JPS6183064U - - Google Patents
Info
- Publication number
- JPS6183064U JPS6183064U JP16762484U JP16762484U JPS6183064U JP S6183064 U JPS6183064 U JP S6183064U JP 16762484 U JP16762484 U JP 16762484U JP 16762484 U JP16762484 U JP 16762484U JP S6183064 U JPS6183064 U JP S6183064U
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- printer head
- optical printer
- base layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 9
- 230000003287 optical effect Effects 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16762484U JPS6183064U (bg) | 1984-11-05 | 1984-11-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16762484U JPS6183064U (bg) | 1984-11-05 | 1984-11-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6183064U true JPS6183064U (bg) | 1986-06-02 |
Family
ID=30725413
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16762484U Pending JPS6183064U (bg) | 1984-11-05 | 1984-11-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6183064U (bg) |
-
1984
- 1984-11-05 JP JP16762484U patent/JPS6183064U/ja active Pending