JPS6183094U - - Google Patents

Info

Publication number
JPS6183094U
JPS6183094U JP16732184U JP16732184U JPS6183094U JP S6183094 U JPS6183094 U JP S6183094U JP 16732184 U JP16732184 U JP 16732184U JP 16732184 U JP16732184 U JP 16732184U JP S6183094 U JPS6183094 U JP S6183094U
Authority
JP
Japan
Prior art keywords
case
heat dissipation
heat
internal device
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16732184U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16732184U priority Critical patent/JPS6183094U/ja
Publication of JPS6183094U publication Critical patent/JPS6183094U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図、第２図、第３図、第４図、第５図は、
この考案の一実施例を示す構成説明図である。 １…ケース、２…内器、３…発熱源、４…コネ
クタ、５…放熱部材。 Figures 1, 2, 3, 4, and 5 are
FIG. 1 is a configuration explanatory diagram showing an embodiment of this invention. DESCRIPTION OF SYMBOLS 1... Case, 2... Internal device, 3... Heat generation source, 4... Connector, 5... Heat radiation member.

Claims (1)

【実用新案登録請求の範囲】 １ ケースに着脱可能に設けられた内器と、この
内器の所要箇所に設けられた発熱源とを備え、内
器がケースに収納されたとき発熱源が位置するケ
ースの所要箇所に発熱源と接触する放熱部材を設
けたことを特徴とする電子機器の放熱構造。 ２ 前記放熱部材として、ケースを内側方向に絞
り形成された凹部を用いたことを特徴とする実用
新案登録請求の範囲第１項記載の電子機器の放熱
構造。 ３ 前記内器の発熱源の前後に隔壁を設け、ケー
スの発熱源が位置する上下に開口を設けたことを
特徴とする実用新案登録請求の範囲第１項または
第２項記載の電子機器の放熱構造。[Scope of Claim for Utility Model Registration] 1. An internal device that is removably installed in a case, and a heat source that is installed at a required location on the internal device, so that when the internal device is housed in the case, the heat source is positioned. A heat dissipation structure for an electronic device, characterized in that a heat dissipation member that comes into contact with a heat generation source is provided at a required location of a case. 2. A heat dissipation structure for an electronic device according to claim 1, wherein the heat dissipation member is a recess formed by drawing the case inward. 3. The electronic device according to claim 1 or 2, characterized in that partition walls are provided before and after the heat source of the internal device, and openings are provided above and below where the heat source of the case is located. Heat dissipation structure.
JP16732184U 1984-11-02 1984-11-02 Pending JPS6183094U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16732184U JPS6183094U (en) 1984-11-02 1984-11-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16732184U JPS6183094U (en) 1984-11-02 1984-11-02

Publications (1)

Publication Number Publication Date
JPS6183094U true JPS6183094U (en) 1986-06-02

Family

ID=30725121

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16732184U Pending JPS6183094U (en) 1984-11-02 1984-11-02

Country Status (1)

Country Link
JP (1) JPS6183094U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019041014A (en) * 2017-08-25 2019-03-14 富士通周辺機株式会社 Electronic device and substrate

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5417674A (en) * 1977-07-11 1979-02-09 Hitachi Ltd Cooler for semiconductor element

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5417674A (en) * 1977-07-11 1979-02-09 Hitachi Ltd Cooler for semiconductor element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019041014A (en) * 2017-08-25 2019-03-14 富士通周辺機株式会社 Electronic device and substrate

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