JPS6183079U - - Google Patents
Info
- Publication number
- JPS6183079U JPS6183079U JP1984168213U JP16821384U JPS6183079U JP S6183079 U JPS6183079 U JP S6183079U JP 1984168213 U JP1984168213 U JP 1984168213U JP 16821384 U JP16821384 U JP 16821384U JP S6183079 U JPS6183079 U JP S6183079U
- Authority
- JP
- Japan
- Prior art keywords
- pin
- substrate
- rigid
- flexible
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 6
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984168213U JPS6183079U (fi) | 1984-11-06 | 1984-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984168213U JPS6183079U (fi) | 1984-11-06 | 1984-11-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6183079U true JPS6183079U (fi) | 1986-06-02 |
Family
ID=30725992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984168213U Pending JPS6183079U (fi) | 1984-11-06 | 1984-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6183079U (fi) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS631094A (ja) * | 1986-06-20 | 1988-01-06 | 富士通株式会社 | フレキシブル及びリジツド印刷配線複合基板 |
| JPH05259648A (ja) * | 1992-01-22 | 1993-10-08 | Internatl Business Mach Corp <Ibm> | 電子回路パッケージおよびその作製方法 |
| US6570280B2 (en) | 2000-08-11 | 2003-05-27 | Asmo Co., Ltd. | Solder-bonding structure and brushless motor having the same |
| KR20130052521A (ko) * | 2011-11-11 | 2013-05-22 | 쇼와 덴코 가부시키가이샤 | 액냉식 냉각 장치 및 그 제조 방법 |
| US10342129B2 (en) | 2017-04-20 | 2019-07-02 | Fujitsu Limited | Substrate and method of manufacturing the same |
-
1984
- 1984-11-06 JP JP1984168213U patent/JPS6183079U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS631094A (ja) * | 1986-06-20 | 1988-01-06 | 富士通株式会社 | フレキシブル及びリジツド印刷配線複合基板 |
| JPH05259648A (ja) * | 1992-01-22 | 1993-10-08 | Internatl Business Mach Corp <Ibm> | 電子回路パッケージおよびその作製方法 |
| US6570280B2 (en) | 2000-08-11 | 2003-05-27 | Asmo Co., Ltd. | Solder-bonding structure and brushless motor having the same |
| KR20130052521A (ko) * | 2011-11-11 | 2013-05-22 | 쇼와 덴코 가부시키가이샤 | 액냉식 냉각 장치 및 그 제조 방법 |
| JP2013123038A (ja) * | 2011-11-11 | 2013-06-20 | Showa Denko Kk | 液冷式冷却装置およびその製造方法 |
| US10342129B2 (en) | 2017-04-20 | 2019-07-02 | Fujitsu Limited | Substrate and method of manufacturing the same |
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