | 1991-10-21 | 1993-05-07 | Hiroshi Ninomiya | Luminous display device |
| US5418384A (en) * | 1992-03-11 | 1995-05-23 | Sharp Kabushiki Kaisha | Light-source device including a linear array of LEDs |
| EP1453109A2 (en) * | 2003-02-28 | 2004-09-01 | Noritsu Koki Co., Ltd. | Light-emitting diode light source unit |
| JP2007176219A (en) * | 2005-12-27 | 2007-07-12 | Showa Denko Kk | Light emission device, and vehicular light using the same |
| US7447416B2 (en) | 2005-03-23 | 2008-11-04 | Samsung Electronics Co., Ltd. | Light emitting assembly, backlight unit and display having the same |
| US7537357B2 (en) | 2005-04-26 | 2009-05-26 | Samsung Electronics Co., Ltd. | Backlight unit for dynamic image and display employing the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS48102585A (en) * | 1972-04-04 | 1973-12-22 |
-
1984
- 1984-10-02 JP JP59207826A patent/JPS6184880A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS48102585A (en) * | 1972-04-04 | 1973-12-22 |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05113762A (en) * | 1991-10-21 | 1993-05-07 | Hiroshi Ninomiya | Luminous display device |
| US5418384A (en) * | 1992-03-11 | 1995-05-23 | Sharp Kabushiki Kaisha | Light-source device including a linear array of LEDs |
| EP1453109A2 (en) * | 2003-02-28 | 2004-09-01 | Noritsu Koki Co., Ltd. | Light-emitting diode light source unit |
| EP1453109A3 (en) * | 2003-02-28 | 2009-05-27 | Noritsu Koki Co., Ltd. | Light-emitting diode light source unit |
| US7447416B2 (en) | 2005-03-23 | 2008-11-04 | Samsung Electronics Co., Ltd. | Light emitting assembly, backlight unit and display having the same |
| US7537357B2 (en) | 2005-04-26 | 2009-05-26 | Samsung Electronics Co., Ltd. | Backlight unit for dynamic image and display employing the same |
| US8807776B2 (en) | 2005-04-26 | 2014-08-19 | Samsung Electronics Co., Ltd. | Backlight unit for dynamic image and display employing the same |
| JP2007176219A (en) * | 2005-12-27 | 2007-07-12 | Showa Denko Kk | Light emission device, and vehicular light using the same |
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